SLVSAF6A June   2011  – January 2016 TPS65835

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Block Diagram
  2. 2 Revision History
  3. 3 Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Functions
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Power-On Hours (POH)
    4. 4.4 Recommended Operating Conditions
    5. 4.5 Thermal Information
    6. 4.6 Electrical Characteristics
    7. 4.7 Quiescent Current
    8. 4.8 Typical Characteristics
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 System Operation
        1. 5.3.1.1 System Power Up
        2. 5.3.1.2 System Operation Using Push Button Switch
        3. 5.3.1.3 System Operation Using Slider Switch
      2. 5.3.2 Linear Charger Operation
        1. 5.3.2.1 Battery and TS Detection
        2. 5.3.2.2 Battery Charging
          1. 5.3.2.2.1 Pre-charge
          2. 5.3.2.2.2 Charge Termination
          3. 5.3.2.2.3 Recharge
          4. 5.3.2.2.4 Charge Timers
        3. 5.3.2.3 Charger Status (nCHG_STAT Pin)
      3. 5.3.3 LDO Operation
        1. 5.3.3.1 LDO Internal Current Limit
      4. 5.3.4 Boost Converter Operation
        1. 5.3.4.1 Boost Thermal Shutdown
        2. 5.3.4.2 Boost Load Disconnect
      5. 5.3.5 Full H-Bridge Analog Switches
        1. 5.3.5.1 H-Bridge Switch Control
      6. 5.3.6 Power Management Core Control
        1. 5.3.6.1 SLEEP / Power Control Pin Function
        2. 5.3.6.2 COMP Pin Functionality
        3. 5.3.6.3 SW_SEL Pin Functionality
        4. 5.3.6.4 SWITCH Pin
        5. 5.3.6.5 Slider Switch Behavior
        6. 5.3.6.6 Push-Button Switch Behavior
    4. 5.4 Device Functional Modes
      1. 5.4.1 SLEEP State
      2. 5.4.2 NORMAL Operating Mode
    5. 5.5 MSP430 CORE
      1. 5.5.1 MSP430 Electrical Characteristics
        1. 5.5.1.1  MSP430 Recommended Operating Conditions
        2. 5.5.1.2  Active Mode Supply Current Into VCC Excluding External Current
        3. 5.5.1.3  Typical Characteristics, Active Mode Supply Current (Into VCC)
        4. 5.5.1.4  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
        5. 5.5.1.5  Typical Characteristics, Low-Power Mode Supply Currents
        6. 5.5.1.6  Schmitt-Trigger Inputs, Ports Px
        7. 5.5.1.7  Leakage Current, Ports Px
        8. 5.5.1.8  Outputs, Ports Px
        9. 5.5.1.9  Output Frequency, Ports Px
        10. 5.5.1.10 Typical Characteristics, Outputs
        11. 5.5.1.11 Pin-Oscillator Frequency - Ports Px
        12. 5.5.1.12 Typical Characteristics, Pin-Oscillator Frequency
        13. 5.5.1.13 POR/Brownout Reset (BOR)
        14. 5.5.1.14 Typical Characteristics, POR/Brownout Reset (BOR)
        15. 5.5.1.15 DCO Frequency
        16. 5.5.1.16 Calibrated DCO Frequencies, Tolerance
        17. 5.5.1.17 Wake-Up From Lower-Power Modes (LPM3/4)
        18. 5.5.1.18 Typical Characteristics, DCO Clock Wake-Up Time From LPM3/4
        19. 5.5.1.19 Crystal Oscillator, XT1, Low-Frequency Mode
        20. 5.5.1.20 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        21. 5.5.1.21 Timer_A
        22. 5.5.1.22 USCI (UART Mode)
        23. 5.5.1.23 USCI (SPI Master Mode)
        24. 5.5.1.24 USCI (SPI Slave Mode)
        25. 5.5.1.25 USCI (I2C Mode)
        26. 5.5.1.26 Comparator_A+
        27. 5.5.1.27 Typical Characteristics - Comparator_A+
        28. 5.5.1.28 10-Bit ADC, Power Supply and Input Range Conditions
        29. 5.5.1.29 10-Bit ADC, Built-In Voltage Reference
        30. 5.5.1.30 10-Bit ADC, External Reference
        31. 5.5.1.31 10-Bit ADC, Timing Parameters
        32. 5.5.1.32 10-Bit ADC, Linearity Parameters
        33. 5.5.1.33 10-Bit ADC, Temperature Sensor and Built-In VMID
        34. 5.5.1.34 Flash Memory
        35. 5.5.1.35 RAM
        36. 5.5.1.36 JTAG and Spy-Bi-Wire Interface
        37. 5.5.1.37 JTAG Fuse
      2. 5.5.2 MSP430 Core Operation
        1. 5.5.2.1 Description
        2. 5.5.2.2 Accessible MSP430 Pins
        3. 5.5.2.3 MSP430 Port Functions and Programming Options
        4. 5.5.2.4 Operating Modes
        5. 5.5.2.5 MSP430x2xx User's Guide
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Active Shutter 3D Glasses
        1. 6.2.1.1 Design Requirements
        2. 6.2.1.2 Detailed Design Procedure
          1. 6.2.1.2.1 Boost Converter Application Information
            1. 6.2.1.2.1.1 Setting Boost Output Voltage
            2. 6.2.1.2.1.2 Boost Inductor Selection
            3. 6.2.1.2.1.3 Boost Capacitor Selection
          2. 6.2.1.2.2 Bypassing Default Push-Button SWITCH Functionality
          3. 6.2.1.2.3 MSP430 Programming
            1. 6.2.1.2.3.1 Code To Setup Power Functions
        3. 6.2.1.3 Application Curves
  7. 7  Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Community Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Terminal Configuration and Functions

