SBVS355C June   2019  – May 2022 TPS745-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 TPS745-Q1 Comparison
      2. 7.3.2 Undervoltage Lockout (UVLO)
      3. 7.3.3 Shutdown
      4. 7.3.4 Foldback Current Limit
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Input and Output Capacitor Selection
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Exiting Dropout
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Power-Good Function
      8. 8.1.8 Feed-Forward Capacitor (CFF)
      9. 8.1.9 Start-Up Sequencing
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at operating temperature range (TJ = –40°C to +150°C), VIN = VOUT(NOM) + 0.5 V or 1.5 V (whichever is greater), IOUT = 1 mA, VEN = VIN, and CIN = COUT = 1 μF, unless otherwise noted; all typical values are at TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback voltage Adjustable only 0.55 V
Output accuracy(1) TJ = 25°C –0.85% 0.85%
-40°C ≤ TJ ≤ 85°C –1.00% 1.00%
-40°C ≤ TJ ≤ 150°C –1.50% 1.50%
Line regulation VOUT(NOM) + 0.5 V(2) ≤ VIN ≤ 6.0 V 2 7.5 mV
Load regulation 0.1 mA ≤ IOUT ≤ 500 mA, VIN ≥ 2.0 V 0.030 V/A
IGND Ground current IOUT = 0 mA TJ = 25°C  25 32 µA
-40°C ≤ TJ ≤ 150°C 25 36
ISHDN Shutdown current VEN ≤ 0.3 V,
1.5 V ≤ VIN ≤ 6.0 V		 -40°C ≤ TJ ≤ 125°C 0.1 1 µA
-40°C ≤ TJ ≤ 150°C 0.1 1.55
IFB Feedback pin current Adjustable only 0.01 0.1 µA
ICL Output current limit VOUT(NOM) < 1.0 V,
VOUT = VOUT(NOM) - 0.2 V, VIN = 2.0 V		 515 720 865 mA
VOUT(NOM) ≥ 1.0 V,
VOUT = VOUT(NOM) x 0.85, VIN = VOUT(NOM) + 1.0 V
ISC Short-circuit current limit VOUT = 0 V VOUT(NOM) < 1.0 V, 
VIN = 2.0 V		 200 350 400 mA
VOUT(NOM) ≥ 1.0 V, 
VIN = VOUT(NOM) + 1.0 V
VDO Dropout voltage IOUT = 500 mA,
VOUT = 0.95 × VOUT(NOM)		 0.65 V ≤ VOUT < 0.8 V(3) 720 910 mV
0.8 V ≤ VOUT < 1.0 V 585 780
1.0 V ≤ VOUT < 1.2 V 420 600
1.2 V ≤ VOUT < 1.5 V 285 430
1.5 V ≤ VOUT < 1.8 V 180 265
1.8 V ≤ VOUT < 2.5 V 140 215
2.5 V ≤ VOUT < 3.3 V 105 170
3.3 V ≤ VOUT ≤ 5.5 V 95 160
PSRR Power-supply rejection ratio VOUT = 1.8 V,
VIN = 2.8 V,
IOUT = 500 mA,
COUT = 2.2 µF		 f = 1 kHz 57 dB
f = 100 kHz 42
f = 1 MHz 35
VN Output noise voltage BW = 10 Hz to 100 kHz, VOUT = 0.9 V, VIN = 1.9 V 53 µVRMS
VUVLO Undervoltage lockout VIN falling 1.17 1.30 1.42 V
VIN rising 1.21 1.34 1.47
VUVLO,HYST Undervoltage lockout hysteresis VIN hysteresis 40 mV
tSTR Startup time From EN low-to-high transition to VOUT = VOUT(NOM) x 0.95 200 500 650 µs
VEN(HI) EN pin high voltage (enabled) 1.0 V
VEN(LO) EN pin low voltage (disabled) 0.3 V
IEN Enable pin current VIN = VEN = 6.0 V 10 nA
RPULLDOWN Pulldown resistance VIN = 6.0 V 95 Ω
PGHTH PG high threshold VOUT increasing 89 92 96 %VOUT
PGLTH PG low threshold VOUT decreasing 86 90 93 %VOUT
PGHYST PG hysteresis 2 %Vout
VOL(PG) PG pin low-level output voltage VIN ≥ 1.5V, ISINK = 1.0 mA 300 mV
VIN ≥ 2.75V, ISINK = 2.0 mA
VOH(PG) PG pin high-level output voltage(4) VOUT ≥ 1.0V, ISOURCE = 0.04 mA 0.8 x VOUT V
VOUT ≥ 1.4V, ISOURCE = 0.2 mA
VOUT ≥ 2.5V, ISOURCE = 0.5 mA
VOUT ≥ 4.5V, ISOURCE = 1.0 mA
Ilkg(PG) PG pin leakage current(5) VOUT > PGHTH, VPG = 6.0 V 7 50 nA
TSD Thermal shutdown Shutdown, temperature increasing 170 °C
Reset, temperature decreasing 155
(1) When the device is connected to external feedback resistors at the FB pin, external resistor tolerances are not included. 
(2) VIN = 1.5 V for VOUT < 1.0 V.
(3) Dropout is not tested for nominal output voltages below 0.65 V since the input voltage may be below UVLO. 
(4) Push-pull version only. The push-pull option is supported only for VOUT ≥ 1.0 V.
(5) Open-drain version only.