SLVSD09C March   2016  – February 2019 TPS65916

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Diagram
  2. 2Revision History
  3. 3Pin Configuration and Functions
    1. 3.1 Pin Attributes
      1.      Pin Attributes
    2. 3.2 Signal Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics — LDO Regulators
    6. 4.6  Electrical Characteristics — SMPS1&2 in Dual-Phase Configuration
    7. 4.7  Electrical Characteristics — SMPS1, SMPS2, SMPS3, SMPS4, and SMPS5 Stand-Alone Regulators
    8. 4.8  Electrical Characteristics — Reference Generator (Bandgap)
    9. 4.9  Electrical Characteristics — 32-kHz RC Oscillators and SYNCCLKOUT Output Buffers
    10. 4.10 Electrical Characteristics — 12-Bit Sigma-Delta ADC
    11. 4.11 Electrical Characteristics — Thermal Monitoring and Shutdown
    12. 4.12 Electrical Characteristics — System Control Thresholds
    13. 4.13 Electrical Characteristics — Current Consumption
    14. 4.14 Electrical Characteristics — Digital Input Signal Parameters
    15. 4.15 Electrical Characteristics — Digital Output Signal Parameters
    16. 4.16 I/O Pullup and Pulldown Characteristics
    17. 4.17 Electrical Characteristics — I2C Interface
    18. 4.18 Timing Requirements — I2C Interface
    19. 4.19 Timing Requirements — SPI
    20. 4.20 Switching Characteristics — LDO Regulators
    21. 4.21 Switching Characteristics — SMPS1&2 in Dual-Phase Configuration
    22. 4.22 Switching Characteristics — SMPS1, SMPS2, SMPS3, SMPS4, and SMPS5 Stand-Alone Regulators
    23. 4.23 Switching Characteristics — Reference Generator (Bandgap)
    24. 4.24 Switching Characteristics — PLL for SMPS Clock Generation
    25. 4.25 Switching Characteristics — 32-kHz RC Oscillators and SYNCCLKOUT Output Buffers
    26. 4.26 Switching Characteristics — 12-Bit Sigma-Delta ADC
    27. 4.27 Typical Characteristics
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Device State Machine
      1. 5.3.1  Embedded Power Controller
      2. 5.3.2  State Transition Requests
        1. 5.3.2.1 ON Requests
        2. 5.3.2.2 OFF Requests
        3. 5.3.2.3 SLEEP and WAKE Requests
      3. 5.3.3  Power Sequences
      4. 5.3.4  Device Power Up Timing
      5. 5.3.5  Power-On Acknowledge
        1. 5.3.5.1 POWERHOLD Mode
        2. 5.3.5.2 AUTODEVON Mode
      6. 5.3.6  BOOT Configuration
        1. 5.3.6.1 Boot Pin Usage and Connection
      7. 5.3.7  Reset Levels
      8. 5.3.8  INT
      9. 5.3.9  Warm Reset
      10. 5.3.10 RESET_IN
    4. 5.4  Power Resources (Step-Down and Step-Up SMPS Regulators, LDOs)
      1. 5.4.1 Step-Down Regulators
        1. 5.4.1.1 Output Voltage and Mode Selection
        2. 5.4.1.2 Clock Generation for SMPS
        3. 5.4.1.3 Current Monitoring and Short Circuit Detection
        4. 5.4.1.4 POWERGOOD
        5. 5.4.1.5 DVS-Capable Regulators
          1. 5.4.1.5.1 Non DVS-Capable Regulators
        6. 5.4.1.6 Step-Down Converters SMPS1, SMPS2 or SMPS1&2
        7. 5.4.1.7 Step-Down Converters SMPS3, SMPS4, and SMPS5
      2. 5.4.2 Low Dropout Regulators (LDOs)
        1. 5.4.2.1 LDOVANA
        2. 5.4.2.2 LDOVRTC
        3. 5.4.2.3 LDO1 and LDO2
        4. 5.4.2.4 Low-Noise LDO (LDO5)
        5. 5.4.2.5 Other LDOs
    5. 5.5  SMPS and LDO Input Supply Connections
    6. 5.6  First Supply Detection
    7. 5.7  Long-Press Key Detection
    8. 5.8  12-Bit Sigma-Delta General-Purpose ADC (GPADC)
      1. 5.8.1 Asynchronous Conversion Request (SW)
      2. 5.8.2 Periodic Conversion (AUTO)
      3. 5.8.3 Calibration
    9. 5.9  General-Purpose I/Os (GPIO Pins)
    10. 5.10 Thermal Monitoring
      1. 5.10.1 Hot-Die Function (HD)
      2. 5.10.2 Thermal Shutdown
    11. 5.11 Interrupts
    12. 5.12 Control Interfaces
      1. 5.12.1 I2C Interfaces
        1. 5.12.1.1 I2C Implementation
        2. 5.12.1.2 F/S Mode Protocol
        3. 5.12.1.3 HS Mode Protocol
      2. 5.12.2 Serial Peripheral Interface (SPI)
        1. 5.12.2.1 SPI Modes
        2. 5.12.2.2 SPI Protocol
