SBVS188E march   2012  – may 2023 TPS7A16-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Regulated Output (VOUT)
      3. 7.3.3 PG Delay Timer (DELAY)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Good
      2. 7.4.2 Power-Good Delay and Delay Capacitor
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS7A1601-Q1 Circuit as an Adjustable Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Adjustable Voltage Operation
          2. 8.2.1.2.2 Resistor Selection
          3. 8.2.1.2.3 Capacitor Recommendations
          4. 8.2.1.2.4 Input and Output Capacitor Requirements
          5. 8.2.1.2.5 Feed-Forward Capacitor (Only for Adjustable Version)
          6. 8.2.1.2.6 Transient Response
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Automotive Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Device Recommendations
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Multicell Battery Packs
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
      4. 8.2.4 Battery-Operated Power Tools
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Additional Layout Considerations
        2. 8.4.1.2 Power Dissipation
        3. 8.4.1.3 Thermal Considerations
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS7A16-Q1 UNIT
DGN (HVSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 66.2 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 45.9 °C/W
RθJB Junction-to-board thermal resistance 34.6 °C/W
ψJT Junction-to-top characterization parameter 1.9 °C/W
ψJB Junction-to-board characterization parameter 34.3 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance 14.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.