SLVS350J October 2002 – May 2019 TPS795
PRODUCTION DATA.
The tab of the 6-pin SOT-223 package is electrically connected to ground. For best thermal performance, solder the tab of the surface-mount version directly to a circuit-board copper area. Increasing the copper area improves heat dissipation.
Solder pad footprint recommendations for the devices are presented in application report SBFA015, Solder Pad Recommendations for Surface-Mount Devices, available from the TI website (www.ti.com).