SLIS165G December   2014  – February 2019 TPS659037

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Simplified Block Diagram
  2. 2 Revision History
  3. 3 Pin Configuration and Functions
    1.     Pin Functions
  4. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics: Latch Up Rating
    6. 4.6  Electrical Characteristics: LDO Regulator
    7. 4.7  Electrical Characteristics: Dual-Phase (SMPS12 and SMPS45) and Triple-Phase (SMPS123 and SMPS457) Regulators
    8. 4.8  Electrical Characteristics: Stand-Alone Regulators (SMPS3, SMPS6, SMPS7, SMPS8, and SMPS9)
    9. 4.9  Electrical Characteristics: Reference Generator (Bandgap)
    10. 4.10 Electrical Characteristics: 16-MHz Crystal Oscillator, 32-kHz RC Oscillator, and Output Buffers
    11. 4.11 Electrical Characteristics: DC-DC Clock Sync
    12. 4.12 Electrical Characteristics: 12-Bit Sigma-Delta ADC
    13. 4.13 Electrical Characteristics: Thermal Monitoring and Shutdown
    14. 4.14 Electrical Characteristics: System Control Threshold
    15. 4.15 Electrical Characteristics: Current Consumption
    16. 4.16 Electrical Characteristics: Digital Input Signal Parameters
    17. 4.17 Electrical Characteristics: Digital Output Signal Parameters
    18. 4.18 Electrical Characteristics: I/O Pullup and Pulldown
    19. 4.19 I2C Interface Timing Requirements
    20. 4.20 SPI Timing Requirements
    21. 4.21 Typical Characteristics
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1  Power Management
      2. 5.3.2  Power Resources (Step-Down and Step-Up SMPS Regulators, LDOs)
        1. 5.3.2.1 Step-Down Regulators
          1. 5.3.2.1.1 Sync Clock Functionality
          2. 5.3.2.1.2 Output Voltage and Mode Selection
          3. 5.3.2.1.3 Current Monitoring and Short Circuit Detection
          4. 5.3.2.1.4 POWERGOOD
          5. 5.3.2.1.5 DVS-Capable Regulators
          6. 5.3.2.1.6 Non DVS-Capable Regulators
          7. 5.3.2.1.7 Step-Down Converters SMPS12 and SMPS123
            1.         a. Dual-Phase SMPS and Stand-Alone SMPS
            2.         b. Triple Phase SMPS
          8. 5.3.2.1.8 Step-Down Converter SMPS45 and SMPS457
          9. 5.3.2.1.9 Step-Down Converters SMPS3, SMPS6, SMPS7, SMPS8, and SMPS9
        2. 5.3.2.2 LDOs – Low Dropout Regulators
          1. 5.3.2.2.1 LDOVANA
          2. 5.3.2.2.2 LDOVRTC
          3. 5.3.2.2.3 LDO Bypass (LDO9)
          4. 5.3.2.2.4 LDOUSB
          5. 5.3.2.2.5 Other LDOs
      3. 5.3.3  Long-Press Key Detection
      4. 5.3.4  RTC
        1. 5.3.4.1 General Description
        2. 5.3.4.2 Time Calendar Registers
          1. 5.3.4.2.1 TC Registers Read Access
          2. 5.3.4.2.2 TC Registers Write Access
        3. 5.3.4.3 RTC Alarm
        4. 5.3.4.4 RTC Interrupts
        5. 5.3.4.5 RTC 32-kHz Oscillator Drift Compensation
      5. 5.3.5  GPADC – 12-Bit Sigma-Delta ADC
        1. 5.3.5.1 Asynchronous Conversion Request (SW)
        2. 5.3.5.2 Periodic Conversion Request (AUTO)
        3. 5.3.5.3 Calibration
      6. 5.3.6  General-Purpose I/Os (GPIO Pins)
        1. 5.3.6.1 REGEN Output
      7. 5.3.7  Thermal Monitoring
        1. 5.3.7.1 Hot-Die Function (HD)
        2. 5.3.7.2 Thermal Shutdown (TS)
        3. 5.3.7.3 Temperature Monitoring With External NTC Resistor or Diode
      8. 5.3.8  Interrupts
      9. 5.3.9  Control Interfaces
        1. 5.3.9.1 I2C Interfaces
          1. 5.3.9.1.1 I2C Implementation
          2. 5.3.9.1.2 F/S Mode Protocol
          3. 5.3.9.1.3 HS Mode Protocol
        2. 5.3.9.2 Serial-Peripheral Interface (SPI)
          1. 5.3.9.2.1 SPI Modes
          2. 5.3.9.2.2 SPI Protocol
      10. 5.3.10 Device Identification
    4. 5.4 Device Functional Modes
      1. 5.4.1  Embedded Power Controller
      2. 5.4.2  State Transition Requests
        1. 5.4.2.1 ON Requests
        2. 5.4.2.2 OFF Requests
        3. 5.4.2.3 SLEEP and WAKE Requests
      3. 5.4.3  Power Sequences
      4. 5.4.4  Startup Timing and RESET_OUT Generation
      5. 5.4.5  Power On Acknowledge
        1. 5.4.5.1 POWERHOLD Mode
        2. 5.4.5.2 AUTODEVON Mode
      6. 5.4.6  BOOT Configuration
        1. 5.4.6.1 Boot Pin Selection
      7. 5.4.7  Reset Levels
      8. 5.4.8  Warm Reset
      9. 5.4.9  RESET_IN
      10. 5.4.10 Watchdog Timer (WDT)
      11. 5.4.11 System Voltage Monitoring
        1. 5.4.11.1 Generating a POR
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1  Recommended External Components
        2. 6.2.2.2  SMPS Input Capacitors
        3. 6.2.2.3  SMPS Output Capacitors
        4. 6.2.2.4  SMPS Inductors
        5. 6.2.2.5  LDO Input Capacitors
        6. 6.2.2.6  LDO Output Capacitors
        7. 6.2.2.7  VCC1
          1. 6.2.2.7.1 Meeting the Power Down Sequence
          2. 6.2.2.7.2 Maintaining Sufficient Input Voltage
        8. 6.2.2.8  VIO_IN
        9. 6.2.2.9  16-MHz Crystal
        10. 6.2.2.10 GPADC
      3. 6.2.3 Application Curves
  7. 7 Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Community Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2.2.1 Recommended External Components

