SLVS822F
March 2009 – April 2024
TPS798-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Dissipation Ratings
5.7
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagrams
6.3
Feature Description
6.3.1
Adjustable Operation
6.3.2
Output Capacitance and Transient Response
6.3.3
Calculating Junction Temperature
6.3.4
Protection Features
6.4
Device Functional Modes
6.4.1
Low-Voltage Tracking
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.3.1
Thermal Considerations
7.3.2
Thermal Layout Considerations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Receiving Notification of Documentation Updates
8.2
Support Resources
8.3
Trademarks
8.4
Electrostatic Discharge Caution
8.5
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DGN|8
MPDS046G
Thermal pad, mechanical data (Package|Pins)
DGN|8
PPTD076F
Orderable Information
slvs822f_oa
slvs822f_pm
5.7
Typical Characteristics
Figure 5-1
Line Regulation vs Input Voltage
Figure 5-3
Dropout Voltage vs Output Current
Figure 5-5
Quiescent Current vs Temperature
Figure 5-7
Quiescent Current vs Input Voltage
Figure 5-9
Quiescent Current vs Output Current
Figure 5-11
Reverse Battery Leakage vs Input Voltage
Figure 5-13
Safe Operating Area
Figure 5-2
Line Regulation vs Input Voltage
Figure 5-4
Dropout Voltage vs Output Current
Figure 5-6
Quiescent Current vs Temperature
Figure 5-8
Quiescent Current vs Input Voltage
Figure 5-10
Quiescent Current vs Output Current
Figure 5-12
Power Supply Ripple Rejection vs Frequency