SLVSBC4G May   2012  – June 2017 TPS65381-Q1

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Typical Application Diagram
  2. 2 Revision History
  3. 3 Pin Configuration and Functions
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing Requirements
    7. 4.7 Switching Characteristics
    8. 4.8 Typical Characteristics
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 VDD6 Buck Switch-Mode Power Supply
      2. 5.3.2 VDD5 Linear Regulator
      3. 5.3.3 VDD3/5 Linear Regulator
      4. 5.3.4 VDD1 Linear Regulator
      5. 5.3.5 VSOUT1 Linear Regulator
      6. 5.3.6 Charge Pump
      7. 5.3.7 Wake-Up
      8. 5.3.8 Reset Extension
    4. 5.4 Device Functional Modes
      1. 5.4.1  Power-Up and Power-Down Behavior
      2. 5.4.2  Safety Functions and Diagnostics Overview
      3. 5.4.3  Voltage Monitor (VMON)
      4. 5.4.4  TPS65381-Q1 Internal Error Signals
      5. 5.4.5  Loss-of-Clock Monitor (LCMON)
      6. 5.4.6  Analog Built-In Self-Test (ABIST)
      7. 5.4.7  Logic Built-In Self-Test (LBIST)
      8. 5.4.8  Junction Temperature Monitoring and Current Limiting
      9. 5.4.9  Diagnostic MUX and Diagnostic Output Pin (DIAG_OUT)
        1. 5.4.9.1 Analog MUX (AMUX)
        2. 5.4.9.2 Digital MUX (DMUX)
        3. 5.4.9.3 Diagnostic MUX Output State (by MUX_OUT bit)
        4. 5.4.9.4 MUX Interconnect Check
      10. 5.4.10 Watchdog Timer (WD)
      11. 5.4.11 Watchdog Fail Counter, Status, and Fail Event
      12. 5.4.12 Watchdog Sequence
      13. 5.4.13 MCU to Watchdog Synchronization
      14. 5.4.14 Trigger Mode (Default Mode)
      15. 5.4.15 Q&A Mode
        1. 5.4.15.1 Watchdog Q&A Related Definitions
        2. 5.4.15.2 Watchdog Sequence in Q&A Mode
        3. 5.4.15.3 Question (Token) Generation
        4. 5.4.15.4 Answer Comparison and Reference Answer
          1. 5.4.15.4.1 Sequence of the 2-bit Watchdog Answer Counter
        5. 5.4.15.5 Watchdog Q&A Mode Sequence Events and WD_STATUS Register Updates
      16. 5.4.16 MCU Error Signal Monitor (MCU ESM)
        1. 5.4.16.1 TMS570 Mode
        2. 5.4.16.2 PWM Mode
      17. 5.4.17 Device Configuration Register Protection
      18. 5.4.18 Enable and Reset Driver Circuit
      19. 5.4.19 Device Operating States
      20. 5.4.20 STANDBY State
      21. 5.4.21 RESET State
      22. 5.4.22 DIAGNOSTIC State
      23. 5.4.23 ACTIVE State
      24. 5.4.24 SAFE State
      25. 5.4.25 State Transition Priorities
      26. 5.4.26 Power on Reset (NPOR)
    5. 5.5 Register Maps
      1. 5.5.1 Serial Peripheral Interface (SPI)
        1. 5.5.1.1 SPI Command Transfer Phase
        2. 5.5.1.2 SPI Data-Transfer Phase
        3. 5.5.1.3 Device Status Flag Byte Response
        4. 5.5.1.4 Device SPI Data Response
        5. 5.5.1.5 SPI Frame Overview
      2. 5.5.2 SPI Register Write Access Lock (SW_LOCK command)
      3. 5.5.3 SPI Registers (SPI Mapped Response)
        1. 5.5.3.1 Device Revision and ID
          1. 5.5.3.1.1 DEV_REV Register
          2. 5.5.3.1.2 DEV_ID Register
        2. 5.5.3.2 Device Status
          1. 5.5.3.2.1 DEV_STAT Register
        3. 5.5.3.3 Device Configuration
          1. 5.5.3.3.1 DEV_CFG1 Register
          2. 5.5.3.3.2 DEV_CFG2 Register
      4. 5.5.4 Device Safety Status and Control Registers
        1. 5.5.4.1  VMON_STAT_1 Register
        2. 5.5.4.2  VMON_STAT_2 Register
        3. 5.5.4.3  SAFETY_STAT_1 Register
        4. 5.5.4.4  SAFETY_STAT_2 Register
        5. 5.5.4.5  SAFETY_STAT_3 Register
        6. 5.5.4.6  SAFETY_STAT_4 Register
        7. 5.5.4.7  SAFETY_STAT_5 Register
        8. 5.5.4.8  SAFETY_ERR_CFG Register
        9. 5.5.4.9  SAFETY_BIST_CTRL Register
        10. 5.5.4.10 SAFETY_CHECK_CTRL Register
        11. 5.5.4.11 SAFETY_FUNC_CFG Register
        12. 5.5.4.12 SAFETY_ERR_STAT Register
        13. 5.5.4.13 SAFETY_ERR_PWM_H Register
        14. 5.5.4.14 SAFETY_ERR_PWM_L Register
        15. 5.5.4.15 SAFETY_PWD_THR_CFG Register
        16. 5.5.4.16 SAFETY_CFG_CRC Register
        17. 5.5.4.17 Diagnostics
          1. 5.5.4.17.1 DIAG_CFG_CTRL Register
          2. 5.5.4.17.2 DIAG_MUX_SEL Register
      5. 5.5.5 Watchdog Timer
        1. 5.5.5.1 WD_TOKEN_FDBK Register
        2. 5.5.5.2 WD_WIN1_CFG Register
        3. 5.5.5.3 WD_WIN2_CFG Register
        4. 5.5.5.4 WD_TOKEN_VALUE Register
        5. 5.5.5.5 WD_STATUS Register
        6. 5.5.5.6 WD_ANSWER Register
      6. 5.5.6 Sensor Supply
        1. 5.5.6.1 SENS_CTRL Register
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 VDD6 Preregulator
        2. 6.2.2.2 VDD1 Linear Controller
        3. 6.2.2.3 VSOUT1 Tracking Linear Regulator, Configured to Track VDD5
        4. 6.2.2.4 Alternative Use for VSOUT1 Tracking Linear Regulator, Configured for 6-V Output Tracking VDD3/5 In 3.3-V Mode
        5. 6.2.2.5 Alternative Use for VSOUT1 Tracking Linear Regulator, Configured for 9-V Output Tracking to 5-V Input from VDD5
        6. 6.2.2.6 Alternative Use for VSOUT1 Tracking Linear Regulator, Configured in Non-tracking Mode Providing a 4.5-V Output
      3. 6.2.3 Application Curves
    3. 6.3 System Examples
  7. 7 Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 VDD6 Buck Preregulator
      2. 8.1.2 VDD1 Linear Regulator Controller
      3. 8.1.3 VDD5 and VDD3/5 Linear Regulators
      4. 8.1.4 VSOUT1 Tracking Linear Regulator
      5. 8.1.5 Charge Pump
      6. 8.1.6 Other Considerations
    2. 8.2 Layout Example
    3. 8.3 Power Dissipation and Thermal Considerations
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Community Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Device and Documentation Support

9.1 Device Support

9.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

9.2 Documentation Support

9.2.1 Related Documentation

For related documentation, see the following:

9.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

9.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

9.5 Trademarks

Hercules, C2000, PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

9.7 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.