SLVSCS9D december   2014  – may 2023 TPS65263-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Enable and Adjusting UVLO
      3. 7.3.3  Soft-Start Time
      4. 7.3.4  Power-Up Sequencing
      5. 7.3.5  V7V Low-Dropout Regulator and Bootstrap
      6. 7.3.6  Out-of-Phase Operation
      7. 7.3.7  Output Overvoltage Protection (OVP)
      8. 7.3.8  PSM
      9. 7.3.9  Slope Compensation
      10. 7.3.10 Overcurrent Protection
        1. 7.3.10.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.10.2 Low-Side MOSFET Overcurrent Protection
      11. 7.3.11 Power Good
        1. 7.3.11.1 Adjustable Switching Frequency
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial Interface Description
      2. 7.4.2 I2C Update Sequence
    5. 7.5 Register Maps
      1. 7.5.1 VOUT2_SEL: Vout2 Voltage Selection Register (Address = 0x01H)
      2. 7.5.2 VOUT1_COM: Buck1 Command Register (offset = 0x03H)
      3. 7.5.3 VOUT2_COM: Buck2 Command Register (offset = 0x04H)
      4. 7.5.4 VOUT3_COM: Buck3 Command Register (offset = 0x05H)
      5. 7.5.5 SYS_STATUS: System Status Register (offset = 0x06H)
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Inductor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Loop Compensation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Qualified for automotive applications
  • AEC-Q100 qualification with the following results:
    • Device temperature grade 1: –40°C to 125°C operating junction temperature range
    • Device HBM ESD classification level H2
    • Device CDM ESD classification level C4B
  • Operating input voltage range 4.0-V to 18-V maximum continuous output current 3 A/2 A/2 A
  • I2C controlled 7-bits VID programmable output voltage from 0.68 to 1.95 V With 10-mV voltage step for Buck2
  • I2C controlled VID voltage transition slew rate for Buck2
  • I2C read back power-good status, overcurrent warning and die temperature warning
  • I2C compatible interface with standard mode (100 kHz) and fast mode (400 kHz)
  • Feedback reference voltage 0.6 V ±1%
  • Adjustable clock frequency from 200 kHz to
    2.3 MHz
  • External clock synchronization
  • Dedicated enable and soft-start pins for each buck
  • Output voltage power-good indicator
  • Thermal overloading protection