SLVSB64I November   2011  – March 2018 TPS65217

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Wake-Up and Power-Up Sequencing
        1. 8.3.1.1 Power-Up Sequencing
        2. 8.3.1.2 Power-Down Sequencing
        3. 8.3.1.3 Special Strobes (STROBE 14 and 15)
      2. 8.3.2  Power Good
        1. 8.3.2.1 LDO1, LDO2 Power-Good (LDO_PGOOD)
        2. 8.3.2.2 Primary Power-Good (PGOOD)
        3. 8.3.2.3 Load Switch PGOOD
      3. 8.3.3  Push-Button Monitor (PB_IN)
      4. 8.3.4  nWAKEUP Pin (nWAKEUP)
      5. 8.3.5  Power Enable Pin (PWR_EN)
      6. 8.3.6  Reset Pin (nRESET)
      7. 8.3.7  Interrupt Pin (nINT)
      8. 8.3.8  Analog Multiplexer
      9. 8.3.9  Battery Charger and Power Path
        1. 8.3.9.1 Shorted or Absent Battery (VBAT < 1.5 V)
        2. 8.3.9.2 Dead Battery (1.5 V < VBAT < VUVLO)
        3. 8.3.9.3 Good Battery (VBAT > VUVLO)
        4. 8.3.9.4 AC and USB Input Discharge
      10. 8.3.10 Battery Charging
      11. 8.3.11 Precharge
      12. 8.3.12 Charge Termination
      13. 8.3.13 Battery Detection and Recharge
      14. 8.3.14 Safety Timer
        1. 8.3.14.1 Dynamic Timer Function
        2. 8.3.14.2 Timer Fault
      15. 8.3.15 Battery-Pack Temperature Monitoring
      16. 8.3.16 DC/DC Converters
        1. 8.3.16.1 Operation
        2. 8.3.16.2 Output Voltage Setting
        3. 8.3.16.3 Power-Save Mode and Pulse-Frequency Modulation (PFM)
        4. 8.3.16.4 Dynamic Voltage Positioning
        5. 8.3.16.5 100% Duty-Cycle Low-Dropout Operation
        6. 8.3.16.6 Short-Circuit Protection
        7. 8.3.16.7 Soft Start
      17. 8.3.17 Standby LDO Regulators (LDO1, LDO2)
      18. 8.3.18 Load Switches or LDO Regulators (LS1 or LDO3, LS2 or LDO4)
      19. 8.3.19 White LED Driver
    4. 8.4 Device Functional Modes
      1. 8.4.1 PMIC States
        1. 8.4.1.1 OFF State
        2. 8.4.1.2 ACTIVE State
        3. 8.4.1.3 SLEEP State
        4. 8.4.1.4 RESET State
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Operation
      2. 8.5.2 Password Protection
        1. 8.5.2.1 Level1 Protection
        2. 8.5.2.2 Level2 Protection
      3. 8.5.3 Resetting of Registers to Default Values
    6. 8.6 Register Maps
      1. 8.6.1  Register Address Map
      2. 8.6.2  Chip ID Register (CHIPID) (Address = 0x00) [reset = X]
        1. Table 2. CHIPID Register Field Descriptions
      3. 8.6.3  Power Path Control Register (PPATH) (Address = 0x01) [reset = 0x3D]
        1. Table 3. PPATH Register Field Descriptions
      4. 8.6.4  Interrupt Register (INT) (Address = 0x02) [reset = 0x80]
        1. Table 4. INT Register Field Descriptions
      5. 8.6.5  Charger Configuration Register 0 (CHGCONFIG0) (Address = 0x03) [reset = 0x00]
        1. Table 5. CHGCONFIG0 Register Field Descriptions
      6. 8.6.6  Charger Configuration Register 1 (CHGCONFIG1) (Address = 0x04) [reset = 0xB1]
        1. Table 6. CHGCONFIG1 Register Field Descriptions
      7. 8.6.7  Charger Configuration Register 2 (CHGCONFIG2) (Address = 0x05) [reset = 0x80]
        1. Table 7. CHGCONFIG2 Register Field Descriptions
      8. 8.6.8  Charger Configuration Register 3 (CHGCONFIG3) (Address = 0x06) [reset = 0xB2]
        1. Table 8. CHGCONFIG3 Register Field Descriptions
      9. 8.6.9  WLED Control Register 1 (WLEDCTRL1) (Address = 0x07) [reset = 0xB1]
        1. Table 9. WLEDCTRL1 Register Field Descriptions
