SWCS095L August   2013  – February 2019 TPS659038-Q1 , TPS659039-Q1

PRODUCTION DATA.  

  1. 1 Device Summary
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Simplified Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
  4. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions
      1.      Pin Functions
    2. 4.2 Device Ball Mapping – 13 × 13 nFBGA, 169 Balls, 0,8-mm Pitch
    3. 4.3 Signal Descriptions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Latch Up Rating
    6. 5.6  Electrical Characteristics: LDO Regulator
    7. 5.7  Electrical Characteristics: Dual-Phase (SMPS12 and SMPS45) and Triple-Phase (SMPS123 and SMPS457) Regulators
    8. 5.8  Electrical Characteristics: Stand-Alone Regulators (SMPS3, SMPS6, SMPS7, SMPS8, and SMPS9)
    9. 5.9  Electrical Characteristics: Reference Generator (Bandgap)
    10. 5.10 Electrical Characteristics: 16-MHz Crystal Oscillator, 32-kHz RC Oscillator, and Output Buffers
    11. 5.11 Electrical Characteristics: DC-DC Clock Sync
    12. 5.12 Electrical Characteristics: 12-Bit Sigma-Delta ADC
    13. 5.13 Electrical Characteristics: Thermal Monitoring and Shutdown
    14. 5.14 Electrical Characteristics: System Control Thresholds
    15. 5.15 Electrical Characteristics: Current Consumption
    16. 5.16 Electrical Characteristics: Digital Input Signal Parameters
    17. 5.17 Electrical Characteristics: Digital Output Signal Parameters
    18. 5.18 Electrical Characteristics: I/O Pullup and Pulldown Resistance
    19. 5.19 I2C Interface Timing Requirements
    20. 5.20 SPI Timing Requirements
    21. 5.21 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1  Power Management
      2. 6.3.2  Power Resources (Step-Down and Step-Up SMPS Regulators, LDOs)
        1. 6.3.2.1 Step-Down Regulators
          1. 6.3.2.1.1 Sync Clock Functionality
          2. 6.3.2.1.2 Output Voltage and Mode Selection
          3. 6.3.2.1.3 Current Monitoring and Short Circuit Detection
          4. 6.3.2.1.4 POWERGOOD
          5. 6.3.2.1.5 DVS-Capable Regulators
          6. 6.3.2.1.6 Non DVS-Capable Regulators
          7. 6.3.2.1.7 Step-Down Converters SMPS12 and SMPS123
            1.         a. Dual-Phase SMPS and Stand-Alone SMPS
            2.         b. Triple Phase SMPS
          8. 6.3.2.1.8 Step-Down Converter SMPS45 and SMPS457
          9. 6.3.2.1.9 Step-Down Converters SMPS3, SMPS6, SMPS7, SMPS8, and SMPS9
        2. 6.3.2.2 LDOs – Low Dropout Regulators
          1. 6.3.2.2.1 LDOVANA
          2. 6.3.2.2.2 LDOVRTC
          3. 6.3.2.2.3 LDO Bypass (LDO9)
          4. 6.3.2.2.4 LDOUSB
          5. 6.3.2.2.5 Other LDOs
      3. 6.3.3  Long-Press Key Detection
      4. 6.3.4  RTC
        1. 6.3.4.1 General Description
        2. 6.3.4.2 Time Calendar Registers
          1. 6.3.4.2.1 TC Registers Read Access
          2. 6.3.4.2.2 TC Registers Write Access
        3. 6.3.4.3 RTC Alarm
        4. 6.3.4.4 RTC Interrupts
        5. 6.3.4.5 RTC 32-kHz Oscillator Drift Compensation
      5. 6.3.5  GPADC – 12-Bit Sigma-Delta ADC
        1. 6.3.5.1 Asynchronous Conversion Request (SW)
        2. 6.3.5.2 Periodic Conversion Request (AUTO)
        3. 6.3.5.3 Calibration
