SLVSDM6C October   2016  – August 2021 TPS65983B

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Supply Requirements and Characteristics
    6. 7.6  Power Supervisor Characteristics
    7. 7.7  Power Consumption Characteristics
    8. 7.8  Cable Detection Characteristics
    9. 7.9  USB-PD Baseband Signal Requirements and Characteristics
    10. 7.10 USB-PD TX Driver Voltage Adjustment Parameter (1)
    11. 7.11 Port Power Switch Characteristics
    12. 7.12 Port Data Multiplexer Switching and Timing Characteristics
    13. 7.13 Port Data Multiplexer Clamp Characteristics
    14. 7.14 Port Data Multiplexer SBU Detection Requirements
    15. 7.15 Port Data Multiplexer Signal Monitoring Pullup and Pulldown Characteristics
    16. 7.16 Port Data Multiplexer USB Endpoint Requirements and Characteristics
    17. 7.17 Port Data Multiplexer BC1.2 Detection Requirements and Characteristics
    18. 7.18 Analog-to-Digital Converter (ADC) Characteristics
    19. 7.19 Input/Output (I/O) Requirements and Characteristics
    20. 7.20 I2C Slave Requirements and Characteristics
    21. 7.21 SPI Controller Characteristics
    22. 7.22 Single-Wire Debugger (SWD) Timing Requirements
    23. 7.23 BUSPOWERZ Configuration Requirements
    24. 7.24 HPD Timing Requirements and Characteristics
    25. 7.25 Thermal Shutdown Characteristics
    26. 7.26 Oscillator Requirements and Characteristics
    27. 7.27 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  USB-PD Physical Layer
        1. 9.3.1.1 USB-PD Encoding and Signaling
        2. 9.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 9.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 9.3.1.4 USB-PD BMC Transmitter
        5. 9.3.1.5 USB-PD BMC Receiver
      2. 9.3.2  Cable Plug and Orientation Detection
        1. 9.3.2.1 Configured as a DFP
        2. 9.3.2.2 Configured as a UFP
        3. 9.3.2.3 Fast Role Swap Signaling
        4. 9.3.2.4 Dead-Battery or No-Battery Support
      3. 9.3.3  Port Power Switches
        1. 9.3.3.1  5V Power Delivery
        2. 9.3.3.2  5V Power Switch as a Source
        3. 9.3.3.3  PP_5V0 Current Sense
        4. 9.3.3.4  PP_5V0 Current Limit
        5. 9.3.3.5  Internal HV Power Delivery
        6. 9.3.3.6  Internal HV Power Switch as a Source
        7. 9.3.3.7  Internal HV Power Switch as a Sink
        8. 9.3.3.8  Internal HV Power Switch Current Sense
        9. 9.3.3.9  Internal HV Power Switch Current Limit
        10. 9.3.3.10 External HV Power Delivery
        11. 9.3.3.11 External HV Power Switch as a Source with RSENSE
        12. 9.3.3.12 External HV Power Switch as a Sink with RSENSE
        13. 9.3.3.13 External HV Power Switch as a Sink without RSENSE
        14. 9.3.3.14 External Current Sense
        15. 9.3.3.15 External Current Limit
        16. 9.3.3.16 Soft Start
        17. 9.3.3.17 BUSPOWERZ
        18. 9.3.3.18 Voltage Transitions on VBUS through Port Power Switches
        19. 9.3.3.19 HV Transition to PP_RV0 Pull-Down on VBUS
        20. 9.3.3.20 VBUS Transition to VSAVE0V
        21. 9.3.3.21 C_CC1 and C_CC2 Power Configuration and Power Delivery
        22. 9.3.3.22 PP_CABLE to C_CC1 and C_CC2 Switch Architecture