    13. 5.13 OTP Configuration Memory
    14. 5.14 Watchdog Timer (WDT)
    15. 5.15 System Voltage Monitoring
    16. 5.16 Register Map
      1. 5.16.1 Functional Register Mapping
    17. 5.17 Device Identification
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 SMPS Input Capacitors
        2. 6.2.2.2 SMPS Output Capacitors
        3. 6.2.2.3 SMPS Inductors
        4. 6.2.2.4 LDO Input Capacitors
        5. 6.2.2.5 LDO Output Capacitors
        6. 6.2.2.6 VCCA
          1. 6.2.2.6.1 Meeting the Power-Down Sequence
          2. 6.2.2.6.2 Maintaining Sufficient Input Voltage
        7. 6.2.2.7 VIO_IN
        8. 6.2.2.8 GPADC
      3. 6.2.3 Application Curves
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
      2. 6.3.2 Layout Example
    4. 6.4 Power Supply Coupling and Bulk Capacitors
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Third-Party Products Disclaimer
      2. 7.1.2 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Receiving Notification of Documentation Updates
    4. 7.4 Community Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.18 Timing Requirements — I2C Interface

Over operating free-air temperature range, typical values are at TA = 27°C (unless otherwise noted). (1)(2)(3)(4)
MIN MAX UNIT
f(SCL) SCL clock frequency Standard mode 100 kHz
Fast mode 400 kHz
High-speed mode (write operation), CB – 100 pF max 3.4 MHz
High-speed mode (read operation), CB – 100 pF max 3.4 MHz
High-speed mode (write operation), CB – 400 pF max 1.7 MHz
High-speed mode (read operation), CB – 400 pF max 1.7 MHz
tBUF Bus free time between a stop (P) and start (S) condition Standard mode 4.7 μs
Fast mode 1.3 μs
tHD(STA) Hold time (Repeated) start
condition		 Standard mode 4 μs
Fast mode 600 ns
High-speed mode 160 ns
tLOW Low period of the SCL clock Standard mode 4.7 μs
Fast mode 1.3 μs
High-speed mode, CB – 100 pF max 160 ns
High-speed mode, CB – 400 pF max 320 ns
tHIGH High period of the SCL clock Standard mode 4 μs
Fast mode 600 ns
High-speed mode, CB – 100 pF max 60 ns
High-speed mode, CB – 400 pF max 120 ns
tSU(STA) Setup time for a repeated start (Sr) condition Standard mode 4.7 μs
Fast mode 600 ns
High-speed mode 160 ns
tSU(DAT) Data setup time Standard mode 250 ns
Fast mode 100 ns
High-speed mode 10 ns
tHD(DAT) Data hold time Standard mode 0 3.45 μs
Fast mode 0 0.9 μs
High-speed mode, CB – 100 pF max 0 70 ns
High-speed mode, CB – 400 pF max 0 150 ns
tRCL Rise time of the SCL signal Standard mode 20 + 0.1 CB 1000 ns
Fast mode 20 + 0.1 CB 300 ns
High-speed mode, CB – 100 pF max 10 40 ns
High-speed mode, CB – 400 pF max 20 80 ns
tRCL1 Rise time of the SCL signal after a Repeated Start condition and after an acknowledge bit Standard mode 20 + 0.1 CB 1000 ns
Fast mode 20 + 0.1 CB 300 ns
High-speed mode, CB – 100 pF max 10 80 ns
High-speed mode, CB – 400 pF max 20 160 ns
tFCL Fall time of the SCL signal Standard mode 20 + 0.1 CB 300 ns
Fast mode 20 + 0.1 CB 300 ns
High-speed mode, CB – 100 pF max 10 40 ns
High-speed mode, CB – 400 pF max 20 80 ns
tRDA Rise time of the SDA signal Standard mode 20 + 0.1 CB 1000 ns
Fast mode 20 + 0.1 CB 300 ns
High-speed mode, CB – 100 pF max 10 80 ns
High-speed mode, CB – 400 pF max 20 160 ns
tFDA Fall time of the SDA signal Standard mode 20 + 0.1 CB 300 ns
Fast mode 20 + 0.1 CB 300 ns
High-speed mode, CB – 100 pF max 10 80 ns
High-speed mode, CB – 400 pF max 20 160 ns
tSU(STO) Setup time for a stop condition Standard mode 4 μs
Fast mode 600 ns
High-speed mode 160 ns
(1) Specified by design. Not tested in production.
(2) All values referred to VIHmin and VIHmax levels.
(3) For bus line loads CB between 100 and 400 pF, the timing parameters must be linearly interpolated.
(4) A device must internally provide a data hold time to bridge the undefined part between VIH and VIL of the falling edge of the SCLH signal. An input circuit with a threshold as low as possible for the falling edge of the SCLH signal minimizes this hold time.