      6. 6.3.6  General-Purpose I/Os (GPIO Terminals)
        1. 6.3.6.1 REGEN Output
      7. 6.3.7  Thermal Monitoring
        1. 6.3.7.1 Hot-Die Function (HD)
        2. 6.3.7.2 Thermal Shutdown (TS)
        3. 6.3.7.3 Temperature Monitoring With External NTC Resistor or Diode
      8. 6.3.8  Interrupts
      9. 6.3.9  Control Interfaces
        1. 6.3.9.1 I2C Interfaces
          1. 6.3.9.1.1 I2C Implementation
          2. 6.3.9.1.2 F/S Mode Protocol
          3. 6.3.9.1.3 HS Mode Protocol
        2. 6.3.9.2 SPI Interface
          1. 6.3.9.2.1 SPI Modes
          2. 6.3.9.2.2 SPI Protocol
      10. 6.3.10 Device Identification
    4. 6.4 Device Functional Modes
      1. 6.4.1  Embedded Power Controller
      2. 6.4.2  State Transition Requests
        1. 6.4.2.1 ON Requests
        2. 6.4.2.2 OFF Requests
        3. 6.4.2.3 SLEEP and WAKE Requests
      3. 6.4.3  Power Sequences
      4. 6.4.4  Start Up Timing and RESET_OUT Generation
      5. 6.4.5  Power On Acknowledge
        1. 6.4.5.1 POWERHOLD Mode
        2. 6.4.5.2 AUTODEVON Mode
      6. 6.4.6  BOOT Configuration
        1. 6.4.6.1 Boot Terminal Selection
      7. 6.4.7  Reset Levels
      8. 6.4.8  Warm Reset
      9. 6.4.9  RESET_IN
      10. 6.4.10 Watchdog Timer (WDT)
      11. 6.4.11 System Voltage Monitoring
        1. 6.4.11.1 Generating a POR
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Recommended External Components
        2. 7.2.2.2  SMPS Input Capacitors
        3. 7.2.2.3  SMPS Output Capacitors
        4. 7.2.2.4  SMPS Inductors
        5. 7.2.2.5  LDO Input Capacitors
        6. 7.2.2.6  LDO Output Capacitors
        7. 7.2.2.7  VCC1
          1. 7.2.2.7.1 Meeting the Power Down Sequence
          2. 7.2.2.7.2 Maintaining Sufficient Input Voltage
        8. 7.2.2.8  VIO_IN
        9. 7.2.2.9  16-MHz Crystal
        10. 7.2.2.10 GPADC
      3. 7.2.3 Application Curves
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Related Links
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Community Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Materials Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZWS|169
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Electrical Characteristics: Stand-Alone Regulators (SMPS3, SMPS6, SMPS7, SMPS8, and SMPS9)

Over operating free-air temperature range, typical values are at TA = 27°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input capacitance (C11, C14, C15, C16, C17) 4.7 µF
Output capacitance (C20, C23, C24, C25, C26)(1) SMPSx operation 33 47 57 µF
CESR Filtering capacitor DC ESR 1 ≤ MHz f ≤ 10 MHz 2 10 mΩ
Output filter inductance (L3, L6, L7, L8, L9) SMPSx_SW 0.7 1 1.3 µH
DCRL Filter inductor DC resistance 50 100 mΩ
VI(SMPSx) Input voltage range, SMPSx_IN VSYS (VCC1) 3.135 5.25 V
VOSMPSx Output voltage, programmable, SMPSx RANGE = 0 (value for RANGE must not be changed when SMPS is active). In Eco-mode the output voltage value is fixed (defined before Eco-mode is enabled). 0.7 1.65 V
RANGE = 1 (value for RANGE must not be changed when SMPS is active). In Eco-mode the output voltage value is fixed (defined before Eco-mode is enabled). 1 3.3
Step size, 0.7 V ≤ VO ≤ 1.65 V 10 mV
