SWCS071C August   2012  – August 2017

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Default Settings
  4. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Characteristics
    5. 5.5  Electrical Characteristics - DCDC1, DCDC2, and DCDC3
    6. 5.6  Electrical Characteristics - DCDC4
    7. 5.7  Electrical Characteristics - LDOs
    8. 5.8  Electrical Characteristics - Digital Inputs, Digital Outputs
    9. 5.9  Electrical Characteristics - VMON Voltage Monitor, VDDIO, Undervoltage Lockout (UVLO), and LDOAO
    10. 5.10 Electrical Characteristics - Load Switch
    11. 5.11 Electrical Characteristics - LED Drivers
    12. 5.12 Electrical Characteristics - Thermal Monitoring and Shutdown
    13. 5.13 Electrical Characteristics - 32-kHz RC Clock
    14. 5.14 SPI Interface Timing Requirements
    15. 5.15 I2C Interface Timing Requirements
    16. 5.16 Typical Characteristics
  6. 6 Parameter Measurement Information
    1. 6.1 I2C Timing Diagrams
    2. 6.2 SPI Timing Diagram
  7. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Linear Regulators
      1. 7.3.1 Low Quiescent Current Mode (Eco-mode™)
      2. 7.3.2 Output Discharge
      3. 7.3.3 Thermal Shutdown
      4. 7.3.4 LDO Enable
      5. 7.3.5 LDO Voltage Range
      6. 7.3.6 LDO Power Good Comparator
    4. 7.4  Step-Down Converters
      1. 7.4.1 PWM/PFM Mode
      2. 7.4.2 Low Quiescent Current Mode
      3. 7.4.3 Output Voltage Monitoring
      4. 7.4.4 Output Discharge
      5. 7.4.5 Thermal Shutdown
      6. 7.4.6 Step-Down Converter ENABLE
      7. 7.4.7 Step-Down converter SOFT START
    5. 7.5  GPIOs
    6. 7.6  Power State Machine
    7. 7.7  Transition Conditions
    8. 7.8  Implementation of Internal Power-Up and Power-Down Sequencing
    9. 7.9  EN1, EN2, EN3, EN4, Resources Control
    10. 7.10 SLEEP State Control
    11. 7.11 Registers SET_OFF, KEEP_ON and DEF_VOLT Used in SLEEP State; CONFIG2 = 1
    12. 7.12 Registers SET_OFF, KEEP_ON and DEF_VOLT Used for Resources Assigned to an External Enable Pin; CONFIG2 = 1
    13. 7.13 Registers SET_OFF, KEEP_ON and DEF_VOLT for Resources Assigned to Pins PWR_REQ, CLK_REQ1 and CLK_REQ2; CONFIG2 = 0
    14. 7.14 Voltage Scaling Interface Control Using _OP and _AVS Registers with I2C or SPI Interface
    15. 7.15 Voltage Scaling Using the VCON Decoder on Pins VCON_PWM and VCON_CLK
    16. 7.16 Configuration Pins CONFIG1, CONFIG2 and DEF_SPI_I2C-GPIO
    17. 7.17 VDDIO Voltage for Push-Pull Output Stages
    18. 7.18 Digital Signal Summary
    19. 7.19 TPS659121 On/Off Operation With E450, E500
      1. 7.19.1 TPS659121 Power Up From Battery or 5-V USB Supply; CONFIG1=LOW
      2. 7.19.2 TPS659121 Power Up From 3.3-V Host Supply; CONFIG1=LOW
    20. 7.20 TPS659122 On/Off Operation for CONFIG1=HIGH
      1. 7.20.1 TPS659122 Power Up With CONFIG1=HIGH
      2. 7.20.2 TPS659121, TPS659122 Power-Off Sequence With CONFIG1=HIGH
    21. 7.21 TPS659122 On/Off Operation for CONFIG1=LOW
      1. 7.21.1 TPS659122 Power Up With CONFIG1=LOW
      2. 7.21.2 TPS659122 Power-Off Sequence With CONFIG1=LOW
    22. 7.22 Interfaces
    23. 7.23 Serial Peripheral Interface
    24. 7.24 I2C Interface
      1. 7.24.1 I2C Implementation
      2. 7.24.2 F/S-Mode Protocol
      3. 7.24.3 H/S-Mode Protocol
    25. 7.25 Thermal Monitoring and Shutdown
    26. 7.26 Load Switch
    27. 7.27 LED Driver
    28. 7.28 Memory
      1. 7.28.1 Register Format
