SLVS822F March   2009  – April 2024 TPS798-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dissipation Ratings
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Adjustable Operation
      2. 6.3.2 Output Capacitance and Transient Response
      3. 6.3.3 Calculating Junction Temperature
      4. 6.3.4 Protection Features
    4. 6.4 Device Functional Modes
      1. 6.4.1 Low-Voltage Tracking
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Thermal Considerations
      2. 7.3.2 Thermal Layout Considerations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-61CBA831-C71F-4532-AF6D-D488C6A8E038-low.gif
The exposed thermal pad is connected to ground through pin 4 (GND).
Figure 4-1 DGN Package,8-Pin HVSSOP With PowerPAD™ (Top View)
Table 4-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
EN 5 I Enable pin. Driving the EN pin high turns on the regulator over full operating range. Driving this pin low puts the regulator into shutdown mode over full operating range.
GND 4 O Ground. The exposed thermal pad is connected to ground through this pin.
IN 8 I Input pin. Place a 0.1μF ceramic or greater capacitor from this pin to ground to provide stability. Both input and output capacitor grounds must be tied back to the device ground with no significant impedance between them.
NC 3, 6, 7 — No internal connection
OUT 1 O Regulated output voltage pin. A small (1μF) capacitor is needed from this pin to ground to provide stability.
SENSE/FB 2 I This pin is the input to the control loop error amplifier. Use this pin to set the output voltage of the device.