SLDS206E November   2014  – February 2021 TPS65218

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Wake-Up and Power-Up and Power-Down Sequencing
        1. 7.3.1.1  Power-Up Sequencing
        2. 7.3.1.2  Power-Down Sequencing
        3. 7.3.1.3  Strobe 1 and Strobe 2
        4. 7.3.1.4  Supply Voltage Supervisor and Power-Good (PGOOD)
        5. 7.3.1.5  Backup Supply Power-Good (PGOOD_BU)
        6. 7.3.1.6  Internal LDO (INT_LDO)
        7. 7.3.1.7  Current Limited Load Switches
          1. 7.3.1.7.1 Load Switch 1 (LS1)
          2. 7.3.1.7.2 Load Switch 2 (LS2)
          3. 7.3.1.7.3 Load Switch 3 (LS3)
        8. 7.3.1.8  LDO1
        9. 7.3.1.9  Coin Cell Battery Voltage Acquisition
        10. 7.3.1.10 UVLO
        11. 7.3.1.11 Power-Fail Comparator
        12. 7.3.1.12 Battery-Backup Supply Power-Path
        13. 7.3.1.13 DCDC3 and DCDC4 Power-Up Default Selection
        14. 7.3.1.14 I/O Configuration
          1. 7.3.1.14.1 Configuring GPO2 as Open-Drain Output
          2. 7.3.1.14.2 Using GPIO3 as Reset Signal to DCDC1 and DCDC2
        15. 7.3.1.15 Push Button Input (PB)
          1. 7.3.1.15.1 Signaling PB-Low Event on the nWAKEUP Pin
          2. 7.3.1.15.2 Push Button Reset
        16. 7.3.1.16 AC_DET Input (AC_DET)
        17. 7.3.1.17 Interrupt Pin (INT)
        18. 7.3.1.18 I2C Bus Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
      2. 7.4.2 OFF
      3. 7.4.3 ACTIVE
      4. 7.4.4 SUSPEND
      5. 7.4.5 RESET
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Applications Without Backup Battery
      2. 8.1.2 Applications Without Battery Backup Supplies
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Output Filter Design
        2. 8.2.1.2 Inductor Selection for Buck Converters
        3. 8.2.1.3 Output Capacitor Selection
      2. 8.2.2 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1.17 Interrupt Pin (INT)

The interrupt pin signals any event or fault condition to the host processor. Whenever a fault or event occurs in the device, the corresponding interrupt bit is set in the INT register, and the open-drain output is pulled low. The INT pin is released (returns to Hi-Z state) and fault bits are cleared when the host reads the INT register. If a failure persists, the corresponding INT bit remains set and the INT pin is pulled low again after a maximum of 32 µs.

The MASK register masks events from generating interrupts. The MASK settings affect the INT pin only, and have no impact on the protection and monitor circuits.