      10. 8.6.10 WLED Control Register 2 (WLEDCTRL2) (Address = 0x08) [reset = 0x00]
        1. Table 10. WLEDCTRL2 Register Field Descriptions
      11. 8.6.11 MUX Control Register (MUXCTRL) (Address = 0x09) [reset = 0x00]
        1. Table 11. MUXCTRL Register Field Descriptions
      12. 8.6.12 Status Register (STATUS) (Address = 0x0A) [reset = 0x00]
        1. Table 12. STATUS Register Field Descriptions
      13. 8.6.13 Password Register (PASSWORD) (Address = 0x0B) [reset = 0x00]
        1. Table 13. Password Register (PASSWORD) Field Descriptions
      14. 8.6.14 Power Good Register (PGOOD) (Address = 0x0C) [reset = 0x00]
        1. Table 14. PGOOD Register Field Descriptions
      15. 8.6.15 Power-Good Control Register (DEFPG) (Address = 0x0D) [reset = 0x0C]
        1. Table 15. DEFPG Register Field Descriptions
      16. 8.6.16 DCDC1 Control Register (DEFDCDC1) (Address = 0x0E) [reset = X]
        1. Table 16. DEFDCDC1 Register Field Descriptions
      17. 8.6.17 DCDC2 Control Register (DEFDCDC2) (Address = 0x0F) [reset = X]
        1. Table 17. DEFDCDC2 Register Field Descriptions
      18. 8.6.18 DCDC3 Control Register (DEFDCDC3) (Address = 0x10) [reset = 0x08]
        1. Table 18. DEFDCDC3 Register Field Descriptions
      19. 8.6.19 Slew-Rate Control Register (DEFSLEW) (Address = 0x11) [reset = 0x06]
        1. Table 19. DEFSLEW Register Field Descriptions
      20. 8.6.20 LDO1 Control Register (DEFLDO1) (Address = 0x12) [reset = 0x09]
        1. Table 20. DEFLDO1 Register Field Descriptions
      21. 8.6.21 LDO2 Control Register (DEFLDO2) (Address = 0x13) [reset = 0x38]
        1. Table 21. DEFLDO2 Register Field Descriptions
      22. 8.6.22 Load Switch1 or LDO3 Control Register (DEFLS1) (Address = 0x14) [reset = X]
        1. Table 22. DEFLS1 Register Field Descriptions
      23. 8.6.23 Load Switch2 or LDO4 Control Register (DEFLS2) (Address = 0x15) [reset = X]
        1. Table 23. DEFLS2 Register Field Descriptions
      24. 8.6.24 Enable Register (ENABLE) (Address = 0x16) [reset = 0x00]
        1. Table 24. ENABLE Register Field Descriptions
      25. 8.6.25 UVLO Control Register (DEFUVLO) (Address = 0x18) [reset = 0x03]
        1. Table 25. DEFUVLO Register Field Descriptions
      26. 8.6.26 Sequencer Register 1 (SEQ1) (Address = 0x19) [reset = X]
        1. Table 26. SEQ1 Register Field Descriptions
      27. 8.6.27 Sequencer Register 2 (SEQ2) (Address = 0x1A) [reset = X]
        1. Table 27. SEQ2 Register Field Descriptions
      28. 8.6.28 Sequencer Register 3 (SEQ3) (Address = 0x1B) [reset = X]
        1. Table 28. SEQ3 Register Field Descriptions
      29. 8.6.29 Sequencer Register 4 (SEQ4) (Address = 0x1C) [reset = 0x40]
        1. Table 29. SEQ4 Register Field Descriptions
      30. 8.6.30 Sequencer Register 5 (SEQ5) (Address = 0x1D) [reset = X]
        1. Table 30. SEQ5 Register Field Descriptions
      31. 8.6.31 Sequencer Register 6 (SEQ6) (Address = 0x1E) [reset = 0x00]
        1. Table 31. SEQ6 Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Filter Design (Inductor and Output Capacitor)
          1. 9.2.2.1.1 Inductor Selection for Buck Converters
          2. 9.2.2.1.2 Output Capacitor Selection
          3. 9.2.2.1.3 Input Capacitor Selection
        2. 9.2.2.2 5-V Operation Without a Battery
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.1.1 Power-Up Sequencing

