SBVS314B March   2018  – October 2018 TPS7A10

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Dropout vs IOUT and Temperature, YKA Package
      2.      Typical Application Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
      2. 7.3.2 Global Undervoltage Lockout (UVLO)
      3. 7.3.3 Active Discharge
      4. 7.3.4 Enable
      5. 7.3.5 Sequencing Requirement
      6. 7.3.6 Internal Foldback Current Limit
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Dropout Mode
      3. 7.4.3 Disable Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Dropout Voltage
      5. 8.1.5 Behavior During Transition From Dropout Into Regulation
      6. 8.1.6 Undervoltage Lockout Circuit Operation
      7. 8.1.7 Power Dissipation (PD)
        1. 8.1.7.1 Estimating Junction Temperature
        2. 8.1.7.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
        2. 11.1.1.2 Spice Model
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DSE|6
  • YKA|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DSE Package
6-Pin WSON
Top View
YKA Package
5-Pin DSBGA
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME DSE YKA
IN 6 A1 I Input pin. For best transient response and to minimize input impedance, use the recommended or larger value ceramic capacitor from IN to ground. as listed in the Recommended Operation Conditions. Place the input capacitor as close as possible to input of the device.
OUT 1 A3 O Regulated output pin. A capacitor is required from OUT to ground for stability. For best transient response, use larger than the minimum recommended value ceramic capacitor. Follow the recommended capacitor value as listed in the Recommended Operation Conditions. Place the output capacitor as close as possible to output of the device.
GND 5 B2 — Ground pin. This pin must be connected to ground.
BIAS 4 C1 I BIAS pin. This pin enables the use of low-input voltage, low-output voltage conditions, (LILO). For best response, use the recommended or larger value ceramic capacitor from BIAS to ground as listed in the Recommended Operation Conditions. Place the bias capacitor as close as possible to input of the device.
EN 3 C3 I Enable pin. Driving this pin to logic high enables the device. Driving this pin to logic low disables the device. If enable functionality is not required, this pin must be connected to IN or BIAS; however, connecting EN to IN is only acceptable if the VIN voltage is greater than 0.9 V.