SBVS082K June   2007  – June 2024 TPS74901

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics: IOUT = 50mA
    7. 5.7 Typical Characteristics: IOUT = 1 A
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Enable and Shutdown
      2. 6.3.2 Power-Good
      3. 6.3.3 Internal Current Limit
      4. 6.3.4 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input, Output, and BIAS Capacitor Requirements
      2. 7.1.2 Transient Response
      3. 7.1.3 Dropout Voltage
      4. 7.1.4 Output Noise
      5. 7.1.5 Programmable Soft-Start
      6. 7.1.6 Sequencing Requirements
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Power Dissipation
        2. 7.4.1.2 Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Development Support
        1. 8.1.2.1 Evaluation Modules
        2. 8.1.2.2 Spice Models
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision J (April 2023) to Revision K (June 2024)

  • Changed M3 references to new chip Added: Accuracy over line, load, and temperature: 1% (new chip)in Description sectionGo
  • Added (Legacy Chip) to KTW packageGo
  • Changed Typical Characteristics: IOUT = 50mA section and added new chip curvesGo
  • Changed Typical Characteristics: IOUT = 1 A section, added new chip curves side by side to legacy curvesGo
  • Changed Legacy Chip Functional Block Diagram to include pulldown resistor for legacy chip and added New Chip Functional Block Diagram Go
  • Added active pulldown circuit discussion and equation to Enable and Shutdown sectionGo
  • Added SOFT-START TIME (New Chip) column and changed footnote in Standard Capacitor Values for Programming the Soft-Start Time tableGo
  • Added feed-forward capacitor discussion to Programmable Soft-Start sectionGo
  • Changed Application Curves section to only show new chip curvesGo
  • Changed last sentence of Layout Recommendations and Power Dissipation section; added Figure 7-7 Go
  • Deleted (previously numbered) Figure 35 through Figure 39Go
  • Added Device Nomenclature sectionGo

Changes from Revision I (May 2016) to Revision J (April 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Added M3-suffix devices to documentGo
  • Added links to Applications sectionGo