        23. 9.3.3.23 PP_CABLE to C_CC1 and C_CC2 Current Limit
      4. 9.3.4  USB Type-C Port Data Multiplexer
        1. 9.3.4.1  USB Top and Bottom Ports
        2. 9.3.4.2  Multiplexer Connection Orientation
        3. 9.3.4.3  Digital Crossbar Multiplexer
        4. 9.3.4.4  SBU Crossbar Multiplexer
        5. 9.3.4.5  Signal Monitoring and Pullup and Pulldown
        6. 9.3.4.6  Port Multiplexer Clamp
        7. 9.3.4.7  USB2.0 Low-Speed Endpoint
        8. 9.3.4.8  Battery Charger (BC1.2) Detection Block
        9. 9.3.4.9  BC1.2 Data Contact Detect
        10. 9.3.4.10 BC1.2 Primary and Secondary Detection
      5. 9.3.5  Power Management
        1. 9.3.5.1 Power-On and Supervisory Functions
        2. 9.3.5.2 Supply Switch-Over
        3. 9.3.5.3 RESETZ and MRESET
      6. 9.3.6  Digital Core
      7. 9.3.7  USB-PD BMC Modem Interface
      8. 9.3.8  System Glue Logic
      9. 9.3.9  Power Reset Congrol Module (PRCM)
      10. 9.3.10 Interrupt Monitor
      11. 9.3.11 ADC Sense
      12. 9.3.12 UART
      13. 9.3.13 I2C Slave
      14. 9.3.14 SPI Controller
      15. 9.3.15 Single-Wire Debugger Interface
      16. 9.3.16 DisplayPort HPD Timers
      17. 9.3.17 ADC
        1. 9.3.17.1 ADC Divider Ratios
        2. 9.3.17.2 ADC Operating Modes
        3. 9.3.17.3 Single Channel Readout
        4. 9.3.17.4 Round Robin Automatic Readout
        5. 9.3.17.5 One Time Automatic Readout
      18. 9.3.18 I/O Buffers
        1. 9.3.18.1 IOBUF_GPIOLS and IOBUF_GPIOLSI2C
        2. 9.3.18.2 IOBUF_OD
        3. 9.3.18.3 IOBUF_UTX
        4. 9.3.18.4 IOBUF_URX
        5. 9.3.18.5 IOBUF_PORT
        6. 9.3.18.6 IOBUF_I2C
        7. 9.3.18.7 IOBUF_GPIOHSPI
        8. 9.3.18.8 IOBUF_GPIOHSSWD
      19. 9.3.19 Thermal Shutdown
      20. 9.3.20 Oscillators
    4. 9.4 Device Functional Modes
      1. 9.4.1 Boot Code
      2. 9.4.2 Initialization
      3. 9.4.3 I2C Configuration
      4. 9.4.4 Dead-Battery Condition
      5. 9.4.5 Application Code
      6. 9.4.6 Flash Memory Read
      7. 9.4.7 Invalid Flash Memory
      8. 9.4.8 UART Download
        1. 9.4.8.1 Primary TPS65983B Flash Master and Secondary Port
    5. 9.5 Programming
      1. 9.5.1 SPI Controller Interface
      2. 9.5.2 I2C Slave Interface
        1. 9.5.2.1 I2C Interface Description
        2. 9.5.2.2 I2C Clock Stretching
        3. 9.5.2.3 I2C Address Setting
        4. 9.5.2.4 Unique Address Interface
        5. 9.5.2.5 I2C Pin Address Setting
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Fully-Featured USB Type-C and PD Charger Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 External FET Path Components (PP_EXT and RSENSE)
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 TPS65983B External Flash
          2. 10.2.1.2.2 I2C (I2C), Debug Control (DEBUG_CTL), and Single-Wire De-bugger (SWD) Resistors
          3. 10.2.1.2.3 Oscillator (R_OSC) Resistor
          4. 10.2.1.2.4 VBUS Capacitor and Ferrite Bead
          5. 10.2.1.2.5 Soft Start (SS) Capacitor
          6. 10.2.1.2.6 USB Top (C_USB_T), USB Bottom (C_USB_B), and Sideband-Use (SBU) Connections
          7. 10.2.1.2.7 Port Power Switch (PP_EXT, PP_HV, PP_5V0, and PP_CABLE) Capacitors
