SBVS083E January   2007  – January 2015 TPS780

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Active VOUT Pulldown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
    5. 7.5 Programming
      1. 7.5.1 Programming the TPS78001 Adjustable LDO Regulator
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Dropout Voltage
        3. 8.2.2.3 Transient Response
        4. 8.2.2.4 Minimum Load
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
    1. 9.1 Powering the MSP430 Microcontroller
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Package Mounting
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

SON
6 Pins
Top View
po_1_bvs083.gif
1. It is recommended that the SON package thermal pad be connected to ground.
SOT
5 Pins
Top View
po_2_bvs083.gif

Pin Functions

PIN I/O DESCRIPTION
NAME SON SOT
OUT 1 5 O Regulated output voltage pin. A small (1-μF) ceramic capacitor is needed from this pin to ground to assure stability. See Input and Output Capacitor Requirements for more details.
N/C 2 — — Not connected.
VSET/FB 3 4 I Feedback pin (FB) for adjustable versions; VSET for fixed voltage versions. Drive the select pin (VSET) below 0.4 V to select preset output voltage high. Drive the VSET pin over 1.2 V to select preset output voltage low.
EN 4 3 I Enable pin. Drive this pin over 1.2 V to turn on the regulator. Drive this pin below 0.4 V to put the regulator into shutdown mode, reducing operating current to 18 nA typical.
GND 5 2 — Ground pin. Tie all ground pins to ground for proper operation.
IN 6 1 I Input pin. A small capacitor is needed from this pin to ground to assure stability. A typical input capacitor is 1.0 μF. Tie back both input and output capacitor ground to the IC ground, with no significant impedance between them.
Thermal pad — — — (SON package only) Connect the thermal pad to ground.