SLUSDQ8D december 2019 – may 2023 TPS652353
PRODUCTION DATA
PIN | TYPE(1) | DESCRIPTION | |
---|---|---|---|
NO. | NAME | ||
1 | LX | I | Switching node of the boost converter |
2 | VIN | S | Input of internal linear regulator |
3 | VCC | O | Internal 6.3-V power supply. Connect a 1-μF ceramic capacitor from this pin to ground. When VIN is 5 V, connect the VCC pin to the VIN pin. |
4 | AGND | S | Analog ground. Connect all ground pins and power pad together. |
5 | TCAP | O | Connect a capacitor to this pin to set the rise time of the LNB output. |
6 | ISET | O | Connect a resistor to this pin to set the LNB output current limit. |
7 | EN | I | Enable this pin to enable the VLNB output. pull this pin to ground to disable the output. The output is then pulled to ground, and, when the EN pin is low, the I2C interface can be accessed. |
8 | FAULT | O | Open drain output pin, it goes low if any fault flag is set. |
9 | ADDR | I | Connect a different resistor to this pin to set different I2C addresses (see the I2C Address SelectionTable 7-4 table). |
10 | VCTRL | I | Voltage level at this pin to set the output voltage (see the Logic tableTable 7-3). |
11 | SDA | I/O | I2C compatible bidirectional data |
12 | SCL | I | I2C compatible clock input |
13 | EXTM | I | External modulation logic input pin that activates the 22-kHz tone output. The feeding signal can be 22-kHz tone or logic high or low. |
14 | DOUT | O | Tone detection output |
15 | DIN | I | Tone detection input |
16 | VLNB | O | Output of the power supply connected to satellite receiver or switch |
17 | VCP | O | Gate drive supply voltage and output of charge pump. Connect a capacitor between this pin and the VLNB pin. |
18 | BOOST | O | Output of the boost regulator and Input voltage of the internal linear regulator |
19 | GDR | O | Control the gate of the external MOSFET for DiSEqc 2.x support |
20 | PGND | S | Power ground for the boost converter |
— | Thermal Pad | — | The thermal pad must be soldered to the printed circuit board (PCB) for optimal thermal performance. Use thermal vias on the PCB to enhance power dissipation. |