SGLS118E December   2001  – July 2024 TPS769-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Dissipation Ratings (Legacy Chip)
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
    8. 5.8 Typical Characteristics: Supported ESR Range
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Adjustable Device Feedback Resistors
        2. 7.2.2.2 Recommended Capacitor Types
        3. 7.2.2.3 Input and Output Capacitor Requirements
        4. 7.2.2.4 Reverse Current
        5. 7.2.2.5 Feed-Forward Capacitor (CFF)
        6. 7.2.2.6 Power Dissipation (PD)
        7. 7.2.2.7 Estimating Junction Temperature
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Module
        2. 8.1.1.2 Spice Models
        3. 8.1.1.3 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: −40°C to 125°C, TA
  • Input voltage range:
    • Legacy chip: 2.7V to 10V (13.5V absolute max)
    • New chip: 2.5V to 16V (18V absolute max)
  • Output voltage range (adjustable):
    • Legacy chip: 1.25V to 5.5V
    • New chip: 1.2V to 5.5V
  • Output voltage range (fixed):
    • Legacy chip: 1.5V to 5V
    • New chip: 1.2V to 5V
  • High PSRR (new chip): 46dB at 1MHz
  • Output accuracy:
    • Legacy chip: 3% over load and temperature
    • New chip: 1.2% over load and temperature
  • Dropout voltage:
    • Legacy chip: 71mV (typ) at 100mA
    • New chip: 150mV (typ) at 100mA
  • Integrated fault protection:
    • Thermal shutdown
    • Overcurrent protection
  • Internal soft-start time (new chip): 750µs (typical)
  • Output capacitor for stable operation:
    • Legacy chip: ≥ 4.7μF
    • New chip: ≥ 2.2μF
  • Package: 5-pin SOT-23, RθJA = 178.6°C/W (new chip)