          8. 10.2.1.2.8 Cable Connection (CCn) Capacitors and RPD_Gn Connections
          9. 10.2.1.2.9 LDO_3V3, LDO_1V8A, LDO_1V8D, LDO_BMC, VOUT_3V3, VIN_3V3, and VDDIO
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Dual-Port Notebook Application Supporting USB PD Charging and DisplayPort
        1. 10.2.2.1 Design Requirements
          1. 10.2.2.1.1 Source Power Delivery Profiles for Type-C Ports
          2. 10.2.2.1.2 Sink Power Delivery Profile for Type-C Ports
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 TPS65983B and System Controller Interaction
          2. 10.2.2.2.2 HD3SS460 Control and DisplayPort Configuration
          3. 10.2.2.2.3 9.3.2.3 DC Barrel Jack and Type-C PD Charging
          4. 10.2.2.2.4 TPS65983B Dead Battery Support Primary and Secondary Port
          5. 10.2.2.2.5 Debugging Methods
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 3.3 V Power
      1. 11.1.1 1VIN_3V3 Input Switch
      2. 11.1.2 VOUT_3V3 Output Switch
      3. 11.1.3 VBUS 3.3 V LDO
    2. 11.2 1.8 V Core Power
      1. 11.2.1 1.8 V Digital LDO
      2. 11.2.2 1.8 V Analog LDO
    3. 11.3 VDDIO
      1. 11.3.1 Recommended Supply Load Capacitance
      2. 11.3.2 Schottky for Current Surge Protection
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1  TPS65983B Recommended Footprints
        1. 12.1.1.1 Standard TPS65983B Footprint (Circular Pads)
      2. 12.1.2  Alternate TPS65983B Footprint (Oval Pads)
      3. 12.1.3  Top TPS65983B Placement and Bottom Component Placement and Layout
      4. 12.1.4  Oval Pad Footprint Layout and Placement
      5. 12.1.5  Component Placement
      6. 12.1.6  Designs Rules and Guidance
      7. 12.1.7  Routing PP_HV, PP_EXT, PP_5V0, and VBUS
      8. 12.1.8  Routing Top and Bottom Passive Components
      9. 12.1.9  Void Via Placement
      10. 12.1.10 Top Layer Routing
      11. 12.1.11 Inner Signal Layer Routing
      12. 12.1.12 Bottom Layer Routing
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-0DE146AB-CF3D-4DF2-8D69-09C916D1E1C2-low.gifFigure 6-1 ZQZ and ZBH Package 96-Pin BGA MicroStar Junior and NFBGATop View
GUID-609514AA-8AAF-449C-B7EF-1460A8583B15-low.gifFigure 6-2 Legend for Pinout Drawing
Table 6-1 Pin Functions
PIN TYPE POR
STATE		 DESCRIPTION
NAME NO.
HIGH-CURRENT POWER PINS
PP_5V0 A11, B11, C11, D11 Power NA 5-V supply for VBUS. Bypass with capacitance CPP_5V0 to GND. Tie pin to GND when unused
PP_HV A6, A7, A8, B7 Power NA HV supply for VBUS. Bypass with capacitance CPP_HV to GND. Tie pin to GND when unused
PP_CABLE H10 Power NA 5-V supply for C_CC pins. Bypass with capacitance CPP_CABLE to GND when not tied to PP_5V0. Tie pin to PP_5V0 when unused.
VBUS H11, J10, J11, K11 Power NA 5-V output from PP_5V0. Input or output from PP_HV up to 20 V. Bypass with capacitance CVBUS to GND.
LOW-CURRENT POWER PINS
VIN_3V3 H1 Power NA Supply for core circuitry and I/O. Bypass with capacitance CVIN_3V3 to GND.
VDDIO B1 Power  NA  VDD for I/O. Some I/Os are reconfigurable to be powered from VDDIO instead of LDO_3V3. When VDDIO is not used, tie pin to LDO_3V3. When not tied to LDO_3V3 and used as a supply input, bypass with capacitance CVDDIO to GND.
