SLVSGA1B December   2022  – June 2024 TPS65219-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  System Control Thresholds
    6. 5.6  BUCK1 Converter
    7. 5.7  BUCK2, BUCK3 Converter
    8. 5.8  General Purpose LDOs (LDO1, LDO2)
    9. 5.9  General Purpose LDOs (LDO3, LDO4)
    10. 5.10 GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO1, GPO2, GPIO, MODE/RESET, MODE/STBY, VSEL_SD/VSEL_DDR)
    11. 5.11 Voltage and Temperature Monitors
    12. 5.12 I2C Interface
    13. 5.13 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Power-Up Sequencing
      2. 6.3.2  Power-Down Sequencing
      3. 6.3.3  Push Button and Enable Input (EN/PB/VSENSE)
      4. 6.3.4  Reset to SoC (nRSTOUT)
      5. 6.3.5  Buck Converters (Buck1, Buck2, and Buck3)
        1. 6.3.5.1 Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Linear Regulators (LDO1 through LDO4)
      7. 6.3.7  Interrupt Pin (nINT)
      8. 6.3.8  PWM/PFM and Low Power Modes (MODE/STBY)
      9. 6.3.9  PWM/PFM and Reset (MODE/RESET)
      10. 6.3.10 Voltage Select pin (VSEL_SD/VSEL_DDR)
      11. 6.3.11 General Purpose Inputs or Outputs (GPO1, GPO2, and GPIO)
      12. 6.3.12 I2C-Compatible Interface
        1. 6.3.12.1 Data Validity
        2. 6.3.12.2 Start and Stop Conditions
        3. 6.3.12.3 Transferring Data
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
        1. 6.4.1.1 OFF State
        2. 6.4.1.2 INITIALIZE State
        3. 6.4.1.3 ACTIVE State
        4. 6.4.1.4 STBY State
        5. 6.4.1.5 Fault Handling
    5. 6.5 Multi-PMIC Operation
    6. 6.6 User Registers
    7. 6.7 Device Registers
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application Example
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Buck1, Buck2, Buck3 Design Procedure
        2. 7.2.3.2 LDO1, LDO2 Design Procedure
        3. 7.2.3.3 LDO3, LDO4 Design Procedure
        4. 7.2.3.4 VSYS, VDD1P8
        5. 7.2.3.5 Digital Signals Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application Curves

TPS65219-Q1  Buck1  ramp
VIN = 5.0 V VOUT = 3.3V TA = 25 °C
Forced-PWM / High Bandwidth Iout = 1 A COUT_total = 57 μF
Figure 7-2 Buck1 ramp
TPS65219-Q1  Buck3 ramp
VIN = 5.0 V VOUT = 3.3V TA = 25 °C
Forced-PWM / High Bandwidth Iout = 1 A COUT_total = 57 μF
Figure 7-4 Buck3 ramp
TPS65219-Q1  LDO3, LDO4 Fast Ramp
VIN = 5.0 V VOUT = 3.3V TA = 25 °C
LDO mode / Fast ramp Iout = 300 mA COUT_total = 10 μF
Figure 7-6 LDO3, LDO4 Fast Ramp
TPS65219-Q1  Bucks Discharge
VIN = 5.0 V VOUT = 3.3V TA = 25 °C
Forced-PWM / High Bandwidth no load COUT_total = 57 μF
Figure 7-8 Bucks Discharge
TPS65219-Q1  Configurable power-up sequence -
            Example
Slot# Duration Assigned Rail
0 1.5 ms BUCK2
1 0 ms
2 3 ms LDO1 / LDO3 / LDO4 / GPO1
3 1.5 ms
4 1.5 ms BUCK3
5 1.5 ms BUCK1
6 1.5 ms LDO2
7 10 ms
8 1.5 ms
9 10 ms nRSTOUT
10-15 0ms
Figure 7-10 Configurable power-up sequence - Example
TPS65219-Q1  Buck2 ramp
VIN = 5.0 V VOUT = 3.3V TA = 25 °C
Forced-PWM / High Bandwidth Iout = 1 A COUT_total = 57 μF
Figure 7-3 Buck2 ramp
TPS65219-Q1  LDO1, LDO2
            ramp
VIN = 5.0 V VOUT = 3.3V TA = 25 °C
LDO mode Iout = 400 mA COUT_total = 10 μF
Figure 7-5 LDO1, LDO2 ramp
TPS65219-Q1  LDO3, LDO4 Slow Ramp
VIN = 5.0 V VOUT = 3.3V TA = 25 °C
LDO mode / Slow ramp Iout = 300 mA COUT_total = 10 μF
Figure 7-7 LDO3, LDO4 Slow Ramp
TPS65219-Q1  LDOs Discharge
VIN = 5.0 V VOUT = 3.3V TA = 25 °C
LDO mode no load COUT_total = 2.2 μF
Figure 7-9 LDOs Discharge
TPS65219-Q1  Configurable power-down sequence -
            Example
Slot# Duration Assigned Rail
0 10 ms nRSTOUT / BUCK3 / LDO2
1 0 ms
2 10 ms BUCK1 / LDO1 / LDO3 / GPO1
3 0 ms
4 10 ms BUCK2 / LDO4
5-15 0 ms
Figure 7-11 Configurable power-down sequence - Example