SBVS097G march   2008  – june 2023 TPS799-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Start-Up
      5. 7.3.5 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Feedback Capacitor Requirements (TPS79901-Q1 Only)
        3. 8.2.2.3 Output Noise
        4. 8.2.2.4 Transient Response
        5. 8.2.2.5 Minimum Load
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
        2. 8.4.1.2 Thermal Consideration
        3. 8.4.1.3 Power Dissipation
        4. 8.4.1.4 Package Mounting
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)(2)TPS799-Q1UNIT
DRV (SON)DDC (SOT-23)
6 PINS5 PINS
RθJAJunction-to-ambient thermal resistance74.2178.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance58.870.7°C/W
RθJBJunction-to-board thermal resistance145.973.4°C/W
ψJTJunction-to-top characterization parameter0.22.5°C/W
ψJBJunction-to-board characterization parameter54.474.1°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance 7.2n/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.