SLVSGA0B
May 2022 – June 2024
TPS65219
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
System Control Thresholds
6.6
BUCK1 Converter
6.7
BUCK2, BUCK3 Converter
6.8
General Purpose LDOs (LDO1, LDO2)
6.9
General Purpose LDOs (LDO3, LDO4)
6.10
GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO1, GPO2, GPIO, MODE/RESET, MODE/STBY, VSEL_SD/VSEL_DDR)
6.11
Voltage and Temperature Monitors
6.12
I2C Interface
6.13
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power-Up Sequencing
7.3.2
Power-Down Sequencing
7.3.3
Push Button and Enable Input (EN/PB/VSENSE)
7.3.4
Reset to SoC (nRSTOUT)
7.3.5
Buck Converters (Buck1, Buck2, and Buck3)
7.3.6
Linear Regulators (LDO1 through LDO4)
7.3.7
Interrupt Pin (nINT)
7.3.8
PWM/PFM and Low Power Modes (MODE/STBY)
7.3.9
PWM/PFM and Reset (MODE/RESET)
7.3.10
Voltage Select pin (VSEL_SD/VSEL_DDR)
7.3.11
General Purpose Inputs or Outputs (GPO1, GPO2, and GPIO)
7.3.12
I2C-Compatible Interface
7.3.12.1
Data Validity
7.3.12.2
Start and Stop Conditions
7.3.12.3
Transferring Data
7.4
Device Functional Modes
7.4.1
Modes of Operation
7.4.1.1
OFF State
7.4.1.2
INITIALIZE State
7.4.1.3
ACTIVE State
7.4.1.4
STBY State
7.4.1.5
Fault Handling
7.5
Multi-PMIC Operation
7.6
User Registers
7.7
Device Registers
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Typical Application Example
8.2.2
Design Requirements
8.2.3
Detailed Design Procedure
8.2.3.1
Buck1, Buck2, Buck3 Design Procedure
8.2.3.2
LDO1, LDO2 Design Procedure
8.2.3.3
LDO3, LDO4 Design Procedure
8.2.3.4
VSYS, VDD1P8
8.2.3.5
Digital Signals Design Procedure
8.2.4
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Receiving Notification of Documentation Updates
9.2
Support Resources
9.3
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RSM|32
MPQF195B
RHB|32
MPQF130D
Thermal pad, mechanical data (Package|Pins)
RSM|32
QFND112H
RHB|32
QFND676
Orderable Information
slvsga0b_oa
slvsga0b_pm
7
Detailed Description