SLVSGA1B December   2022  – June 2024 TPS65219-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  System Control Thresholds
    6. 5.6  BUCK1 Converter
    7. 5.7  BUCK2, BUCK3 Converter
    8. 5.8  General Purpose LDOs (LDO1, LDO2)
    9. 5.9  General Purpose LDOs (LDO3, LDO4)
    10. 5.10 GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO1, GPO2, GPIO, MODE/RESET, MODE/STBY, VSEL_SD/VSEL_DDR)
    11. 5.11 Voltage and Temperature Monitors
    12. 5.12 I2C Interface
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Power-Up Sequencing
      2. 6.3.2  Power-Down Sequencing
      3. 6.3.3  Push Button and Enable Input (EN/PB/VSENSE)
      4. 6.3.4  Reset to SoC (nRSTOUT)
      5. 6.3.5  Buck Converters (Buck1, Buck2, and Buck3)
        1. 6.3.5.1 Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Linear Regulators (LDO1 through LDO4)
      7. 6.3.7  Interrupt Pin (nINT)
      8. 6.3.8  PWM/PFM and Low Power Modes (MODE/STBY)
      9. 6.3.9  PWM/PFM and Reset (MODE/RESET)
      10. 6.3.10 Voltage Select pin (VSEL_SD/VSEL_DDR)
      11. 6.3.11 General Purpose Inputs or Outputs (GPO1, GPO2, and GPIO)
      12. 6.3.12 I2C-Compatible Interface
        1. 6.3.12.1 Data Validity
        2. 6.3.12.2 Start and Stop Conditions
        3. 6.3.12.3 Transferring Data
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
        1. 6.4.1.1 OFF State
        2. 6.4.1.2 INITIALIZE State
        3. 6.4.1.3 ACTIVE State
        4. 6.4.1.4 STBY State
        5. 6.4.1.5 Fault Handling
    5. 6.5 Multi-PMIC Operation
    6. 6.6 User Registers
    7. 6.7 Device Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application Example
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Buck1, Buck2, Buck3 Design Procedure
        2. 7.2.3.2 LDO1, LDO2 Design Procedure
        3. 7.2.3.3 LDO3, LDO4 Design Procedure
        4. 7.2.3.4 VSYS, VDD1P8
        5. 7.2.3.5 Digital Signals Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.7 Interrupt Pin (nINT)

During power-up, the output of the nINT pin does depend on whether any INT_SOURCE flags are set and the configuration of the MASK_EFFECT bit in INT_MASK_BUCKS register-. If one or more flags are set, then nINT pin is pulled low and is only released high after those flags have been cleared by writing ‘1’ to them. Note, the nINT-pin can only transition 'high' if a VIO-voltage for the pull-up is available.

In ACTIVE or STBY state, the nINT pin signals any event or fault condition to the host processor. Whenever a fault or event occurs in the IC, the corresponding interrupt bit is set in the INT register, and the open-drain output is driven low. In case the device transitions to INITIALIZE state, the nINT pin is pulled low as well, regardless if the transition is triggered by an OFF-request or a fault.

If the fault is no longer present, a W1C (write '1' to clear) needs to be performed on the failure bits. This command also allows the nINT-pin to release (return to Hi-Z state).

If a failure persists, the corresponding bit remains set and the INT pin remains low.

The UV-faults can be individually masked per rail in INT_MASK_UV registers. The thermal sensors can individually be masked by SENSOR_x_WARM_MASK in the MASK_CONFIG register. The effect of the masking for UV and WARM is defined globally by MASK_EFFECT bits in MASK_CONFIG register.

The nINT reaction for RV-faults is defined globally by MASK_INT_FOR_RV bits in MASK_CONFIG register.

  • 00b = no state change, no nINT reaction, no bit set
  • 01b = no state change, no nINT reaction, bit set
  • 10b = no state change, nINT reaction, bit set (same as 11b)
  • 11b = no state change, nINT reaction, bit set (same as 10b)
CAUTION: Masking poses a risk to the device or the system. In case the masking is performed by I2C-command, the masking bits do get reset to EEPROM-based default after transitioning to INITIALIZE state. Bits corresponding to faults newly configured via I2C as SD-faults do not get cleared.

It is strongly discouraged to mask OC- and UV-detection on the same rail.