When the power-up sequence is initiated, STROBE1 occurs and any rail assigned to this strobe is enabled. After a delay time of DLY1, STROBE2 occurs and the rail assigned to this strobe is powered up. The sequence continues until all strobes have occurred and all DLYx times have been executed.

TPS65217 pwr_up_seq_lvsb64.gif
The power-up sequence is defined by strobes and delay times. In this example, push-button low is the power-up event.
Figure 3. Power-Up Sequence

The default power-up sequence can be changed by writing to the SEQ1 through SEQ6 registers. Strobes are assigned to rails by writing to the SEQ1 through SEQ4 registers. A rail can be assigned to only one strobe but multiple rails can be assigned to the same strobe. Delays between strobes are defined in the SEQ5 and SEQ6 registers.

TPS65217 Power_Up_slvu551.gif
For default power-up sequences of the other TPS65217x family members, refer to the Powering the AM335x with the TPS65217x user's guide.
Figure 4. Default Power-Up Sequence for the TPS65217A Device

The power-up sequence is executed if the following events occurs:

From the OFF state (going to the ACTIVE state):

  • Push-button is pressed (falling edge on PB_IN) OR
  • USB voltage is asserted (rising edge on USB) OR
  • The AC adaptor is inserted (rising edge on the AC pin)

The PWR_EN pin is level-sensitive (opposed to edge-sensitive), and the pin can be asserted before or after the previously listed power-up events. However, the PWR_EN pin must be asserted within 5 s of the power-up event; otherwise, the power-down sequence is triggered and the device goes to the OFF state. If a fault occurs because the device is in undervoltage lockout (UVLO) or requires overtemperature shutdown (OTS), the device goes to the OFF state.

From the SLEEP state (going to the ACTIVE state):

  • The push-button is pressed (falling edge on the PB_IN pin) OR
  • The USB voltage is asserted (rising edge on the USB pin) OR
  • The AC adaptor is inserted (rising edge on the AC pin) OR
  • The PWR_EN pin is asserted (pulled high).

In the SLEEP state, the power-up sequence can be triggered by asserting the PWR_EN pin only, and the push-button press or AC and USB assertion are not required. If a fault occurs because the device is in undervoltage lockout (UVLO) or requires overtemperature shutdown (OTS), the device goes to the OFF state.

In the ACTIVE state:

The sequencer can be triggered any time by setting the SEQUP bit in the SEQ6 register high. The SEQUP bit is automatically cleared after the sequencer is complete.

Rails that are not assigned to a strobe (the SEQ bit set to 0000b) are not affected by power-up and power-down sequencing and stay in their current ON or OFF state regardless of the sequencer. Any rail can be enabled or disabled at any time by setting the corresponding enable bit in the ENABLE register with the only exception that the ENABLE register cannot be accessed while the sequencer is active. Enable bits always reflect the current enable state of the rail, that is, the sequencer sets or resets the enable bits for the rails under its control. Also, whenever faults occur which shut-down the power-rails, the corresponding enable bits are reset.