SLVSCE6C December 2013 – June 2018 TPS709-Q1
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TPS709-Q1 | UNIT | ||
---|---|---|---|---|
DBV (SOT-23) | DRV (WSON) | |||
5 PINS | 6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 210.9 | 73.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 127.4 | 97.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 39.4 | 42.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 16.8 | 2.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 38.4 | 42.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 12.8 | °C/W |