SBVS186H March   2012  – July 2021 TPS709

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Undervoltage Lockout (UVLO)
      4. 7.3.4 Reverse-Current Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor
      2. 8.1.2 Transient Response
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Protection
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-CC984DF7-6E20-42F7-8B4E-D14266ED89EB-low.gifFigure 5-1 TPS709: DBV Package,5-Pin SOT-23,Top View
GUID-6E259FF9-7F89-4779-B68D-33A674FA579F-low.gifFigure 5-3 TPS709B: DBV Package,5-Pin SOT-23,Top View
GUID-389F2B5F-29D8-44DF-9060-945DD23FCBB0-low.gifFigure 5-2 TPS709A: DBV Package,5-Pin SOT-23,Top View
GUID-65890D32-38FF-41AC-8537-D74DB7D78C45-low.gifFigure 5-4 DRV Package,6-Pin WSON,Top View
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME DRV DBV
TPS709 TPS709 TPS709A TPS709B
EN 4 3 5 5 I Enable pin. Drive this pin high to enable the device. Drive this pin low to put the device into low current shutdown. This pin can be left floating to enable the device. The maximum voltage must remain below 6.5 V.
GND 3 2 2 1 — Ground
IN 6 1 3 2 I Unregulated input to the device
NC 2, 5 4 4 4 — No internal connection
OUT 1 5 1 3 O Regulated output voltage. Connect a small 2.2-µF or greater ceramic capacitor from this pin to ground to assure stability.
Thermal pad — — — — The thermal pad is electrically connected to the GND node. Connect this pad to the GND plane for improved thermal performance.