Table 6-2 Recommended External Components for Commercial Usage

REFERENCE COMPONENTS COMPONENT(1) MANUFACTURER PART NUMBER VALUE EIA SIZE CODE SIZE (mm)
INPUT POWER SUPPLIES EXTERNAL COMPONENTS
C7, C8 VSYS (VCC1) tank capacitor(2) Murata GRM188R60J106ME84 10 µF, 6V3 0603 1.6 × 0.8 × 0.8
C6 Decoupling capacitor Murata GRM155R61C104KA88 100 nF, 6V3 0402 1 × 0.5 × 0.5
CRYSTAL OSCILLATOR EXTERNAL COMPONENTS
Y1 Crystal Epson FA-238 16.384 MHz - 3.2 × 2.5 × 0.6
TXC 7V-16.384MAAE-T 16.384 MHz - 3.2 × 2.5 × 0.8
C21, C22 Crystal decoupling Murata GRM1555C1H100JA01 10 pF, 50V 0402 1 × 0.5 × 0.5
C18 Crystal supply decoupling Murata GRM155R60J225ME15 2.2 µF, 6V3 0402 1 × 0.5 × 0.5
TDK C1005X5R0J225M 2.2 µF, 6V3 0402 1 × 0.5 × 0.5
BANDGAP EXTERNAL COMPONENTS
C9 Capacitor Murata GRM155R61C104KA88 100 nF, 6V3 0402 1 × 0.5 × 0.5
SMPS EXTERNAL COMPONENTS
C10, C12, C14, C19, C23, C26, C27, C43, C45 Input capacitor Murata GRM155R60J475ME47 4.7 µF, 6V3 0402 1 × 0.5 × 0.5
C11, C13, C16, C20, C24, C25, C28, C42, C44 Output Capacitance for all SMPS Murata GRM21BR60J476ME15 47 µF, 6V3 0805 2 × 1.25 × 1.25
L2, L3, L4, L6, L7, L8, L9, L10, L11 Inductor (BUCK) TOKO DFE252010C-1RON 1 µH 2520 2.5 × 2 × 1
Vishay IHLP1616ABER1R0M11 1 µH 4 × 4.4 × 1.2
LDO EXTERNAL COMPONENTS
C1, C2, C3, C4, C5 Input capacitor Murata GRM155R60J225ME15 2.2 µF, 6V3 0402 1 × 0.5 × 0.5
TDK C1005X5R0J225M 2.2 µF, 6V3 0402 1 × 0.5 × 0.5
C29, C30, C31, C32, C33, C34, C37, C40, C41 Output capacitor Murata GRM155R60J225ME15 2.2 µF, 6V3 0402 1 × 0.5 × 0.5
TDK C1005X5R0J225M 2.2 µF, 6V3 0402 1 × 0.5 × 0.5
VBUS EXTERNAL COMPONENTS
C17 VBUS decoupling capacitor Murata GRM188R71C104KA01 100 nF 16 V 0603 1.6 × 0.8 × 0.8
Murata GRM155R61C104KA88 100 nF 16 V 0402 1 × 0.5 × 0.5
(1) Component minimum and maximum tolerance values are specified in the electrical parameters section of each IP.
(2) The tank capacitors filter the VSYS/VCC1 input voltage of the LDO and SMPS core architectures.