SLVSAF6A June   2011  – January 2016 TPS65835

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Block Diagram
  2. 2 Revision History
  3. 3 Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Functions
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Power-On Hours (POH)
    4. 4.4 Recommended Operating Conditions
    5. 4.5 Thermal Information
    6. 4.6 Electrical Characteristics
    7. 4.7 Quiescent Current
    8. 4.8 Typical Characteristics
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 System Operation
        1. 5.3.1.1 System Power Up
        2. 5.3.1.2 System Operation Using Push Button Switch
        3. 5.3.1.3 System Operation Using Slider Switch
      2. 5.3.2 Linear Charger Operation
        1. 5.3.2.1 Battery and TS Detection
        2. 5.3.2.2 Battery Charging
          1. 5.3.2.2.1 Pre-charge
          2. 5.3.2.2.2 Charge Termination
          3. 5.3.2.2.3 Recharge
          4. 5.3.2.2.4 Charge Timers
        3. 5.3.2.3 Charger Status (nCHG_STAT Pin)
      3. 5.3.3 LDO Operation
        1. 5.3.3.1 LDO Internal Current Limit
      4. 5.3.4 Boost Converter Operation
        1. 5.3.4.1 Boost Thermal Shutdown
        2. 5.3.4.2 Boost Load Disconnect
      5. 5.3.5 Full H-Bridge Analog Switches
        1. 5.3.5.1 H-Bridge Switch Control
      6. 5.3.6 Power Management Core Control
        1. 5.3.6.1 SLEEP / Power Control Pin Function
        2. 5.3.6.2 COMP Pin Functionality
        3. 5.3.6.3 SW_SEL Pin Functionality
        4. 5.3.6.4 SWITCH Pin
        5. 5.3.6.5 Slider Switch Behavior
        6. 5.3.6.6 Push-Button Switch Behavior
    4. 5.4 Device Functional Modes
      1. 5.4.1 SLEEP State
      2. 5.4.2 NORMAL Operating Mode
    5. 5.5 MSP430 CORE
      1. 5.5.1 MSP430 Electrical Characteristics
        1. 5.5.1.1  MSP430 Recommended Operating Conditions
        2. 5.5.1.2  Active Mode Supply Current Into VCC Excluding External Current
        3. 5.5.1.3  Typical Characteristics, Active Mode Supply Current (Into VCC)
        4. 5.5.1.4  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
        5. 5.5.1.5  Typical Characteristics, Low-Power Mode Supply Currents
        6. 5.5.1.6  Schmitt-Trigger Inputs, Ports Px
        7. 5.5.1.7  Leakage Current, Ports Px
        8. 5.5.1.8  Outputs, Ports Px
        9. 5.5.1.9  Output Frequency, Ports Px
        10. 5.5.1.10 Typical Characteristics, Outputs
        11. 5.5.1.11 Pin-Oscillator Frequency - Ports Px
        12. 5.5.1.12 Typical Characteristics, Pin-Oscillator Frequency
        13. 5.5.1.13 POR/Brownout Reset (BOR)
        14. 5.5.1.14 Typical Characteristics, POR/Brownout Reset (BOR)
        15. 5.5.1.15 DCO Frequency
        16. 5.5.1.16 Calibrated DCO Frequencies, Tolerance
        17. 5.5.1.17 Wake-Up From Lower-Power Modes (LPM3/4)
        18. 5.5.1.18 Typical Characteristics, DCO Clock Wake-Up Time From LPM3/4
        19. 5.5.1.19 Crystal Oscillator, XT1, Low-Frequency Mode
        20. 5.5.1.20 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        21. 5.5.1.21 Timer_A
        22. 5.5.1.22 USCI (UART Mode)
        23. 5.5.1.23 USCI (SPI Master Mode)
        24. 5.5.1.24 USCI (SPI Slave Mode)
        25. 5.5.1.25 USCI (I2C Mode)
        26. 5.5.1.26 Comparator_A+
        27. 5.5.1.27 Typical Characteristics - Comparator_A+
        28. 5.5.1.28 10-Bit ADC, Power Supply and Input Range Conditions
        29. 5.5.1.29 10-Bit ADC, Built-In Voltage Reference
        30. 5.5.1.30 10-Bit ADC, External Reference
        31. 5.5.1.31 10-Bit ADC, Timing Parameters
        32. 5.5.1.32 10-Bit ADC, Linearity Parameters
        33. 5.5.1.33 10-Bit ADC, Temperature Sensor and Built-In VMID
        34. 5.5.1.34 Flash Memory
        35. 5.5.1.35 RAM
        36. 5.5.1.36 JTAG and Spy-Bi-Wire Interface
        37. 5.5.1.37 JTAG Fuse
      2. 5.5.2 MSP430 Core Operation
        1. 5.5.2.1 Description
        2. 5.5.2.2 Accessible MSP430 Pins
        3. 5.5.2.3 MSP430 Port Functions and Programming Options
        4. 5.5.2.4 Operating Modes
        5. 5.5.2.5 MSP430x2xx User's Guide
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Active Shutter 3D Glasses
        1. 6.2.1.1 Design Requirements
        2. 6.2.1.2 Detailed Design Procedure
          1. 6.2.1.2.1 Boost Converter Application Information
            1. 6.2.1.2.1.1 Setting Boost Output Voltage
            2. 6.2.1.2.1.2 Boost Inductor Selection
            3. 6.2.1.2.1.3 Boost Capacitor Selection
          2. 6.2.1.2.2 Bypassing Default Push-Button SWITCH Functionality
          3. 6.2.1.2.3 MSP430 Programming
            1. 6.2.1.2.3.1 Code To Setup Power Functions
        3. 6.2.1.3 Application Curves
  7. 7  Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Community Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Device and Documentation Support

9.1 Device Support

9.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

9.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

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9.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

9.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

9.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.