3.1 Pin Diagram

TPS65835 TPS65835_Pinout.gif
A. Pins 10 and 40 = N/C. No internal connection; connect to main system ground.
Figure 3-1 40-Pin RKP VQFN (Top View)

3.2 Pin Functions

Table 3-1 Pin Functions

PIN I/O DESCRIPTION
NO. NAME
POWER MANAGEMENT CORE (PMIC)
4 DGND - PMIC Digital Ground(2)
5 LCLP O H-Bridge Output for Left LC Shutter, Positive Terminal
6 LCLN O H-Bridge Output for Left LC Shutter, Negative Terminal
7 LCRP O H-Bridge Output for Right LC Shutter, Positive Terminal
8 LCRN O H-Bridge Output for Right LC Shutter, Negative Terminal
11 BST_OUT O Boost Output
12 BST_SW I Boost Switch Node
14 PGNDBST — PMIC Boost Power Ground(2)
15 BST_FB I Boost Feedback Node
18 ISET I/O Fast-Charge Current Setting Resistor
19 TS I Pin for 10-kΩ NTC Thermistor Connection
FLOAT IF THERMISTOR / TS FUNCTION IS NOT USED
22 BAT I/O Charger Power Stage Output and Battery Voltage Sense Input
23 SYS O Output Terminal to System
26 VIN I AC or USB Adapter Input
27 VLDO O LDO Output
28 VLDO_SET I Sets LDO Output Voltage (see Table 5-2)
29 AGND — PMIC Analog Ground(2)
33 SWITCH I Switch Input for Device Power On/Off
35 SW_SEL I Selects Type of Switch Connected to SWITCH Pin (see Table 5-6)
36 PSDA I/O I2C Data Pin (only used for TI debug and test)
GROUND PIN IN APPLICATION
37 PSCL I/O I2C Clock Pin (only used for TI debug and test)
GROUND PIN IN APPLICATION
38 nCHG_STAT O Open-drain Output, Charger Status Indication
CONNECT TO GROUND IF FUNCTION IS NOT USED
MSP430 MICROCONTROLLER
1 P2.1/
TA1.1		 I/O General-purpose digital I/O pin
Timer1_A, capture: CCI1A input, compare: Out1 output
2 P2.2/
TA1.1		 I/O General-purpose digital I/O pin
Timer1_A, capture: CCI1B input, compare: Out1 output
3 P3.3/
TA1.2		 I/O General-purpose digital I/O pin
Timer1_A, compare: Out2 output
9 P3.5/
TA0.1		 I/O General-purpose digital I/O pin
Timer0_A, compare: Out0 output
13 P1.6/
TA0.1/
A6/
CA6/
UCB0SOMI/
UCB0SCL/
TDI/TCLK		 I/O General-purpose digital I/O pin
Timer0_A, compare: Out1 output
ADC10 analog input A6
Comparator_A+, CA6 input
USCI_B0 slave out/master in SPI mode
USCI_B0 SCL I2C clock in I2C mode
JTAG test data input or test clock input during programming and test
16 P1.7/
A7/
CA7/
CAOUT/
UCB0SIMO/
UCB0SDA/
TDO/TDI		 I/O General-purpose digital I/O pin
ADC10 analog input A7
Comparator_A+, CA7 input
Comparator_A+, output
USCI_B0 slave in/master out in SPI mode
USCI_B0 SDA I2C data in I2C mode
JTAG test data output terminal or test data input during programming and test(3)
17 nRST/
NMI/
SBWTDIO		 I/O Reset
Nonmaskable interrupt input
Spy-Bi-Wire test data input/output during programming and test
