SLVS237E August 1999 – March 2024 TPS766
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TPS766 (2) | UNIT | |
---|---|---|---|
D (SOIC) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 126.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 68.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 75.7 | °C/W |
ΨJT | Junction-to-top characterization parameter | 18.0 | °C/W |
ΨJB | Junction-to-board characterization parameter | 74.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |