SLVSCL3E
June 2014 – May 2019
TPS65283
,
TPS65283-1
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Typical Schematic
Efficiency, Vin = 12 V, PSM
5
Revision History
6
Description (continued)
7
Pin Configuration and Functions
Pin Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
Handling Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information
8.5
Electrical Characteristics
8.6
Typical Characteristics
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Power Switch Detailed Description
9.3.1.1
Overcurrent Condition
9.3.1.2
Reverse Current and Voltage Protection
9.3.1.3
nFAULT Response
9.3.1.4
UVLO
9.3.1.5
Enable and Output Discharge
9.3.1.6
Power Switch Input and Output Capacitance
9.3.1.7
Programming the Current-Limit Threshold
9.3.2
Buck DC-DC Converter Detailed Description
9.3.2.1
Output Voltage
9.3.2.2
Adjustable Switching Frequency
9.3.2.3
Synchronization
9.3.2.4
Error Amplifier
9.3.2.5
Slope Compensation
9.3.2.6
Enable and Adjusting UVLO
9.3.2.7
Internal V7V Regulator
9.3.2.8
Short Circuit Protection
9.3.2.8.1
High-Side MOSFET Overcurrent Protection
9.3.2.8.2
Low-Side MOSFET Overcurrent Protection
9.3.2.9
Bootstrap Voltage (BST) and Low Dropout Operation
9.3.2.10
Output Overvoltage Protection (OVP)
9.3.2.11
Power Good
9.3.2.12
Power-Up Sequencing
9.3.2.13
Thermal Performance
9.4
Device Functional Modes
9.4.1
Operation With VIN < 4.5 V (Minimum VIN)
9.4.2
Operation With EN Control
9.4.3
Operation at Light Loads
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.2.1
Output Voltage Setting
10.2.2.2
Bootstrap Capacitor Selection
10.2.2.3
Inductor Selection
10.2.2.4
Output Capacitor Selection
10.2.2.5
Input Capacitor Selection
10.2.2.6
Minimum Output Voltage
10.2.2.7
Compensation Component Selection
10.2.3
Application Curves
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.1.1
PCB Layout Recommendation
12.1.2
Power Dissipation and Junction Temperature
12.2
Layout Example
13
Device and Documentation Support
13.1
Documentation Support
13.1.1
Related Links
13.2
Trademarks
13.3
Electrostatic Discharge Caution
13.4
Glossary
14
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGE|24
MPQF124G
Thermal pad, mechanical data (Package|Pins)
RGE|24
QFND008AA
Orderable Information
slvscl3e_oa
slvscl3e_pm
12.2
Layout Example
Figure 58.
4-Layer PCB Layout Recommendation