SLVSAF6A June   2011  – January 2016 TPS65835

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Block Diagram
  2. 2 Revision History
  3. 3 Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Functions
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Power-On Hours (POH)
    4. 4.4 Recommended Operating Conditions
    5. 4.5 Thermal Information
    6. 4.6 Electrical Characteristics
    7. 4.7 Quiescent Current
    8. 4.8 Typical Characteristics
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 System Operation
        1. 5.3.1.1 System Power Up
        2. 5.3.1.2 System Operation Using Push Button Switch
        3. 5.3.1.3 System Operation Using Slider Switch
      2. 5.3.2 Linear Charger Operation
        1. 5.3.2.1 Battery and TS Detection
        2. 5.3.2.2 Battery Charging
          1. 5.3.2.2.1 Pre-charge
          2. 5.3.2.2.2 Charge Termination
          3. 5.3.2.2.3 Recharge
          4. 5.3.2.2.4 Charge Timers
        3. 5.3.2.3 Charger Status (nCHG_STAT Pin)
      3. 5.3.3 LDO Operation
        1. 5.3.3.1 LDO Internal Current Limit
      4. 5.3.4 Boost Converter Operation
        1. 5.3.4.1 Boost Thermal Shutdown
        2. 5.3.4.2 Boost Load Disconnect
      5. 5.3.5 Full H-Bridge Analog Switches
        1. 5.3.5.1 H-Bridge Switch Control
      6. 5.3.6 Power Management Core Control
        1. 5.3.6.1 SLEEP / Power Control Pin Function
        2. 5.3.6.2 COMP Pin Functionality
        3. 5.3.6.3 SW_SEL Pin Functionality
        4. 5.3.6.4 SWITCH Pin
        5. 5.3.6.5 Slider Switch Behavior
        6. 5.3.6.6 Push-Button Switch Behavior
    4. 5.4 Device Functional Modes
      1. 5.4.1 SLEEP State
      2. 5.4.2 NORMAL Operating Mode
    5. 5.5 MSP430 CORE
      1. 5.5.1 MSP430 Electrical Characteristics
        1. 5.5.1.1  MSP430 Recommended Operating Conditions
        2. 5.5.1.2  Active Mode Supply Current Into VCC Excluding External Current
        3. 5.5.1.3  Typical Characteristics, Active Mode Supply Current (Into VCC)
        4. 5.5.1.4  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
        5. 5.5.1.5  Typical Characteristics, Low-Power Mode Supply Currents
        6. 5.5.1.6  Schmitt-Trigger Inputs, Ports Px
        7. 5.5.1.7  Leakage Current, Ports Px
        8. 5.5.1.8  Outputs, Ports Px
        9. 5.5.1.9  Output Frequency, Ports Px
        10. 5.5.1.10 Typical Characteristics, Outputs
        11. 5.5.1.11 Pin-Oscillator Frequency - Ports Px
        12. 5.5.1.12 Typical Characteristics, Pin-Oscillator Frequency
        13. 5.5.1.13 POR/Brownout Reset (BOR)
        14. 5.5.1.14 Typical Characteristics, POR/Brownout Reset (BOR)
        15. 5.5.1.15 DCO Frequency
        16. 5.5.1.16 Calibrated DCO Frequencies, Tolerance
        17. 5.5.1.17 Wake-Up From Lower-Power Modes (LPM3/4)
        18. 5.5.1.18 Typical Characteristics, DCO Clock Wake-Up Time From LPM3/4
        19. 5.5.1.19 Crystal Oscillator, XT1, Low-Frequency Mode
        20. 5.5.1.20 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        21. 5.5.1.21 Timer_A
        22. 5.5.1.22 USCI (UART Mode)
        23. 5.5.1.23 USCI (SPI Master Mode)
        24. 5.5.1.24 USCI (SPI Slave Mode)
        25. 5.5.1.25 USCI (I2C Mode)
        26. 5.5.1.26 Comparator_A+
        27. 5.5.1.27 Typical Characteristics - Comparator_A+
        28. 5.5.1.28 10-Bit ADC, Power Supply and Input Range Conditions
        29. 5.5.1.29 10-Bit ADC, Built-In Voltage Reference
        30. 5.5.1.30 10-Bit ADC, External Reference
        31. 5.5.1.31 10-Bit ADC, Timing Parameters
        32. 5.5.1.32 10-Bit ADC, Linearity Parameters
        33. 5.5.1.33 10-Bit ADC, Temperature Sensor and Built-In VMID
        34. 5.5.1.34 Flash Memory
        35. 5.5.1.35 RAM
        36. 5.5.1.36 JTAG and Spy-Bi-Wire Interface
        37. 5.5.1.37 JTAG Fuse
      2. 5.5.2 MSP430 Core Operation
        1. 5.5.2.1 Description
        2. 5.5.2.2 Accessible MSP430 Pins
        3. 5.5.2.3 MSP430 Port Functions and Programming Options
        4. 5.5.2.4 Operating Modes
        5. 5.5.2.5 MSP430x2xx User's Guide
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Active Shutter 3D Glasses
        1. 6.2.1.1 Design Requirements
        2. 6.2.1.2 Detailed Design Procedure
          1. 6.2.1.2.1 Boost Converter Application Information
            1. 6.2.1.2.1.1 Setting Boost Output Voltage
            2. 6.2.1.2.1.2 Boost Inductor Selection
            3. 6.2.1.2.1.3 Boost Capacitor Selection
          2. 6.2.1.2.2 Bypassing Default Push-Button SWITCH Functionality
          3. 6.2.1.2.3 MSP430 Programming
            1. 6.2.1.2.3.1 Code To Setup Power Functions
        3. 6.2.1.3 Application Curves
  7. 7  Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Community Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Layout

8.1 Layout Guidelines

The layout is an important step in the design process. Proper function of the device demands careful attention to the PCB layout. Care must be taken in board layout to get the specified performance. If the layout is not carefully done, the regulators may show poor performance including stability issues as well as EMI problems. It is critical to provide a low impedance ground path. Therefore, use wide and short traces for the main current paths. The input capacitors must be placed as close as possible to the IC pins as well as the inductor and output capacitor.

Keep the common path to the ground pins which return the small signal components and the high current of the output capacitors as short as possible in order to avoid ground noise.

8.2 Layout Example

TPS65835 BST_Layout.gif Figure 8-1 Boost Layout