SLVSER5A December   2018  – May 2021 TPS73801-SEP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Operation
      2. 7.3.2 Fixed Operation
      3. 7.3.3 Overload Recovery
      4. 7.3.4 Output Voltage Noise
      5. 7.3.5 Protection Features
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Capacitance and Transient Response
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Calculating Junction Temperature
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS73801-SEPUNIT
DCQ (SOT-223)
6 PINS
RθJAJunction-to-ambient thermal resistance50.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance31.1°C/W
RθJBJunction-to-board thermal resistance5.1°C/W
ψJTJunction-to-top characterization parameter1°C/W
ψJBJunction-to-board characterization parameter5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.