SLVSAA2D March   2010  – January  2016 TPS65182 , TPS65182B

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Data Transmission Timing
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Modes of Operation
      2. 7.3.2  Mode Transistions
      3. 7.3.3  Wake-Up and Power Up Sequencing
      4. 7.3.4  Dependencies Between Rails
      5. 7.3.5  Soft-Start
      6. 7.3.6  VCOM Adjustment
      7. 7.3.7  VPOS and VNEG Supply Tracking
      8. 7.3.8  Fault Handling and Recovery
      9. 7.3.9  Power Good Pin
      10. 7.3.10 Panel Temperature Monitoring
      11. 7.3.11 NTC Bias Circuit
    4. 7.4 Device Functional Modes
      1. 7.4.1 I2C Bus Operation
    5. 7.5 Register Maps
      1. 7.5.1 Thermistor Readout (TMST_VALUE) Register (offset = 0x00h)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (October 2010) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go