VOUT_3V3 H2 Power NA Output of supply switched from VIN_3V3. Bypass with capacitance COUT_3V3 to GND. Float pin when unused.
LDO_3V3 G1 Power NA Output of the VBUS to 3.3 V LDO or connected to VIN_3V3 by a switch. Main internal supply rail. Used to power external flash memory. Bypass with capacitance CLDO_3V3 to GND.
LDO_1V8A K1 Power NA Output of the 3.3 V or 1.8 V LDO for Core Analog Circuits. Bypass with capacitance CLDO_1V8A to GND.
LDO_1V8D A2 Power NA Output of the 3.3 V or 1.8 V LDO for Core Digital Circuits. Bypass with capacitance CLDO_1V8D to GND.
LDO_BMC E1 Power NA Output of the USB-PD BMC transceiver output level LDO. Bypass with capacitance CLDO_BMC to GND.
TYPE-C PORT PINS
C_CC1 L9 Analog I/O Hi-Z Output to Type-C CC or VCONN pin. Filter noise with capacitance CC_CC1 to GND.
C_CC2 L10 Analog I/O Hi-Z Output to Type-C CC or VCONN pin. Filter noise with capacitance CC_CC2 to GND.
RPD_G1 K9 Analog I/O Hi-Z Tie pin to C_CC1 when configured to receive power in dead-battery or no-power condition. Tie pin to GND otherwise.
RPD_G2 K10 Analog I/O Hi-Z Tie pin to C_CC2 when configured to receive power in dead-battery or no-power condition. Tie pin to GND otherwise.
C_USB_TP K6 Analog I/O Hi-Z Port side Top USB D+ connection to Port Multiplexer.
C_USB_TN L6 Analog I/O Hi-Z Port side Top USB D– connection to Port Multiplexer.
C_USB_BP K7 Analog I/O Hi-Z Port side Bottom USB D+ connection to Port Multiplexer.
C_USB_BN L7 Analog I/O Hi-Z Port side Bottom USB D– connection to Port Multiplexer.
C_SBU1 K8 Analog I/O Hi-Z Port side Sideband Use connection of Port Multiplexer.
C_SBU2 L8 Analog I/O Hi-Z Port side Sideband Use connection of Port Multiplexer.
PORT MULTIPLEXER PINS
SWD_DATA F4 Digital I/O Resistive Pull High SWD serial data. Float pin when unused.
SWD_CLK G4 Digital Input Resistive Pull High SWD serial clock. Float pin when unused.
UART_RX F2 Digital Input Digital Input UART serial receive data. Connect pin to another TPS65983B UART_TX to share firmware. Connect UART_RX to UART_TX when not connected to another TPS65983B and ground pin through a 100 kΩ resistance.
UART_TX E2 Digital Output UART_RX UART serial transmit data. Connect pin to another TPS65983B UART_TX to share firmware. Connect UART_RX to UART_TX when not connected to another TPS65983B.
USB_RP_P L5 Analog I/O Hi-Z System side USB2.0 high-speed connection to Port Multiplexer. Ground pin with between 1-kΩ and 5-MΩ resistance when unused.
USB_RP_N K5 Analog I/O Hi-Z System side USB2.0 high-speed connection to Port Multiplexer. Ground pin with between 1-kΩ and 5-MΩ resistance when unused.
LSX_R2P L4 Digital Input Digital Input System side low speed TX from system to port. This pin is configurable to be an input to the digital core or the crossbar multiplexer to the port. Ground pin with between 1-kΩ and 5-MΩ resistance when unused.
LSX_P2R K4 Digital Output Hi-Z System side low speed RX to system from port. This pin is configurable to be an output from the digital core or the crossbar multiplexer from the port. Float pin when unused.
AUX_P J1 Analog I/O Hi-Z System side DisplayPort connection to Port Multiplexer. Ground pin with between 1-kΩ and 5-MΩ resistance when unused.
AUX_N J2 Analog I/O Hi-Z System side DisplayPort connection to Port Multiplexer. Ground pin with between 1-kΩ and 5-MΩ resistance when unused.
