SBVS034N September   2003  – December 2015 TPS731

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Output Noise
      2. 7.3.2 Internal Current Limit
      3. 7.3.3 Enable Pin and Shutdown
      4. 7.3.4 Reverse Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation With 1.7 V ≤ VIN ≤ 5.5 V and VEN ≥ 1.7 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Dropout Voltage
        3. 8.2.2.3 Transient Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Voltage VIN –0.3 6 V
VEN –0.3 6
VOUT –0.3 5.5
VNR, VFB –0.3 6
Peak output current IOUT Internally limited
Output short-circuit duration Indefinite
Continuous total power dissipation PDISS See Power Dissipation
Temperature Junction, TJ –55 150 °C
Storage, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input supply voltage range 1.7 5.5 V
IOUT Output current 0 150 mA
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS731xx UNIT
DBV (SOT-23)
5 PINS
RθJA Junction-to-ambient thermal resistance 207.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 124.2
RθJB Junction-to-board thermal resistance 35
ψJT Junction-to-top characterization parameter 13.5
ψJB Junction-to-board characterization parameter 34.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(nom) + 0.5 V(1), IOUT = 10 mA, VEN = 1.7 V, and
COUT = 0.1 μF, unless otherwise noted. Typical values are at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range(1) 1.7 5.5 V
VFB Internal reference (TPS73101) TJ = 25°C 1.198 1.20 1.210 V
VOUT Output voltage range (TPS73101)(2) VFB 5.5 – VDO V
Accuracy(1) (3) Nominal TJ = 25°C –0.5% 0.5%
VIN, IOUT, and T VOUT + 0.5 V ≤ VIN ≤ 5.5 V;
10 mA ≤ IOUT ≤ 150 mA		 –1% ±0.5% 1%
ΔVOUT(ΔVIN) Line regulation(1) VOUT(nom) + 0.5 V ≤ VIN ≤ 5.5 V 0.01 %/V
ΔVOUT(ΔIOUT) Load regulation 1 mA ≤ IOUT ≤ 150 mA 0.002 %/mA
10 mA ≤ IOUT ≤ 150 mA 0.0005
VDO Dropout voltage(4)
(VIN = VOUT (nom) – 0.1V)		 IOUT = 150 mA 30 100 mV
ZO(DO) Output impedance in dropout 1.7 V ≤ VIN ≤ VOUT + VDO 0.25 Ω
ICL Output current limit VOUT = 0.9 × VOUT(nom) 150 360 500 mA
ISC Short-circuit current VOUT = 0 V 200 mA
IREV Reverse leakage current(5) (–IIN) VEN ≤ 0.5 V, 0V ≤ VIN ≤ VOUT 0.1 10 μA
IGND GND pin current IOUT = 10 mA (IQ) 400 550 μA
IOUT = 150 mA 550 750
ISHDN Shutdown current (IGND) VEN ≤ 0.5 V, VOUT ≤ VIN ≤ 5.5 V,
–40°C ≤ TJ ≤ 100°C		 0.02 1 μA
IFB FB pin current (TPS73101) 0.1 0.3 μA
PSRR Power-supply rejection ratio
(ripple rejection)		 f = 100 Hz, IOUT = 150 mA 58 dB
f = 10 kHz, IOUT = 150 mA 37
Vn Output noise voltage
BW = 10Hz - 100kHz		 COUT = 10 μF, No CNR 27 × VOUT μVRMS
COUT = 10 μF, CNR = 0.01 μF 8.5 × VOUT
tSTR Startup time VOUT = 3 V, RL = 30 Ω
COUT = 1 μF, CNR = 0.01 μF		 600 μs
VEN(high) EN pin high (enabled) 1.7 VIN V
VEN(low) EN pin low (shutdown) 0 0.5 V
IEN(high) EN pin current (enabled) VEN = 5.5V 0.02 0.1 μA
TSD Thermal shutdown temperature Shutdown Temp increasing 160 °C
Reset Temp decreasing 140
TJ Operating junction temperature –40 125 °C
(1) Minimum VIN = VOUT + VDO or 1.7 V, whichever is greater.
(2) TPS73101 is tested at VOUT = 2.5 V.
(3) Tolerance of external resistors not included in this specification.
(4) VDO is not measured for fixed output versions with VOUT(nom) < 1.8 V because minimum VIN = 1.7 V.
(5) Fixed-voltage versions only; refer to Application Information for more information.

6.6 Typical Characteristics

For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5 V, IOUT = 10 mA, VEN = 1.7 V, and COUT = 0.1 μF, unless otherwise noted.
TPS731 ld_reg_bvs034.gif
Figure 1. Load Regulation
TPS731 vdo_v_io_bvs034.gif
Figure 3. Dropout Voltage vs Output Current
TPS731 vo_shto_bvs034.gif
Figure 5. Output Voltage Accuracy Histogram
TPS731 ignd_v_io_bvs034.gif
Figure 7. Ground Pin Current vs Output Current
TPS731 ignd2_v_ta_bvs034.gif
Figure 9. Ground Pin Current in Shutdown vs Temperature
TPS731 ilimit_v_vi_bvs034.gif
Figure 11. Current Limit vs VIN
TPS731 tc_psrr_frq-bvs034.gif
Figure 13. PSRR (Ripple Rejection) vs Frequency
TPS731 noise_dnsty_bvs034.gif
Figure 15. Noise Spectral Density CNR = 0 μF
TPS731 vn_v_co_bvs034.gif
Figure 17. RMS Noise Voltage vs COUT
TPS731 load_tr_bvs034.gif
Figure 19. TPS73133 Load Transient Response
TPS731 trn-on_res_bvs034.gif
Figure 21. TPS73133 Turnon Response
TPS731 pw-up_pw-dn_bvs034.gif
Figure 23. TPS73133 Power Up and Power Down
TPS731 vn_v_cbf_bvs034.gif
Figure 25. TPS73101 RMS Noise Voltage vs CFB
TPS731 ldtrns_adj_bvs034.gif
Figure 27. TPS73101 Load Transient, Adjustable Version
TPS731 line_reg_bvs034.gif
Figure 2. Line Regulation
TPS731 vdo_v_ta_bvs034.gif
Figure 4. Dropout Voltage vs Temperature
TPS731 vo_hsto_dft_bvs034.gif
Figure 6. Output Voltage Drift Histogram
TPS731 ignd_v_ta_bvs034.gif
Figure 8. Ground Pin Current vs Temperature
TPS731 tc_ilim_vout_fdbk_bvs034.gif
Figure 10. Current Limit vs VOUT (Foldback)
TPS731 ililit_v_ta_bvs034.gif
Figure 12. Current Limit vs Temperature
TPS731 tc_psrr_vin_vout-bvs034.gif
Figure 14. PSRR (Ripple Rejection) vs VIN – VOUT
TPS731 noise2_dnsty_bvs034.gif
Figure 16. Noise Spectral Density CNR = 0.01 μF
TPS731 vn_cnr_bvs034.gif
Figure 18. RMS Noise Voltage vs CNR
TPS731 line_tr_bvs034.gif
Figure 20. TPS73133 Line Transient Response
TPS731 trn-off_res_bvs034.gif
Figure 22. TPS73133 Turnoff Response
TPS731 ienab_v_ta_bvs034.gif
Figure 24. IENABLE vs Temperature
TPS731 ifb_v_ta_bvs034.gif
Figure 26. TPS73101 IFB vs Temperature
TPS731 lntrns_adj_bvs034.gif
Figure 28. TPS73101 Line Transient, Adjustable Version