The TPS652353 is designed to layout in 2‐layer PCB. To ensure reliability of the
device, following common printed-circuit board layout guidelines is recommended.
- It is critical to make sure the ground of input capacitor, output capacitor,
and the boost converter are connected at one point at same layer.
- The PGND and AGND pins are located in different regions. Connect these grounds
to the thermal pad. Other components are connected the AGND pin.
- Put the BOOST
capacitors as close as possible.
- The loop from the VIN inductor to the LX pin
should be as short as possible.
- The loop from the VIN inductor to D1 Schottky
diode to the BOOST should be as short as possible.
- The loop for boost
capacitors to the PGND pin should be within the loop from the LX pin to D1 Schottky diode to the
BOOST pin.