EXTERNAL HV FET CONTROL/SENSE PINS AND SOFT START
SENSEP B10 Analog Input Analog Input Positive sense for external high voltage power path current sense resistance. Short pin to VBUS when unused.
SENSEN A10 Analog Input Analog Input Positive sense for external high voltage power path current sense resistance. Short pin to VBUS when unused.
HV_GATE1 B9 Analog Output Short to SENSEP External NFET gate control for high voltage power path. Float pin when unused.
HV_GATE2 A9 Analog Output Short to VBUS External NFET gate control for high voltage power path. Float pin when unused.
SS H7 Analog Output Driven Low Soft Start. Tie pin to capacitance CSS to ground.
DIGITAL CORE I/O AND CONTROL PINS
R_OSC G2 Analog I/O Hi-Z External resistance setting for oscillator accuracy. Connect R_OSC to GND through resistance RR_OSC.
GPIO0
(HD3 AMSEL)		 B2 Digital I/O Hi-Z General Purpose Digital I/O 0. Alternate mode select signal to external Super Speed multiplexer (tri-state capable with pullup and pulldown resistors). Ground pin with a 1-MΩ resistor when unused in the application.
GPIO1
(CONFIG0)		 C2 Digital I/O Hi-Z General Purpose Digital I/O 1. Must be tied high or low through a 1 kΩ pullup or pulldown resistor when used as a configuration input.
GPIO2 D10 Digital I/O Hi-Z General Purpose Digital I/O 2. Float pin if it is configured as a push-pull output in the application. Ground pin with a 1-MΩ resistor when unused in the application.
GPIO3
(HD3 EN)		 G11 Digital I/O Hi-Z General Purpose Digital I/O 3. Enable signal to external Super Speed multiplexer. Float pin if it is configured as a push-pull output in the application. Ground pin with a 1-MΩ resistor when unused in the application.
GPIO4
(HPD TXRX)		 C10 Digital I/O Hi-Z General Purpose Digital I/O 4. Configured as Hot Plug Detect (HPD) TX and/or HPD RX when DisplayPort Mode supported. Ground pin with a 1-MΩ resistor when unused in the application.
GPIO5
(HPD RX)		 E10 Digital I/O Hi-Z General Purpose Digital I/O 5. Can be configured as Hot Plug Detect (HPD) RX when DisplayPort Mode supported. Must be tied high or low through a 1 kΩ pullup or pulldown resistor when used as a configuration input. Ground pin with a 1-MΩ resistor when unused in the application.
GPIO6 G10 Digital I/O Hi-Z General Purpose Digital I/O 6. Float pin if it is configured as a push-pull output in the application. Ground pin with a 1-MΩ resistor when unused in the application.
GPIO7 D7 Digital I/O Hi-Z General Purpose Digital I/O 7. Float pin if it is configured as a push-pull output in the application. Ground pin with a 1-MΩ resistor when unused in the application.
GPIO8 H6 Digital I/O Hi-Z General Purpose Digital I/O 8. Float pin if it is configured as a push-pull output in the application. Ground pin with a 1-MΩ resistor when unused in the application.
RESETZ
(GPIO9)		 F11 Digital I/O Push-Pull Output (Low) General Purpose Digital I/O 9. Active low reset output when VOUT_3V3 is low (driven low on start-up). Float pin when unused.
BUSPOWERZ
(GPIO10)		 F10 Analog Input Input (Hi-Z) General Purpose Digital I/O 10. Sampled by ADC at boot. Tie pin to LDO_3V3 through a 100-kΩ resistor to disable PP_HV and PP_EXT power paths during dead-battery or no-battery boot conditions. Refer to the Section 9.3.3.17 table for more details.
MRESET
(GPIO11)		 E11 Digital I/O Hi-Z General Purpose Digital I/O 11. Forces RESETZ to assert. By default, this pin asserts RESETZ when pulled high. The pin can be programmed to assert RESETZ when pulled low. Ground pin with a 1-MΩ resistor when unused in the application.
