SBVS326A April   2018  – December 2018 TPS745

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Input and Output Capacitor Selection
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Exiting Dropout
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Power-Good Function
      8. 8.1.8 Feed-Forward Capacitor (CFF)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at operating temperature range (TJ = –40°C to +125°C),VIN = VOUT(NOM) + 0.5 V or 1.5 V (whichever isgreater), IOUT = 1 mA, VEN =VIN, and CIN = COUT = 1 uF(unless otherwise noted); all typical values are at TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback voltage TJ = 25°C 0.55 V
Output accuracy(1) TJ = 25°C –0.7% 0.7%
–40°C ≤ TJ ≤ +85°C –1% 1%
–40°C ≤ TJ ≤ +125°C –1.5% 1.5%
Line regulation VOUT(NOM) + 0.5 V(2) ≤ VIN ≤ 6.0 V 2 7.5 mV
Load regulation 0.1 mA ≤ IOUT ≤ 500 mA, VIN ≥ 2.0 V 0.030 V/A
IGND Ground current IOUT = 0 mA TJ = 25°C 10 25 31 µA
IGND Ground current –40°C ≤ TJ ≤ +125°C 35 µA
ISHDN Shutdown current VEN ≤ 0.3 V, 1.5 V ≤ VIN ≤ 6.0 V 0.1 1 µA
IFB Feedback pin current 0.01 0.1 µA
ICL Output current limit VIN = VOUT(NOM) + 1.0 V VOUT = VOUT(NOM) – 0.2 V,
VOUT < 1.5 V		 530 720 865 mA
VOUT = 0.9 V × VOUT(NOM),
VOUT ≥ 1.5 V		 530 720 865
ISC Short-circuit current limit VIN = VOUT(NOM) + 1.0 V VOUT = 0 V 350 mA
VDO Dropout voltage IOUT = 500 mA,
–40°C ≤ TJ ≤ +125°C,
VOUT = 0.95 × VOUT(NOM) 		0.65 V ≤ VOUT < 0.8 V 720 880 mV
0.8 V ≤ VOUT < 1.0 V 585 750
1.0 V ≤ VOUT < 1.2 V 420 570
1.2 V ≤ VOUT < 1.5 V 285 400
1.5 V ≤ VOUT < 1.8 V 180 235
1.8 V ≤ VOUT < 2.5 V 140 185
2.5 V ≤ VOUT < 3.3 V 102 140
3.3 V ≤ VOUT ≤ 5.5 V 95 130
PSRR Power-supply rejection ratio VIN = VOUT(NOM) + 1.0 V,
IOUT = 50 mA		 f = 1 kHz 50 dB
f = 100 kHz 45
f = 1 MHz 30
Vn Output noise voltage BW = 10 Hz to 100 kHz, VOUT = 0.9 V 53 µVRMS
VUVLO Undervoltage lockout VIN rising 1.21 1.33 1.47 V
VIN falling 1.17 1.29 1.42 V
VUVLO, HYST Undervoltage lockout hysteresis VIN Hysteresis 40 mV
tSTR Startup time From EN low-to-high transition to VOUT = VOUT(NOM) × 95% 500 µs
VEN(HI) EN pin high voltage 1.0 V
VEN(LO) EN pin low voltage  0.3 V
IEN Enable pin current VIN = EN = 6.0 V 10 nA
RPULL DOWN Pulldown resistance VIN = 6.0 V 95 Ω
PGHTH PG high threshold VOUT increasing 89 94 95 %VOUT
PGLTH PG low threshold VOUT decreasing 87 92 93 %VOUT
VOL(PG) PG pin low-level output voltage VIN ≥ 1.5 V, ISINK = 1 mA
300 mV
VOL(PG) PG pin low-level output voltage VIN ≥ 2.75 V, ISINK = 2 mA 300
Ilkg(PG) PG pin leakage current VOUT > PGHTH, VPG = 6.0 V 300 nA
TSD Thermal shutdown Shutdown, temperature increasing 170 °C
Reset, temperature decreasing 155
(1) When the device is connected to external feedback resistors at the FB pin, external resistor tolerances are not included
(2) VIN = 1.5V for VOUT < 1.0 V