SBVS342A February   2019  – March 2019 TPS7A16A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Regulated Output (VOUT)
      3. 7.3.3 PG Delay Timer (DELAY)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Good
        1. 7.4.1.1 Power-Good Delay and Delay Capacitor
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS7A16A-Q1 Circuit as an Adjustable Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Adjustable Voltage Operation
            1. 8.2.1.2.1.1 Resistor Selection
          2. 8.2.1.2.2 Capacitor Recommendations
          3. 8.2.1.2.3 Input and Output Capacitor Requirements
          4. 8.2.1.2.4 Feed-Forward Capacitor (Only for Adjustable Version)
          5. 8.2.1.2.5 Transient Response
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Automotive Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Device Recommendations
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Additional Layout Considerations
      2. 10.1.2 Power Dissipation
      3. 10.1.3 Thermal Considerations
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.2 Power Dissipation

The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Using heavier copper increases the effectiveness of removing heat from the device. The addition of plated through-holes to heat dissipating layers also improves the heatsink effectiveness.

Power dissipation depends on input voltage and load conditions. As Equation 2 shows, power dissipation (PD) is equal to the product of the output current times the voltage drop across the output pass element:

Equation 2. TPS7A16A-Q1 q_pd_bvs125.gif