SBVS037P August 2003 – December 2015 TPS732
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
Voltage | VIN | –0.3 | 6 | V |
VEN | –0.3 | 6 | ||
VOUT | –0.3 | 5.5 | ||
VNR, VFB | –0.3 | 6 | ||
Peak output current | IOUT | Internally limited | ||
Output short-circuit duration | Indefinite | |||
Continuous total power dissipation | See Power Dissipation | |||
Temperature | Junction range ,TJ | –55 | 150 | °C |
Storage range, Tstg | –65 | 150 |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) | ±2000 | V |
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) | ±500 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
VIN | Input supply voltage range | 1.7 | 5.5 | V | |
IOUT | Output current | 0 | 250 | mA | |
TJ | Operating junction temperature | –40 | 125 | °C |
THERMAL METRIC(1)(2) | TPS732(3) | UNIT | |||
---|---|---|---|---|---|
DRB [SON] | DCQ [SOT223] | DBV [SOT23] | |||
8 PINS | 6 PINS | 5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 58.3 | 53.1 | 205.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 93.8 | 35.2 | 119 | |
RθJB | Junction-to-board thermal resistance | 72.8 | 7.8 | 35.4 | |
ψJT | Junction-to-top characterization parameter | 2.7 | 2.9 | 12.7 | |
ψJB | Junction-to-board characterization parameter | 25 | 7.7 | 34.5 | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 5 | N/A | N/A |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
---|---|---|---|---|---|---|---|---|
VIN | Input voltage range(1) | 1.7 | 5.5 | V | ||||
VFB | Internal reference (TPS73201) | TJ = 25°C | 1.198 | 1.2 | 1.21 | V | ||
VOUT | Output voltage range (TPS73201)(2) | VFB | 5.5 – VDO | V | ||||
Accuracy(1)(3) | Nominal | TJ = 25°C | –0.5% | 0.5% | ||||
VIN, IOUT, and T | VOUT + 0.5 V ≤ VIN ≤ 5.5 V; 10 mA ≤ IOUT ≤ 250 mA |
–1% | ±0.5% | 1% | ||||
ΔVOUT(ΔVIN) | Line regulation(1) | VOUT(nom) + 0.5 V ≤ VIN ≤ 5.5 V | 0.01 | %/V | ||||
ΔVOUT(ΔIOUT) | Load regulation | 1 mA ≤ IOUT ≤ 250 mA | 0.002 | %/mA | ||||
10 mA ≤ IOUT ≤ 250 mA | 0.0005 | %/mA | ||||||
VDO | Dropout voltage(4)
(VIN = VOUT (nom) – 0.1 V) |
IOUT = 250 mA | 40 | 150 | mV | |||
ZO(do) | Output impedance in dropout | 1.7 V ≤ VIN ≤ VOUT + VDO | 0.25 | Ω | ||||
ICL | Output current limit | VOUT = 0.9 × VOUT(nom) | 250 | 425 | 600 | mA | ||
ISC | Short-circuit current | VOUT = 0 V | 300 | mA | ||||
IREV | Reverse leakage current(5) (–IIN) | VEN ≤ 0.5 V, 0 V ≤ VIN ≤ VOUT | 0.1 | 10 | μA | |||
IGND | GND pin current | IOUT = 10 mA (IQ) | 400 | 550 | μA | |||
IOUT = 250 mA | 650 | 950 | ||||||
ISHDN | Shutdown current (IGND) | VEN ≤ 0.5 V, VOUT ≤ VIN ≤ 5.5, –40°C ≤ TJ ≤ 100°C |
0.02 | 1 | µA | |||
IFB | FB pin current (TPS73201) | 0.1 | 0.3 | μA | ||||
PSRR | Power-supply rejection ratio (ripple rejection) |
f = 100 Hz, IOUT = 250 mA | 58 | dB | ||||
f = 10 kHz, IOUT = 250 mA | 37 | |||||||
Vn | Output noise voltage BW = 10Hz – 100kHz |
COUT = 10 μF, No CNR | 27 × VOUT | μVRMS | ||||
COUT = 10 μF, CNR = 0.01 μF | 8.5 × VOUT | |||||||
VEN(high) | EN pin high (enabled) | 1.7 | VIN | V | ||||
VEN(low) | EN pin low (shutdown) | 0 | 0.5 | V | ||||
IEN(high) | EN pin current (enabled) | VEN = 5.5 V | 0.02 | 0.1 | μA | |||
TSD | Thermal shutdown temperature | Shutdown | Temp increasing | 160 | °C | |||
Reset | Temp decreasing | 140 | ||||||
TJ | Operating junction temperature | –40 | 125 | °C |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
tSTR | Start-up time | VOUT = 3 V, RL = 30 Ω COUT = 1 μF, CNR = 0.01 μF |
600 | μs |