SLVSAQ8G February   2011  – September 2017 TPS65185

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Data Transmission
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Wake-Up and Power-Up Sequencing
      2. 8.3.2  Dependencies Between Rails
      3. 8.3.3  Soft Start
      4. 8.3.4  Active Discharge
      5. 8.3.5  VPOS/VNEG Supply Tracking
      6. 8.3.6  V3P3 Power Switch
      7. 8.3.7  VCOM Adjustment
        1. 8.3.7.1 Kick-Back Voltage Measurement
        2. 8.3.7.2 Storing the VCOM Power-Up Default Value in Memory
      8. 8.3.8  Fault Handling And Recovery
      9. 8.3.9  Power Good Pin
      10. 8.3.10 Interrupt Pin
      11. 8.3.11 Panel Temperature Monitoring
        1. 8.3.11.1 NTC Bias Circuit
        2. 8.3.11.2 Hot, Cold, and Temperature-Change Interrupts
        3. 8.3.11.3 Typical Application of the Temperature Monitor
    4. 8.4 Device Functional Modes
      1. 8.4.1 SLEEP
      2. 8.4.2 STANDBY
      3. 8.4.3 ACTIVE
      4. 8.4.4 Mode Transitions
        1. 8.4.4.1 SLEEP → ACTIVE
        2. 8.4.4.2 SLEEP → STANDBY
        3. 8.4.4.3 STANDBY → ACTIVE
        4. 8.4.4.4 ACTIVE → STANDBY
        5. 8.4.4.5 STANDBY → SLEEP
        6. 8.4.4.6 ACTIVE → SLEEP
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Operation
    6. 8.6 Register Maps
      1. 8.6.1  Thermistor Readout (TMST_VALUE) Register (address = 0x00h) [reset = N/A]
      2. 8.6.2  Enable (ENABLE) Register (address = 0x01h) [reset = 0h]
      3. 8.6.3  Voltage Adjustment (VADJ) Register (address = 0x02h) [reset = 23h]
      4. 8.6.4  VCOM 1 (VCOM1) Register (address = 0x03h) [reset = 7Dh]
      5. 8.6.5  VCOM 2 (VCOM2) Register (address = 0x04h) [reset = 04h]
      6. 8.6.6  Interrupt Enable 1 (INT_EN1) Register (address = 0x05h) [reset = 7Fh]
      7. 8.6.7  Interrupt Enable 2 (INT_EN2) Register (address = 0x06h) [reset = FFh]
      8. 8.6.8  Interrupt 1 (INT1) Register (address = 0x07h) [reset = 0h]
      9. 8.6.9  Interrupt 2 (INT2) Register (address = 0x08h) [reset = N/A]
      10. 8.6.10 Power-Up Sequence 0 (UPSEQ0) Register (address = 0x09h) [reset = E4h]
      11. 8.6.11 Power-Up Sequence 1 (UPSEQ1) Register (address = 0x0Ah) [reset = 55h]
      12. 8.6.12 Power-Down Sequence 0 (DWNSEQ0) Register (address = 0x0Bh) [reset = 1Eh]
      13. 8.6.13 Power-Down Sequence 1 (DWNSEQ1) Register (address = 0x0Ch) [reset = E0h]
      14. 8.6.14 Thermistor 1 (TMST1) Register (address = 0x0Dh) [reset = 20h]
      15. 8.6.15 Thermistor 2 (TMST2) Register (address = 0x0Eh) [reset = 78h]
      16. 8.6.16 Power Good Status (PG) Register (address = 0x0Fh) [reset = 0h]
      17. 8.6.17 Revision and Version Control (REVID) Register (address = 0x10h) [reset = 45h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

  1. PBKG (Die substrate) must connect to VN (–16 V) with short, wide trace. Wide copper trace will improve heat dissipation.
  2. The thermal pad is internally connected to PBKG and must not be connected to ground, but connected to VN with a short wide copper trace.
  3. Inductor traces must be kept on the PCB top layer free of any vias.
  4. Feedback traces must be routed away from any potential noise source to avoid coupling.
  5. Output caps must be placed immediately at output pin.
  6. The VIN pins must be bypassed to ground with low ESR ceramic bypass capacitors.

11.2 Layout Example

TPS65185 TPS651851 layout_ex_slvsb04.gif Figure 51. Layout Diagram