SLVSFN9A
September 2020 – August 2021
TPS65988DK
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Power Supply Requirements and Characteristics
6.6
Power Consumption Characteristics
6.7
Power Switch Characteristics
6.8
Cable Detection Characteristics
6.9
USB-PD Baseband Signal Requirements and Characteristics
6.10
Thermal Shutdown Characteristics
6.11
Oscillator Characteristics
6.12
I/O Characteristics
6.13
I2C Requirements and Characteristics
6.14
SPI Controller Timing Requirements
6.15
HPD Timing Requirements
6.16
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
USB-PD Physical Layer
8.3.1.1
USB-PD Encoding and Signaling
8.3.1.2
USB-PD Bi-Phase Marked Coding
8.3.1.3
USB-PD Transmit (TX) and Receive (Rx) Masks
8.3.1.4
USB-PD BMC Transmitter
8.3.1.5
USB-PD BMC Receiver
8.3.2
Power Management
8.3.2.1
Power-On and Supervisory Functions
8.3.2.2
VBUS LDO
8.3.2.3
Supply Switch Over
8.3.3
Port Power Switches
8.3.3.1
PP_HV Power Switch
8.3.3.1.1
PP_HV Overcurrent Clamp
8.3.3.1.2
PP_HV Overcurrent Protection
8.3.3.1.3
PP_HV OVP and UVP
8.3.3.1.4
PP_HV Reverse Current Protection
8.3.3.2
Schottky for Current Surge Protection
8.3.3.3
PP_EXT Power Path Control
8.3.3.4
PP_CABLE Power Switch
8.3.3.4.1
PP_CABLE Overcurrent Protection
8.3.3.4.2
PP_CABLE Input Good Monitor
8.3.3.5
VBUS Transition to VSAFE5V
8.3.3.6
VBUS Transition to VSAFE0V
8.3.4
Cable Plug and Orientation Detection
8.3.4.1
Configured as a DFP
8.3.4.2
Configured as a UFP
8.3.4.3
Configured as a DRP
8.3.4.4
Fast Role Swap Signaling
8.3.5
Dead Battery Operation
8.3.5.1
Dead Battery Advertisement
8.3.5.2
BUSPOWER (ADCIN1)
8.3.6
ADC
8.3.7
DisplayPort HPD
8.3.8
Digital Interfaces
8.3.8.1
General GPIO
8.3.8.2
I2C
8.3.8.3
SPI
8.3.9
Digital Core
8.3.10
I2C Interfaces
8.3.10.1
I2C Interface Description
8.3.10.2
I2C Clock Stretching
8.3.10.3
I2C Address Setting
8.3.10.4
Unique Address Interface
8.3.10.5
I2C Pin Address Setting (ADCIN2)
8.3.11
SPI Controller Interface
8.3.12
Thermal Shutdown
8.3.13
Oscillators
8.4
Device Functional Modes
8.4.1
Boot
8.4.2
Power States
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
USB4 Device Application with Host Charging
9.2.1.1
Design Requirements
9.2.1.1.1
Power Supply Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
USB Power Delivery Source Capabilities
9.2.1.2.2
USB Power Delivery Sink Capabilities
9.2.1.2.3
Supported Data Modes
9.2.1.2.4
USB4 Hub Controller & PD Controller I2C Communication
9.2.1.2.5
Dock Management Controller & PD Controller I2C Communication
9.2.1.2.6
SPI Flash Options
10
Power Supply Recommendations
10.1
3.3-V Power
10.1.1
VIN_3V3 Input Switch
10.1.2
VBUS 3.3-V LDO
10.2
1.8-V Power
10.3
Recommended Supply Load Capacitance
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
11.3
Stack-up and Design Rules
11.4
Main Component Placement
11.5
Super Speed Type-C Connectors
11.6
Capacitor Placement
11.7
CC1/2 Capacitors & ADCIN1/2 Resistors
11.8
CC and SBU Protection Placement
11.9
CC Routing
11.10
DRAIN1 and DRAIN2 Pad Pours
11.11
VBUS Routing
11.12
Completed Layout
11.13
Power Dissipation
12
Device and Documentation Support
12.1
Device Support
12.1.1
Firmware Warranty Disclaimer
12.2
Documentation Support
12.2.1
Related Documentation
12.3
Support Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RSH|56
MPQF191C
Thermal pad, mechanical data (Package|Pins)
RSH|56
QFND570A
Orderable Information
slvsfn9a_oa
slvsfn9a_pm
8
Detailed Description