      2. 7.28.2 Register Descriptions
        1. 7.28.2.1 DCDC Registers
          1. 7.28.2.1.1  DCDC1_CTRL (00h)
          2. 7.28.2.1.2  DCDC2_CTRL (01h)
          3. 7.28.2.1.3  DCDC3_CTRL (02h)
          4. 7.28.2.1.4  DCDC4_CTRL (03h)
          5. 7.28.2.1.5  DCDC1_OP (04h)
          6. 7.28.2.1.6  DCDC1_AVS (05h)
          7. 7.28.2.1.7  DCDC1_LIMIT (06h)
          8. 7.28.2.1.8  DCDC2_OP (07h)
          9. 7.28.2.1.9  DCDC2_AVS (08h)
          10. 7.28.2.1.10 DCDC2_LIMIT (09h)
          11. 7.28.2.1.11 DCDC3_OP (0Ah)
          12. 7.28.2.1.12 DCDC3_AVS (0Bh)
          13. 7.28.2.1.13 DCDC3_LIMIT (0Ch)
          14. 7.28.2.1.14 DCDC4_OP (0Dh)
          15. 7.28.2.1.15 DCDC4_AVS (0Eh)
          16. 7.28.2.1.16 DCDC4_LIMIT (0Fh)
          17. 7.28.2.1.17 VDCDCx Range Settings
          18. 7.28.2.1.18 DCDCx Voltage Settings
        2. 7.28.2.2 LDO Registers
          1. 7.28.2.2.1  LDO1_OP (10h)
          2. 7.28.2.2.2  LDO1_AVS (11h)
          3. 7.28.2.2.3  LDO1_LIMIT (12h)
          4. 7.28.2.2.4  LDO2_OP (13h)
          5. 7.28.2.2.5  LDO2_AVS (14h)
          6. 7.28.2.2.6  LDO2_LIMIT (15h)
          7. 7.28.2.2.7  LDO3_OP (16h)
          8. 7.28.2.2.8  LDO3_AVS (17h)
          9. 7.28.2.2.9  LDO3_LIMIT (18h)
          10. 7.28.2.2.10 LDO4_OP (19h)
          11. 7.28.2.2.11 LDO4_AVS (1Ah)
          12. 7.28.2.2.12 LDO4_LIMIT (1Bh)
          13. 7.28.2.2.13 LDO5 (1Ch)
          14. 7.28.2.2.14 LDO6 (1Dh)
          15. 7.28.2.2.15 LDO7 (1Eh)
          16. 7.28.2.2.16 LDO8 (1Fh)
          17. 7.28.2.2.17 LDO9 (20h)
          18. 7.28.2.2.18 LDO10 (21h)
        3. 7.28.2.3 LDO Voltage Settings
        4. 7.28.2.4 DEVCTRL Registers
          1. 7.28.2.4.1  THRM_REG (22h)
          2. 7.28.2.4.2  CLK32KOUT (23h)
          3. 7.28.2.4.3  DEVCTRL (24h)
          4. 7.28.2.4.4  DEVCTRL2 (25h)
          5. 7.28.2.4.5  I2C_SPI_CFG (26h)
          6. 7.28.2.4.6  KEEP_ON1 (27h)
          7. 7.28.2.4.7  KEEP_ON2 (28h)
          8. 7.28.2.4.8  SET_OFF1 (29h)
          9. 7.28.2.4.9  SET_OFF2 (2Ah)
          10. 7.28.2.4.10 DEF_VOLT (2Bh)
          11. 7.28.2.4.11 LDO Sleep Mode Behavior
          12. 7.28.2.4.12 DEF_VOLT_MAPPING (2Ch)
          13. 7.28.2.4.13 DISCHARGE1 (2Dh)
          14. 7.28.2.4.14 DISCHARGE2 (2Eh)
          15. 7.28.2.4.15 EN1_SET1 (2Fh)
          16. 7.28.2.4.16 EN1_SET2 (30h)
          17. 7.28.2.4.17 EN2_SET1 (31h)
          18. 7.28.2.4.18 EN2_SET2 (32h)
          19. 7.28.2.4.19 EN3_SET1 (33h)
          20. 7.28.2.4.20 EN3_SET2 (34h)
          21. 7.28.2.4.21 EN4_SET1 (35h)
          22. 7.28.2.4.22 EN4_SET2 (36h)
          23. 7.28.2.4.23 PGOOD (37h)
          24. 7.28.2.4.24 PGOOD2 (38h)
          25. 7.28.2.4.25 INT_STS (39h)
          26. 7.28.2.4.26 INT_MSK (3Ah)
          27. 7.28.2.4.27 INT_STS2 (3Bh)
          28. 7.28.2.4.28 INT_MSK2 (3Ch)
          29. 7.28.2.4.29 INT_STS3 (3Dh)
          30. 7.28.2.4.30 INT_MSK3 (3Eh)
          31. 7.28.2.4.31 INT_STS4 (3Fh)
          32. 7.28.2.4.32 INT_MSK4 (40h)
          33. 7.28.2.4.33 GPIO1 (41h)
          34. 7.28.2.4.34 GPIO2 (42h)
          35. 7.28.2.4.35 GPIO3 (43h)
          36. 7.28.2.4.36 GPIO4 (44h)
          37. 7.28.2.4.37 GPIO5 (45h)
          38. 7.28.2.4.38 VMON (46h)
          39. 7.28.2.4.39 LEDA_CTRL1 (47h)
          40. 7.28.2.4.40 LEDA_CTRL2 (48h)
          41. 7.28.2.4.41 LEDA_CTRL3 (49h)
          42. 7.28.2.4.42 LEDA_CTRL4 (4Ah)
          43. 7.28.2.4.43 LEDA_CTRL5 (4Bh)
