SBVS316B September   2018  – December 2020 TPS7A11

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
        1. 7.3.1.1 Global Undervoltage Lockout (UVLO)
      2. 7.3.2 Active Discharge
      3. 7.3.3 Enable Pin
      4. 7.3.4 Sequencing Requirement
      5. 7.3.5 Internal Foldback Current Limit
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Dropout Mode
      3. 7.4.3 Disable Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Dropout Voltage
      5. 8.1.5 Behavior During Transition From Dropout Into Regulation
      6. 8.1.6 Undervoltage Lockout Circuit Operation
      7. 8.1.7 Power Dissipation (PD)
      8. 8.1.8 Estimating Junction Temperature
      9. 8.1.9 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedures
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
      2. 11.1.2 Spice Model
      3. 11.1.3 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-05954297-875F-45FE-B3B5-795571C2C2B1-low.svg
TI recommends connecting the SON (DRV) package thermal pad to ground.
NC – No internal connection.
Figure 5-1 DRV Package,6-Pin SON With Exposed Thermal Pad,Top View
Table 5-1 Pin Functions: DRV
PINI/ODESCRIPTION
NAMENO.
IN6InputInput pin. A capacitor is required from IN to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from IN to ground. Follow the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the input capacitor as close to the input pin of the device as possible.
OUT1OutputRegulated output pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground. Follow the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the output capacitor as close to the output pin of the device as possible.
GND5—Ground pin. This pin must be connected to ground.
BIAS4InputBIAS pin. This pin enables the use of low-input voltage, low-output voltage (LILO) conditions. For best performance, use the nominal recommended value or larger ceramic capacitor from BIAS to ground. Follow the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the bias capacitor as close to the bias pin of the device as possible.
EN3InputEnable pin. Driving this pin to logic high enables the device. Driving this pin to logic low disables the device. If enable functionality is not required, this pin must be connected to IN or BIAS; however, connecting EN to IN is only acceptable if the IN pin voltage is greater than 0.9 V.
NC2—This pin is not internally connected. Connect to ground for better thermal dissipation or leave floating.
Thermal pad—Connect the thermal pad to a large-area ground plane.
GUID-37C3E116-22E2-4E4C-847D-6B2F73314250-low.svgFigure 5-2 YKA Package,5-Pin DSBGA, Top View
Table 5-2 Pin Functions: YKA
PINI/ODESCRIPTION
NO.NAME
A1INInputInput pin. A capacitor is required from IN to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from IN to ground. Follow the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the input capacitor as close to the input pin of the device as possible.
A3OUTOutputRegulated output pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground. Follow the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the output capacitor as close to the output pin of the device as possible.
B2GND—Ground pin. This pin must be connected to ground.
C1BIASInputBIAS pin. This pin enables the use of low-input voltage, low-output voltage (LILO) conditions. For best performance, use the nominal recommended value or larger ceramic capacitor from BIAS to ground. Follow the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the bias capacitor as close to the bias pin of the device as possible.
C3ENInputEnable pin. Driving this pin to logic high enables the device. Driving this pin to logic low disables the device. If enable functionality is not required, this pin must be connected to IN or BIAS; however, connecting EN to IN is only acceptable if the IN pin voltage is greater than 0.9 V.