20 TEST/
SBWTCK		 I Selects test mode for JTAG pins on Port 1. The device protection fuse is connected to TEST.
Spy-Bi-Wire test clock input during programming and test
21 P2.7/
XOUT		 I/O General-purpose digital I/O pin
Output terminal of crystal oscillator(1))
24 P2.6/
XIN/
TA0.1		 I/O General-purpose digital I/O pin
XIN, Input terminal of crystal oscillator
TA0.1, Timer0_A, compare: Out1 output
25 DVSS — MSP430 Ground reference(2)
30 P1.1/
TA0.0/
UCA0RXD/
UCA0SOMI/
A1/
CA1		 I/O General-purpose digital I/O pin
Timer0_A, capture: CCI0A input, compare: Out0 output
USCI_A0 receive data input in UART mode
USCI_A0 slave data out/master in SPI mode
ADC10 analog input A1
Comparator_A+, CA1 input
31 P1.2/
TA0.1/
UCA0TXD/
UCA0SIMO/
A2/
CA2		 I/O General-purpose digital I/O pin
Timer0_A, capture: CCI1A input, compare: Out1 output
USCI_A0 transmit data output in UART mode
USCI_A0 slave data in/master out in SPI mode
ADC10 analog input A2
Comparator_A+, CA2 input
32 P1.3/
ADC10CLK/
A3
VREF-/VEREF-/
CA3/
CAOUT		 I/O General-purpose digital I/O pin
ADC10, conversion clock output
ADC10 analog input A3
ADC10 negative reference voltage
Comparator_A+, CA3 input
Comparator_A+, output
34 P1.4/
SMCLK/
UCB0STE
UCA0CLK/
A4
VREF+/VEREF+/
CA4
TCK		 I/O General-purpose digital I/O pin
SMCLK signal output
USCI_B0 slave transmit enable
USCI_A0 clock input/output
ADC10 analog input A4
ADC10 positive reference voltage
Comparator_A+, CA4 input
JTAG test clock, input terminal for device programming and test
39 P1.5/
TA0.0/
UCB0CLK/
UCA0STE/
A5/
CA5/
TMS		 I/O General-purpose digital I/O pin
Timer0_A, compare: Out0 output
USCI_B0 clock input/output
USCI_A0 slave transmit enable
ADC10 analog input A5
Comparator_A+, CA5 input
JTAG test mode select, input terminal for device programming and test
MISCELLANEOUS AND PACKAGE
10, 40 N/C — All N/C pins are not connected internally (package to die). They should be connected to the main system ground.
41 Thermal PAD — There is an internal electrical connection between the exposed thermal pad and the AGND ground pin of the device. The thermal pad must be connected to the same potential as the AGND pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the device. AGND pin must be connected to ground at all times.
(1) If P2.7 is used as an input, excess current will flow until P2SEL.7 is cleared. This is due to the oscillator output driver connection to this pad after reset.
(2) MSP430 ground and grounds for PMIC (Power Management Core) are connected internally.
(3) TDO or TDI is selected via JTAG instruction.