          44. 7.28.2.4.44 LEDA_CTRL6 (4Ch)
          45. 7.28.2.4.45 LEDA_CTRL7 (4Dh)
          46. 7.28.2.4.46 LEDA_CTRL8 (4Eh)
          47. 7.28.2.4.47 LEDB_CTRL1 (4Fh)
          48. 7.28.2.4.48 LEDB_CTRL2 (50h)
          49. 7.28.2.4.49 LEDB_CTRL3 (51h)
          50. 7.28.2.4.50 LEDB_CTRL4 (52h)
          51. 7.28.2.4.51 LEDB_CTRL5 (53h)
          52. 7.28.2.4.52 LEDB_CTRL6 (54h)
          53. 7.28.2.4.53 LEDB_CTRL7 (55h)
          54. 7.28.2.4.54 LEDB_CTRL8 (56h)
          55. 7.28.2.4.55 LEDC_CTRL1 (57h)
          56. 7.28.2.4.56 LEDC_CTRL2 (58h)
          57. 7.28.2.4.57 LEDC_CTRL3 (59h)
          58. 7.28.2.4.58 LED_CTRL4 (5Ah)
          59. 7.28.2.4.59 LEDC_CTRL5 (5Bh)
          60. 7.28.2.4.60 LEDC_CTRL6 (5Ch)
          61. 7.28.2.4.61 LEDC_CTRL7 (5Dh)
          62. 7.28.2.4.62 LEDC_CTRL8 (5Eh)
          63. 7.28.2.4.63 LED_RAMP_UP_TIME (5Fh)
          64. 7.28.2.4.64 LED_RAMP_DOWN_TIME (60h)
          65. 7.28.2.4.65 LED_SEQ_EN (61h)
          66. 7.28.2.4.66 LEDx DC Current
          67. 7.28.2.4.67 LOADSWITCH (62h)
          68. 7.28.2.4.68 SPARE (63h)
          69. 7.28.2.4.69 VERNUM (64h)
  8. 8 Applications, Implementation, and Layout
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DC-DC Converters
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Filter Design (Inductor and Output Capacitor)
            1. 8.2.1.2.1.1 Inductor Selection
            2. 8.2.1.2.1.2 Output Capacitor Selection
            3. 8.2.1.2.1.3 Input Capacitor Selection / Input Voltage
            4. 8.2.1.2.1.4 Output Capacitor Table
            5. 8.2.1.2.1.5 Voltage Change on DCDC1 to DCDC4
        3. 8.2.1.3 Application Curves
        4. 8.2.1.4 Layout
          1. 8.2.1.4.1 Layout Guidelines
          2. 8.2.1.4.2 Layout Example
    3. 8.3 Power Supply Recommendations
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
      2. 9.1.2 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Community Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Device and Documentation Support

9.1 Device Support

9.1.1 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of the TPS659121 and TPS659122 device applications:

Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software needed to support any TPS659121 and TPS659122 device application.

Hardware Development Tools: Extended Development System (XDS™) Emulator

For a complete listing of development-support tools for the TPS659121 and TPS659122 platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

9.1.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, TPS659121 and TPS659122).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

X and P devices are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

For orderable part numbers of TPS659121 and TPS659122 devices in the YFF package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

9.2 Documentation Support

9.2.1 Related Documentation

For related documentation see the following:
Texas Instruments, TPS65912xEVM-081 User's Guide

9.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

9.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

9.5 Trademarks

Eco-mode, Code Composer Studio, DSP/BIOS, XDS, E2E are trademarks of Texas Instruments.

NXP is a registered trademark of NXP Semiconductors.

All other trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

9.7 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.