SLVS332J March   2001  – December 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Regulator Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Powering Microcontrollers
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 External Capacitor Requirements
        3. 8.2.1.3 Application Curves
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation and Junction Temperature
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from I Revision (October 2013) to J Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Dissipation Ratings table; see Thermal Information tableGo
  • Added Thermal Information tableGo
  • Changed Load Regulation parameter unit From: mV To: %/AGo
  • Changed Output Spectral Noise Density vs Frequency graph Y-axis unit From: nV/√Hz To: µV/√HzGo
  • Changed IOUTx values From: ICL To: ISCGo

Changes from H Revision (April 2012) to I Revision

  • Changed Dropout Voltage vs Junction Temperature graph Y-axis unit From: V To: mV (typo)Go

Changes from G Revision (November 2009) to H Revision

  • Deleted sentence regarding thermal protectionGo

Changes from F Revision (May 2009) to G Revision

  • Changed document titleGo
  • Deleted references to SOT323 package throughout documentGo
  • Changed Test Conditions for Electrical Characteristics tableGo
  • Changed output voltage accuracy test conditions from 10 µA < IOUT < 10 mA to 1 mA < IOUT < 10 mAGo
  • Deleted line regulation maximum specificationGo
  • Changed PG trip threshold voltage test conditions from VOUT decreasing to VOUT increasing; deleted minimum and maximum specificationsGo
  • Revised PG low output low voltage test conditionsGo
  • Updated PG leakage current test conditionsGo