DEBUG4
(GPIO12, CONFIG2)		 K3 Digital I/O Hi-Z General Purpose Digital I/O 12. Must be tied high or low through a 1-kΩ pullup or pulldown resistor when used as a configuration input.
DEBUG3
(GPIO13, CONFIG1)		 L3 Digital I/O Hi-Z General Purpose Digital I/O 13. Must be tied high or low through a 1-kΩ pullup or pulldown resistor when used as a configuration input.
DEBUG2
(GPIO14, HD3 POL)		 K2 Digital I/O Hi-Z General Purpose Digital I/O 14. Polarity signal to external Super Speed multiplexer. Float pin if it is configured as a push-pull output in the application. Ground pin with a 1-MΩ resistor when unused in the application.
DEBUG1
(GPIO15)		 L2 Digital I/O Hi-Z General Purpose Digital I/O 15. Ground pin with a 1-MΩ resistor when unused in the application.
DEBUG_CTL1
(GPIO16, I2C ADDR B4)		 E4 Digital I/O Hi-Z General Purpose Digital I/O 16. At power-up, pin state is sensed to determine bit 4 of the I2C address.
DEBUG_CTL2
(GPIO17, I2C ADDR B5)		 D5 Digital I/O Hi-Z General Purpose Digital I/O 17. At power-up, pin state is sensed to determine bit 5 of the I2C address.
HRESET D6 Digital Input Hi-Z Active high hardware reset input. Will re-load settings from external flash memory. Ground pin when HRESET functionality will not be used.
I2C_SDA1 D1 Digital I/O Digital Input I2C port 1 serial data. Open-drain output. Tie pin to LDO_3V3 or VDDIO (depending on configuration) through a 10-kΩ resistor when used or unused.
I2C_SCL1 D2 Digital I/O Digital Input I2C port 1 serial clock. Open-drain output. Tie pin to LDO_3V3 or VDDIO (depending on configuration) through a 10-kΩ resistor when used or unused.
I2C_IRQ1Z C1 Digital Output Hi-Z I2C port 1 interrupt. Active low. Implement externally as an open drain with a pullup resistance. Float pin when unused.
I2C_SDA2 A5 Digital I/O Digital Input I2C port 2 serial data. Open-drain output. Tie pin to LDO_3V3 or VDDIO (depending on configuration) through a 10-kΩ resistor when used or unused.
I2C_SCL2 B5 Digital I/O Digital Input I2C port 2 serial clock. Open-drain output. Tie pin to LDO_3V3 or VDDIO (depending on configuration) through a 10-kΩ resistor when used or unused.
I2C_IRQ2Z B6 Digital Output Hi-Z I2C port 2 interrupt. Active low. Implement externally as an open drain with a pullup resistance. Float pin when unused.
I2C_ADDR F1 Analog I/O Analog Input Sets the I2C address for both I2C ports as well as determine the controller and slave devices for memory code sharing.
SPI_CLK A3 Digital Output Digital Input SPI serial clock. Ground pin when unused
SPI_PICO B4 Digital Output Digital Input SPI serial controller output to peripheral. Ground pin when unused.
SPI_POCI A4 Digital Input Digital Input SPI serial controller input from peripheral. This pin is used during boot sequence to determine if the flash memory is valid. Refer to the Boot Code section for more details. Ground pin when unused.
SPI_CSZ B3 Digital Output Digital Input SPI chip select. Ground pin when unused.
GROUND AND NO CONNECT PINS
GND A1, B8, D8, E5, E6, E7, E8, F5, F6, F7, F8, G5, G6, G7, G8, H4, H5, H8, L1 Ground NA Ground. Connect all balls to ground plane.
NC L11 Blank NA Populated Ball that must remain unconnected.
No Ball C3, C4, C5, C6, C7, C8, C9, D3, D4, D9, E3, E9, F3, F9, G3, G9, H3, H9, J3, J4, J5, J6, J7, J8, J9 Blank NA Unpopulated ball for A1 marker and unpopulated inner ring.