SBVS186H March   2012  – July 2021 TPS709

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Undervoltage Lockout (UVLO)
      4. 7.3.4 Reverse-Current Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor
      2. 8.1.2 Transient Response
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Protection
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at ambient temperature (TA) = –40°C to +85°C, VIN = VOUT(typ) + 1 V or 2.7 V (whichever is greater), IOUT = 1 mA, VEN = 2 V, and CIN = COUT = 2.2-μF ceramic (unless otherwise noted); typical values are at TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 2.7 30 V
VOUT Output voltage range 1.2 6.5 V
VOUT DC output accuracy VOUT < 3.3 V –2% 2%
VOUT ≥ 3.3 V –1% 1%
ΔVOUT Line regulation (VOUT(nom) + 1 V, 2.7 V) ≤ VIN ≤ 30 V 3 10 mV
Load regulation VIN = VOUT(typ) + 1.5 V or 3 V (whichever is greater), 100 µA ≤ IOUT ≤ 150 mA 20 50
VDO Dropout voltage(1)(3) TPS70933, IOUT = 50 mA 295 650 mV
TPS70933, IOUT = 150 mA 960 1400
TPS70950, IOUT = 50 mA 245 500
TPS70950, IOUT = 150 mA 690 1200
TPS70965, IOUT = 50 mA 180 500
TPS70965, IOUT = 150 mA 460 1000
I(CL) Output current limit(4) VOUT = 0.9 × VOUT(nom) 200 320 500 mA
IGND Ground pin current IOUT = 0 mA, VOUT ≤ 3.3 V 1.3 2.05 µA
IOUT = 0 mA, VOUT > 3.3 V 1.4 2.25
IOUT = 150 mA 350
ISHUTDOWN Shutdown current VEN ≤ 0.4 V, VIN = 2.7 V 150 nA
PSRR Power-supply rejection ratio f = 10 Hz 80 dB
f = 100 Hz 62
f = 1 kHz 52
Vn Output noise voltage BW = 10 Hz to 100 kHz, IOUT = 10 mA,
VIN = 2.7 V, VOUT = 1.2 V		 190 μVRMS
tSTR Start-up time(2) VOUT(nom) ≤ 3.3 V 200 600 µs
VOUT(nom) > 3.3 V 500 1500
VEN(HI) Enable pin high-level input voltage Device enabled 0.9 V
VEN(LOW) Enable pin low-level input voltage Device disabled 0 0.4 V
IEN EN pin current EN = 1.0 V, VIN = 5.5 V 300 nA
I(REV) Reverse current
(flowing out of IN pin)		 VOUT = 3 V, VIN = VEN = 0 V 10 nA
Reverse current
(flowing into OUT pin)		 VOUT = 3 V, VIN = VEN = 0 V 100
tSD Thermal shutdown temperature Shutdown, temperature increasing 158 °C
Reset, temperature decreasing 140
(1) VDO is measured with VIN = 0.98 × VOUT(nom).
(2) Start-up time = time from EN assertion to 0.95 × VOUT(nom) and load = 47 Ω.
(3) Dropout is only valid when VOUT ≥ 2.8 V because of the minimum input voltage limits.
(4) Measured with VIN = VOUT + 3 V for VOUT ≤ 2.5 V. Measured with VIN = VOUT + 2.5 V for VOUT > 2.5 V.