Step size, 1 V ≤ VO ≤ 3.3 V 20
DC output voltage accuracy, includes voltage references, DC load/line regulation, process and temperature Eco-mode –3% 4%
PWM mode –1% 2%
Ripple Max load, VI = 3.8 V, VO = 1.2 V,
ESRCO = 2 mΩ, measure with 20-MHz LPF		 8 mVPP
DCLNR DC line regulation TA = –40°C to 85°C 0.1 %/V
DCLDR DC load regulation TA = –40°C to 85°C 0.1 %/A
TLDSR Transient load step response SMPS3, SMPS6, SMPS7 , IOUT = 0.5 to 500 mA,
tr = tf = 100 ns, CO = 47 µF , L = 1 µH		 3%
SMPS8, SMPS9, IO = 0.5 to 500 mA,
tr = tf = 1 µs, CO = 47 µF , L = 1 µH		 3%
IOmax Rated output current, SMPS3 VI ≥ 3 V
Advance thermal design is required to avoid thermal shutdown		 3 A
VI < 3 V
Advance thermal design is required to avoid thermal shutdown		 2
Rated output current, SMPS6 When OTP programmed with BOOST_CURRENT = 0
Advance thermal design is required to avoid thermal shutdown		 2
When OTP programmed with BOOST_CURRENT = 1
Advance thermal design is required to avoid thermal shutdown		 3
Rated output current, SMPS7 Advance thermal design is required to avoid thermal shutdown 2
Rated output current, SMPS8, SMPS9 Advance thermal design is required to avoid thermal shutdown 1
Maximum output current, Eco-mode 5 mA
ILIM HS FET High-side MOSFET forward current limit SMPS3 and SMPS6 in 3-A mode 3.7 4 A
SMPS6 in 2-A mode, SMPS7 2.7 3
SMPS8, SMPS9 1.7 2
ILIM LS FET Low-side MOSFET forward current limit SMPS3 and SMPS6 in 3-A mode 3.7 A
SMPS6 in 2-A mode, SMPS7 2.7
SMPS8, SMPS9 1.7
Low-side MOSFET negative current limit SMPS3 and SMPS6 in 3-A mode 0.6 A
SMPS6 in 2-A mode, SMPS7 0.6
SMPS8, SMPS9 0.6
rDS(on) HS FET N-channel MOSFET on-resistance (high-side FET) SMPS3 115 mΩ
SMPS6, SMPS7 115
SMPS8, SMPS9 180
rDS(on) LS FET N-channel MOSFET on-resistance (low-side FET) SMPS3 30 mΩ
SMPS6, SMPS7 30
SMPS8, SMPS9 79
tstart Time from enable to start of the ramp 150 µs
tramp Time from enable to 80% of VO CO < 57 µF, no load 400 1000 µs
Overshoot during turn-on 5%
Output voltage slew rate Fixed TSTEP, only available on SMPS6, SMPS8 2.5 mV/µs
RDIS Pulldown discharge resistance at SMPSx output SMPSx_FDBK, SMPS turned off 300 Ω
SMPSx_SW, SMPS turned off 9 22
IQ(off) Quiescent current – OFF mode IL = 0 mA 0.1 1 µA
IQ(on) Quiescent current – ON mode - SMPS3, SMPS6, SMPS7 Eco-mode, device not switching, VO < 1.8 V 12 15 µA
Eco-mode, device not switching, VO ≥ 1.8 V 13.5 23
FORCED_PWM mode, IL = 0 mA,
VI = 3.8 V, device switching		 11 mA
IQ(on) Quiescent current – ON mode - SMPS8, SMPS9 Eco-mode, device not switching, VO < 1.8 V 10.5 15 µA
Eco-mode, device not switching, VO ≥ 1.8 V 12 23
FORCED_PWM mode, IL = 0 mA,
VI = 3.8 V, device switching		 7 mA
VSMPSPG Powergood threshold SMPS output voltage rising, referenced to programmed output voltage –7.5%
SMPS output voltage falling, referenced to programmed output voltage –12.5%
IL_AVG_COMP Powergood: GPADC monitoring SMPS IL_AVG_COMP_rising IOmax – 20% IOmax IOmax + 20%
IL_AVG_COMP_falling, 3-A phase IL_AVG_COMP_rising – 5%
IL_AVG_COMP_falling, 2-A phase IL_AVG_COMP_rising – 8%
(1) Additional information about how this parameter is specified is located in the Section 7.2.2 section.