SLVSH09A November   2023  – June 2024 TPS6522005-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  System Control Thresholds
    6. 5.6  BUCK1 Converter
    7. 5.7  BUCK2, BUCK3 Converter
    8. 5.8  General Purpose LDOs (LDO1, LDO2)
    9. 5.9  General Purpose LDOs (LDO3, LDO4)
    10. 5.10 GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO1, GPO2, GPIO, MODE/RESET, MODE/STBY, VSEL_SD/VSEL_DDR)
    11. 5.11 Voltage and Temperature Monitors
    12. 5.12 I2C Interface
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Power-Up Sequencing
      2. 6.3.2  Power-Down Sequencing
      3. 6.3.3  Push Button and Enable Input (EN/PB/VSENSE)
      4. 6.3.4  Reset to SoC (nRSTOUT)
      5. 6.3.5  Buck Converters (Buck1, Buck2, and Buck3)
        1. 6.3.5.1 Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Linear Regulators (LDO1 through LDO4)
      7. 6.3.7  Interrupt Pin (nINT)
      8. 6.3.8  PWM/PFM and Low Power Modes (MODE/STBY)
      9. 6.3.9  PWM/PFM and Reset (MODE/RESET)
      10. 6.3.10 Voltage Select pin (VSEL_SD/VSEL_DDR)
      11. 6.3.11 General Purpose Inputs or Outputs (GPO1, GPO2, and GPIO)
      12. 6.3.12 I2C-Compatible Interface
        1. 6.3.12.1 Data Validity
        2. 6.3.12.2 Start and Stop Conditions
        3. 6.3.12.3 Transferring Data
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
        1. 6.4.1.1 OFF State
        2. 6.4.1.2 INITIALIZE State
        3. 6.4.1.3 ACTIVE State
        4. 6.4.1.4 STBY State
        5. 6.4.1.5 Fault Handling
    5. 6.5 Multi-PMIC Operation
    6. 6.6 NVM Programming
      1. 6.6.1 TPS6522005-EP default NVM settings
      2. 6.6.2 NVM programming in Initialize State
      3. 6.6.3 NVM Programming in Active State
    7. 6.7 User Registers
    8. 6.8 Device Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application Example
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Buck1, Buck2, Buck3 Design Procedure
        2. 7.2.3.2 LDO1, LDO2 Design Procedure
        3. 7.2.3.3 LDO3, LDO4 Design Procedure
        4. 7.2.3.4 VSYS, VDD1P8
        5. 7.2.3.5 Digital Signals Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.10 Voltage Select pin (VSEL_SD/VSEL_DDR)

The function of this pin is configured by VSEL_DDR_SD in MFP_1_CONFIG.

When configured as VSEL_SD, the bit VSEL_RAIL in MFP_1_CONFIG register selects LDO1 or LDO2 to be controlled by the pin. The configuration must not change after power-up.

VSEL_SD/VSEL_DDR configured as 'VSEL_SD': SD-card-IO-select:

The polarity of this pin can be configured by writing to VSEL_SD_POLARITY in MFP_1_CONFIG register. Toggling the pin changes the output voltage of the selected LDO between hard-coded 1.8 V and the voltage configured in LDOx_VOUT. For the SD-card-IO-supply, LDOx_VOUT must be configured for 3.3 V. A change of the VSEL_SD status does not cause a state-transition.

CAUTION: In SD-card-configuration, customer must configure the pin-polarity and drive the pin so that the LDO delivers 3.3 V at start-up.

VSEL_SD/VSEL_DDR configured as 'VSEL_DDR':

Pulling this pin high sets the output voltage of Buck3 to 1.35 V (DDR3LV), leaving the pin floating sets the output voltage of Buck3 to 1.2 V (DDR4, LP-DDR3, some LP-DDR2), pulling the pin low sets the output voltage of the Buck3 voltage configured in BUCK3_VOUT. For LP-DDR4, BUCK3_VOUT must be configured to 1.1 V.

CAUTION: This function needs to be hard-wired and must not change during operation.
CAUTION: The VSEL_RAIL still needs to be configured for the LDO that supplies the SD-card-IO-voltage, as an I2C-command toggles the selected LDO-rail for the SD-card. The VSEL_SD_POLARITY bit has no effect if the pin is configured as VSEL_DDR.

The Table below shows the various combinations.

Table 6-5 VSEL_SD/VSEL_DDR configuration options

Pin Configuration

(VSEL_DDR_SD)

Pin Polarity

(VSEL_SD_POLARITY)

Rail selection

(VSEL_RAIL)		 PIN state

(schematic)

 I2C control

(VSEL_SD_I2C_CTRL)

 Resulting Function
DDR n/a 0 = LDO1

1 = LDO2

(needed for I2C control)

 L 0h: LDOx = 1.8V

1h: LDOx = LDOx_VSET

 BUCK3 = Buck3_VSET
DDR n/a 0 = LDO1

1= LDO2

(needed for I2C control)

 open 0h: LDOx = 1.8V

1h: LDOx = LDOx_VSET

 BUCK3 = 1.2V
DDR n/a 0 = LDO1

1 = LDO2

(needed for I2C control)

 H 0h: LDOx = 1.8V

1h: LDOx = LDOx_VSET

 BUCK3 = 1.35
SD 0 0 = LDO1 L x LDO1 = 1.8 V
SD 0 0 = LDO1 H x LDO1 = LDO1_VSET
SD 1 0 = LDO1 L x LDO1 = LDO1_VSET
SD 1 0 = LDO1 H x LDO1 = 1.8 V
SD 0 1 = LDO2 L x LDO2 = 1.8 V
SD 0 1 = LDO2 H x LDO2 = LDO2_VSET
SD 1 1 = LDO2 L x LDO2 = LDO2_VSET
SD 1 1 = LDO2 H x LDO2 = 1.8 V