SLVSH09A November   2023  – June 2024 TPS6522005-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  System Control Thresholds
    6. 5.6  BUCK1 Converter
    7. 5.7  BUCK2, BUCK3 Converter
    8. 5.8  General Purpose LDOs (LDO1, LDO2)
    9. 5.9  General Purpose LDOs (LDO3, LDO4)
    10. 5.10 GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO1, GPO2, GPIO, MODE/RESET, MODE/STBY, VSEL_SD/VSEL_DDR)
    11. 5.11 Voltage and Temperature Monitors
    12. 5.12 I2C Interface
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Power-Up Sequencing
      2. 6.3.2  Power-Down Sequencing
      3. 6.3.3  Push Button and Enable Input (EN/PB/VSENSE)
      4. 6.3.4  Reset to SoC (nRSTOUT)
      5. 6.3.5  Buck Converters (Buck1, Buck2, and Buck3)
        1. 6.3.5.1 Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Linear Regulators (LDO1 through LDO4)
      7. 6.3.7  Interrupt Pin (nINT)
      8. 6.3.8  PWM/PFM and Low Power Modes (MODE/STBY)
      9. 6.3.9  PWM/PFM and Reset (MODE/RESET)
      10. 6.3.10 Voltage Select pin (VSEL_SD/VSEL_DDR)
      11. 6.3.11 General Purpose Inputs or Outputs (GPO1, GPO2, and GPIO)
      12. 6.3.12 I2C-Compatible Interface
        1. 6.3.12.1 Data Validity
        2. 6.3.12.2 Start and Stop Conditions
        3. 6.3.12.3 Transferring Data
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
        1. 6.4.1.1 OFF State
        2. 6.4.1.2 INITIALIZE State
        3. 6.4.1.3 ACTIVE State
        4. 6.4.1.4 STBY State
        5. 6.4.1.5 Fault Handling
    5. 6.5 Multi-PMIC Operation
    6. 6.6 NVM Programming
      1. 6.6.1 TPS6522005-EP default NVM settings
      2. 6.6.2 NVM programming in Initialize State
      3. 6.6.3 NVM Programming in Active State
    7. 6.7 User Registers
    8. 6.8 Device Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application Example
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Buck1, Buck2, Buck3 Design Procedure
        2. 7.2.3.2 LDO1, LDO2 Design Procedure
        3. 7.2.3.3 LDO3, LDO4 Design Procedure
        4. 7.2.3.4 VSYS, VDD1P8
        5. 7.2.3.5 Digital Signals Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.3.5 Digital Signals Design Procedure

This section describes the external connections required for the digital pins. A VIO supply of 3.3V or 1.8V supply is commonly used as the voltage level for the digital signals that require an external pull-up. However, higher voltage can be used (up to the maximum spec). The VIO supply for the digital pins on the PMIC must be the same as the IO domain for the digital signal that is connected to on the processor. 100 kΩ is the recommended pull-up resistor for EN/PB/VSENSE. Pull-up resistor for I2C pins can be calculated based on system requirements. All other digital pins can use 10 kΩ.

If GPIO, GPO1 or GPO2 is assigned to the first slot of the power-up sequence to enable an external discrete, they can be pulled up to VSYS.

The EN/PB/VSENSE pin can be driven externally to enable or disable the PMIC. However, if the application does not have an external signal dedicated to drive this pin, it can be pulled up to VSYS.

Note: Driving the EN/PB/VSENSE pin with an external signal is needed to wake-up the PMIC after an I2C OFF request is sent by I2C (I2C_OFF_REQ). If an OFF request is sent by I2C and the EN/PB/VSENSE is not driven by an external signal, a power cycle on VSYS must be performed to transfer the PMIC from Initialize state to Active.

Table 7-4 Digital Signals requirements
Digital Pin External Connection
nINT Open-drain output. Requires external pull-up.
nRSTOUT Open-drain output. Requires external pull-up.
EN/PB/VSENSE When configured as EN, this signal can be driven by external logic to enable or disable the PMIC.

When configured as PB, this signal requires a pull-up resistor connected to the VSYS pin. Push-button is optional.

When configured as VSENSE, this signal requires an external resistor divider to monitor the pre-regulator.

SDA I2C clock signal. Requires external pull-up.
SCL I2C data signal. Requires external pull-up.
GPIO When configured as GPIO (for multi-PMIC), this pin shares the external pull-up resistor with the second TPS6522005-EP PMIC.

When configured as GPO (for single PMIC), requires external pull-up.

GPO1 Open-drain general purpose output. Requires external pull-up.
GPO2 Open-drain general purpose output. Requires external pull-up.
VSEL_SD / VSEL_DDR Input digital pin. The initial state (pull-up or pull-down) must be set before the assigned PMIC rail ramps up. For example, if this pin is used to set the voltage on LDO1, the state must be set before LDO1 powers up.
MODE / STBY Input digital pin. The initial state (pull-up or pull-down) must be set before the power-up sequence is complete.
MODE / RESET Input digital pin. The initial state (pull-up or pull-down) must be set before the power-up sequence is complete.