SBVS133A February   2010  – November 2014 TPS783

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Input and Output Capacitor Requirements
        2. 8.2.1.2 Dropout Voltage
        3. 8.2.1.3 Transient Response
        4. 8.2.1.4 Minimum Load
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Extending Battery Life in Keep-Alive Circuitry Applications for MSP430 and Other Low-Power Microcontrollers
      2. 8.3.2 Supercapacitor-Based Backup Power
    4. 8.4 Do's and Don’ts
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Package Mounting
      3. 10.1.3 Thermal Information
        1. 10.1.3.1 Thermal Protection
        2. 10.1.3.2 Power Dissipation
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (February 2010) to A Revision

  • Changed document format to latest data sheet standards; added Handling Ratings, Thermal Information, Recommended Operating Conditions, Power Supply Recommendations, and Device and Documentation Support sections; moved existing sectionsGo
  • Deleted factory programming feature bullet Go
  • Added input voltage range feature bullet Go
  • Deleted programmable mode application bulletGo
  • Added simplified schematic to front pageGo
  • Changed Pin Functions table Go
  • Changed operating junction temperature maximum value in Absolute Maximum Ratings tableGo
  • Deleted Dissipation Ratings table; see Thermal Information tableGo
  • Changed symbol and parameter names for clarity in Electrical Characteristics tableGo
  • Added footnote (2) to Electrical Characteristics tableGo
  • Changed Figure 7 y-axis title and measurement rangeGo
  • Changed Figure 9 VEN labels to match Electrical Characteristics tableGo
  • Changed Figure 10 y-axis title to match Electrical Characteristics tableGo
  • Deleted Figure 14 IOUT conditionGo
  • Deleted Figure 15 IOUT conditionGo
  • Changed Functional Block DiagramGo
  • Changed Figure 18Go
  • Added reference for Table 1 in Device Functional ModesGo
  • Changed Figure 19Go
  • Changed Table 2 formatGo