SLDS261A November   2019  – February 2021 TPS6521815

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Simplified Schematic
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Wake-Up and Power-Up and Power-Down Sequencing
        1. 8.3.1.1  Power-Up Sequencing
        2. 8.3.1.2  Power-Down Sequencing
        3. 8.3.1.3  Strobe 1 and Strobe 2
        4. 8.3.1.4  Supply Voltage Supervisor and Power-Good (PGOOD)
        5. 8.3.1.5  Backup Supply Power-Good (PGOOD_BU)
        6. 8.3.1.6  Internal LDO (INT_LDO)
        7. 8.3.1.7  Current Limited Load Switches
          1. 8.3.1.7.1 Load Switch 1 (LS1)
          2. 8.3.1.7.2 Load Switch 2 (LS2)
          3. 8.3.1.7.3 Load Switch 3 (LS3)
        8. 8.3.1.8  LDO1
        9. 8.3.1.9  Coin Cell Battery Voltage Acquisition
        10. 8.3.1.10 UVLO
        11. 8.3.1.11 Power-Fail Comparator
        12. 8.3.1.12 Battery-Backup Supply Power-Path
        13. 8.3.1.13 DCDC3 and DCDC4 Power-Up Default Selection
        14. 8.3.1.14 I/O Configuration
          1. 8.3.1.14.1 Configuring GPO2 as Open-Drain Output
          2. 8.3.1.14.2 Using GPIO3 as Reset Signal to DCDC1 and DCDC2
        15. 8.3.1.15 Push Button Input (PB)
          1. 8.3.1.15.1 Signaling PB-Low Event on the nWAKEUP Pin
          2. 8.3.1.15.2 Push Button Reset
        16. 8.3.1.16 AC_DET Input (AC_DET)
        17. 8.3.1.17 Interrupt Pin (INT)
        18. 8.3.1.18 I2C Bus Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
      2. 8.4.2 OFF
      3. 8.4.3 ACTIVE
      4. 8.4.4 SUSPEND
      5. 8.4.5 RESET
    5. 8.5 Programming
      1. 8.5.1 Programming Power-Up Default Values
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Applications Without Backup Battery
      2. 9.1.2 Applications Without Battery Backup Supplies
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Filter Design
        2. 9.2.2.2 Inductor Selection for Buck Converters
        3. 9.2.2.3 Output Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

Follow these layout guidelines:

  • The IN_X pins should be bypassed to ground with a low ESR ceramic bypass capacitor. The typical recommended bypass capacitance is 4.7-µF with a X5R or X7R dielectric.
  • The optimum placement is closest to the IN_X pins of the device. Take care to minimize the loop area formed by the bypass capacitor connection, the IN_X pin, and the thermal pad of the device.
  • The thermal pad should be tied to the PCB ground plane with a minimum of 25 vias. See Figure 11-2 for an example.
  • The LX trace should be kept on the PCB top layer and free of any vias.
  • The FBX traces should be routed away from any potential noise source to avoid coupling.
  • DCDC4 Output capacitance should be placed immediately at the DCDC4 pin. Excessive distance between the capacitance and DCDC4 pin may cause poor converter performance.