SLDS261A November   2019  – February 2021 TPS6521815

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Simplified Schematic
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Wake-Up and Power-Up and Power-Down Sequencing
        1. 8.3.1.1  Power-Up Sequencing
        2. 8.3.1.2  Power-Down Sequencing
        3. 8.3.1.3  Strobe 1 and Strobe 2
        4. 8.3.1.4  Supply Voltage Supervisor and Power-Good (PGOOD)
        5. 8.3.1.5  Backup Supply Power-Good (PGOOD_BU)
        6. 8.3.1.6  Internal LDO (INT_LDO)
        7. 8.3.1.7  Current Limited Load Switches
          1. 8.3.1.7.1 Load Switch 1 (LS1)
          2. 8.3.1.7.2 Load Switch 2 (LS2)
          3. 8.3.1.7.3 Load Switch 3 (LS3)
        8. 8.3.1.8  LDO1
        9. 8.3.1.9  Coin Cell Battery Voltage Acquisition
        10. 8.3.1.10 UVLO
        11. 8.3.1.11 Power-Fail Comparator
        12. 8.3.1.12 Battery-Backup Supply Power-Path
        13. 8.3.1.13 DCDC3 and DCDC4 Power-Up Default Selection
        14. 8.3.1.14 I/O Configuration
          1. 8.3.1.14.1 Configuring GPO2 as Open-Drain Output
          2. 8.3.1.14.2 Using GPIO3 as Reset Signal to DCDC1 and DCDC2
        15. 8.3.1.15 Push Button Input (PB)
          1. 8.3.1.15.1 Signaling PB-Low Event on the nWAKEUP Pin
          2. 8.3.1.15.2 Push Button Reset
        16. 8.3.1.16 AC_DET Input (AC_DET)
        17. 8.3.1.17 Interrupt Pin (INT)
        18. 8.3.1.18 I2C Bus Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
      2. 8.4.2 OFF
      3. 8.4.3 ACTIVE
      4. 8.4.4 SUSPEND
      5. 8.4.5 RESET
    5. 8.5 Programming
      1. 8.5.1 Programming Power-Up Default Values
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Applications Without Backup Battery
      2. 9.1.2 Applications Without Battery Backup Supplies
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Filter Design
        2. 9.2.2.2 Inductor Selection for Buck Converters
        3. 9.2.2.3 Output Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

Operating under free-air temperature range (unless otherwise noted).(1)
MINMAXUNIT
Supply voltageIN_BIAS, IN_LDO1, IN_LS2, IN_DCDC1, IN_DCDC2, IN_DCDC3, IN_DCDC4–0.37V
IN_LS1, CC–0.33.6
IN_LS3–0.311.2
IN_BU–0.35.8
Output voltageAll pins unless specified separately–0.37V
Source or sink currentGPO26mA
PGOOD_BU, IN_nCC1
Sink currentPGOOD, nWAKEUP, nINT, nPFO, SDA, GPIO1, GPIO36mA
TAOperating ambient temperature–40105°C
TJJunction temperature–40125°C
TstgStorage temperature–65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.