SLVS979C October   2009  – May 2018 TPS65720 , TPS65721

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application Schematic
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions—DSBGA (TPS65720)
    2.     Pin Functions—DSBGA (TPS657201, TPS657202)
    3.     Pin Functions—WQFN (TPS65721)
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Timing Requirements
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Battery Charger and Power Path
      2. 8.3.2  Power-Path Management
      3. 8.3.3  Battery Charging
        1. 8.3.3.1 I-PRECHARGE
        2. 8.3.3.2 ITERM
        3. 8.3.3.3 Battery Detection and Recharge
        4. 8.3.3.4 Charge Termination On/Off
        5. 8.3.3.5 Timers
        6. 8.3.3.6 Dynamic Timer Function
        7. 8.3.3.7 Charger Fault
      4. 8.3.4  Thermal Regulation and Thermal Shutdown
      5. 8.3.5  Battery Pack Temperature Monitoring
      6. 8.3.6  DCDC1 Converter
      7. 8.3.7  Power Save Mode
        1. 8.3.7.1 Dynamic Voltage Positioning
        2. 8.3.7.2 Soft Start
        3. 8.3.7.3 100% Duty Cycle Low Dropout Operation
        4. 8.3.7.4 Undervoltage Lockout
      8. 8.3.8  Short-Circuit Protection
      9. 8.3.9  Thermal Shutdown
      10. 8.3.10 LDO1
        1. 8.3.10.1 Default Voltage Setting for LDOs and DCDC1
        2. 8.3.10.2 Internal Analog Multiplexer (BAT, TS, TS_OUT); TPS657201, TPS657202 Only
        3. 8.3.10.3 Internal Battery Voltage Comparator
        4. 8.3.10.4 GPIOs, LED Drivers
        5. 8.3.10.5 RESET Output
        6. 8.3.10.6 Threshold Input (TPS65721 Only)
          1. 8.3.10.6.1 ENABLE for DCDC1 and LDO1
          2. 8.3.10.6.2 PB_IN Input
          3. 8.3.10.6.3 HOLD_DCDC1 Input
          4. 8.3.10.6.4 HOLD_LDO1 Input
          5. 8.3.10.6.5 INT Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Down
      2. 8.4.2 Sleep Mode
      3. 8.4.3 Standby Mode
      4. 8.4.4 Power-On Reset Mode
      5. 8.4.5 Idle Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
    6. 8.6 Register Maps
      1. 8.6.1  CHGSTATUS Register Address: 01h (read only)
      2. 8.6.2  CHGCONFIG0 Register Address: 02h (read/write)
      3. 8.6.3  CHGCONFIG1 Register Address: 03h (read/write)
      4. 8.6.4  CHGCONFIG2 Register Address: 04h (read/write)
      5. 8.6.5  CHGCONFIG3 Register Address: 05h (read/write)
      6. 8.6.6  CHGSTATE Register Address: 06h (read only)
      7. 8.6.7  DEFDCDC1 Register Address: 07h (read/write)
      8. 8.6.8  LDO_CTRL Register Address: 08h (read/write)
      9. 8.6.9  CONTROL0 Register Address: 09h (read/write)
      10. 8.6.10 CONTROL1 Register Address: 0Ah (read/write)
      11. 8.6.11 GPIO_SSC Register Address: 0Bh (read/write)
      12. 8.6.12 GPIODIR Register Address: 0Ch (read/write)
      13. 8.6.13 IRMASK0 Register Address: 0Dh (read/write)
      14. 8.6.14 IRMASK1 Register Address: 0Eh (read/write)
      15. 8.6.15 IRMASK2 Register Address: 0Fh (read/write)
      16. 8.6.16 IR0 Register Address: 10h (read only)
      17. 8.6.17 IR1 Register Address: 11h (read)
      18. 8.6.18 IR2 Register Address: 12h (read)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Voltage Setting
          1. 9.2.2.1.1 DCDC1
          2. 9.2.2.1.2 LDO1
        2. 9.2.2.2 Output Filter Design (Inductor and Output Capacitor)
          1. 9.2.2.2.1 Inductor Selection
          2. 9.2.2.2.2 Output Capacitor Selection
          3. 9.2.2.2.3 Input Capacitor Selection
        3. 9.2.2.3 Charger/Power Path
          1. 9.2.2.3.1 Charger Stability
          2. 9.2.2.3.2 Setting the Charge Current
          3. 9.2.2.3.3 Dynamic Power Path Management (DPPM)
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Timing Requirements

MIN NOM MAX UNIT
RESET and PB_IN
TRESET Reset delay time on pin RESET Low to high transition of RESET pin, Bit RESET_DELAY = 0 9 11 13 ms
Low to high transition of RESET pin, Bit RESET_DELAY = 1 70 90 110
HIGH to LOW transition of RESET pin RESET will go low by HOLD pin going LOW AND HOLD Bit set to 0 OR voltage at Vreset falling below the threshold 10 μs
Tdebounce Debounce time at PB_IN Rising and falling voltage 39 50 60 ms
POWER OUTPUTS, DCDC1 and LDO1
tStart DCDC1 Start-up time Time from active EN to Start switching 170 μs
tRamp DCDC1 VOUT ramp time Time to ramp from 5% to 95% of VOUT 250 μs
LDO1 PGOOD debounce time Internal PGOOD comparator at VOUTLDO1 is debounced by 80 μs
tRamp LDO1 VOUT Ramp time Internal soft-start when LDO is enabled;
Time to ramp from 5% to 95% of VOUT 		250 μs
POWER PATH
tDGL(PGOOD) Deglitch time, input power detected status Time measured from VIN: 0 V → 5 V 1 μs
rise time to PGOOD = LO		 2 ms
tBLK(OVP) Input overvoltage blanking time 50 μs
tREC(OVP) Input overvoltage recovery time Time measured from VAC: 11 V → 5 V 1 μs
fall time to <CH_PGOOD> = 0		 2 ms
tDGL(SC2) Output short-circuit detection deglitch time, supplement mode short circuit
VBAT – VOUT> VO(SC2) indicates short-circuit		 250 μs
tREC(SC2) Recovery time, supplement mode short circuit 60 ms
CHARGER
tDGL1(LOWV) Deglitch time on pre-charge to fast-charge transition 25 ms
tDGL2(LOWV) Deglitch time on fast-charge to pre-charge transition 25 ms
tDGL(TERM) Deglitch time, termination detected 25 ms
tDGL(RCH) Deglitch time, recharge threshold detected 62.5 ms
tDGL(NO-IN) Delay time, input power loss to charger turn-off VBAT = 3.6 V. Time measured from VIN: 5 V → 3.3 V 1 μs fall time 20 ms
tDET Battery detection timer 250 ms
BATTERY PACK MONITOR
tDGL(TS) Deglitch time, pack temperature fault detection 50 ms
tSW(VBAT-TS) MUX switching time Bit <OPAMP+MUX> toggles 1 ms
I2C COMMUNICATION
fMAX Clock frequency 400 kHz
twH(HIGH) Clock high time 600 ns
twL(LOW) Clock low time 1300 ns
tR DATA and CLK rise time 300 ns
tF DATA and CLK fall time 300 ns
th(STA) Hold time (repeated) START condition (after this period the first clock pulse is generated) 600 ns
th(DATA) Setup time for repeated START condition 600 ns
th(DATA) Data input hold time 0 ns
tsu(DATA) Data input setup time 100 ns
tsu(STO) STOP condition setup time 600 ns
t(BUF) Bus free time 1300 ns