SLVSEW8B August   2019  – December 2019 TPS66020 , TPS66021

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Function Table
      1.      TPS6602x Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Supply Load Capacitance
    5. 6.5  Thermal Information
    6. 6.6  PP5V Power Switch Characteristics
    7. 6.7  PPHV Power Switch Characteristics
    8. 6.8  Power Path Supervisory
    9. 6.9  VBUS LDO Characteristics
    10. 6.10 Thermal Shutdown Characteristics
    11. 6.11 Input-output (I/O) Characteristics
    12. 6.12 Power Consumption Characteristics
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 5-V Source (PP5V Power Path)
        1. 8.3.1.1 PP5V Current Limit
        2. 8.3.1.2 PP5V Reverse Current Protection (RCP)
      2. 8.3.2 20-V Sink (PPHV Power Path)
        1. 8.3.2.1 PPHV Soft Start
        2. 8.3.2.2 PPHV Reverse Current Protection (RCP)
      3. 8.3.3 Overtemperature Protection
      4. 8.3.4 VBUS Overvoltage Protection (OVP)
      5. 8.3.5 Power Management and Supervisory
        1. 8.3.5.1 Supply Connections
        2. 8.3.5.2 Power Up Sequences
          1. 8.3.5.2.1 Normal Power Up
          2. 8.3.5.2.2 Dead Battery Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 State Transitions
        1. 8.4.1.1 DISABLED State
        2. 8.4.1.2 SRC 1.5-A State
        3. 8.4.1.3 SRC 3-A State
        4. 8.4.1.4 SNK State
        5. 8.4.1.5 FRS (Fast Role Swap) State
      2. 8.4.2 SRC FAULT State
      3. 8.4.3 SNK FAULT State
      4. 8.4.4 Device Functional Mode Summary
      5. 8.4.5 Enabling the PP5V Source Path
      6. 8.4.6 Enabling the PPHV Sink Path
      7. 8.4.7 Fast Role Swap (FRS)
        1. 8.4.7.1 Overview
        2. 8.4.7.2 Fast Role Swap Use Cases
        3. 8.4.7.3 Fast Role Swap Sequence
      8. 8.4.8 Faults
        1. 8.4.8.1 Fault Types
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 External Current Reference Resistor (RIREF)
        2. 9.2.2.2 External VLDO Capacitor (CVLDO)
        3. 9.2.2.3 PP5V Power Path Capacitance
        4. 9.2.2.4 PPHV, VBUS Power Path Capacitance
        5. 9.2.2.5 VBUS TVS Protection (Optional)
        6. 9.2.2.6 VBUS Schottky Diode Protection (Optional)
        7. 9.2.2.7 VBUS Overvoltage Protection (Optional)
        8. 9.2.2.8 Dead Battery Support
        9. 9.2.2.9 Fast Role Swap (FRS) (Optional)
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER MIN MAX UNIT
Terminal voltage range (2) PP5V, EN0(4), EN1(4), FLT, VIN, VLDO –0.3 6.2 V
Terminal voltage range (2) OVP –0.3 VBUS V
Terminal voltage range (2) VBUS,  power path disabled (stand off voltage) –0.5 32 V
Terminal voltage range (2) VBUS,  power path enabled(3) –0.5 26 V
Terminal voltage range (2) PPHV –0.3 26 V
Terminal voltage range (2) IREF –0.3 4.5 V
Terminal positive source current IREF Internally limited mA
Terminal positive source current VLDO sourced from VBUS VLDO Internally limited mA
VLDO sourced from VIN 50 mA
Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network GND. All GND pins must be connected directly to the GND plane of the board.
(3) For VBUS, a TVS protection with a break down voltage falling between the Recommended and Absolute maximum ratings is recommended, such as the TVS2200.
(4) EN0 and EN1 each have an internal voltage clamp and may be driven above the absolute maximium voltage rating up to EN_CLAMP maximum specification if current is limited to less than 100µA.