SWCS095L August 2013 – February 2019 TPS659038-Q1 , TPS659039-Q1
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TPS659038-Q1
TPS659039-Q1 |
UNIT | |
---|---|---|---|
ZWS (NFBGA) | |||
169 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 36.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 6.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 18.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 18.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |